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STGP30H65F

STMicroelectronics

STGP30H65F by STMicroelectronics

STMicroelectronics' STGP30H65F is an N-CHANNEL IGBT with 650V VCE, 60A IC, and 2.4V VCEsat. Ideal for POWER CONTROL applications, it has a toff of 234ns and ton of 64ns. The transistor operates b/w -55 °C to 175°C in a PLASTIC/EPOXY package with FLANGE MOUNT style.

Median Price

$3.460

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 14 parts In-Stock

1+ parts

$3.460

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-

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14

$3.460

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Distributors (In-Stock)

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Digiode

USA . 1,031 parts In-Stock

1+ parts

$2.822

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1,031

$2.822

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Vyrian

USA . 3,847 parts In-Stock

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3,847

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Anansix

USA . 1,505 parts In-Stock

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1,505

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,131 parts In-Stock

1+ parts

$1.137

100+ parts

-

1k+ parts

$1.023

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-

2,131

$1.137

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$1.023

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MKK Technologies

India . 2,022 parts In-Stock

1+ parts

$2.138

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2,022

$2.138

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DigiPath Technology Company

USA . 2,022 parts In-Stock

1+ parts

$2.138

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2,022

$2.138

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Corphita

USA . 2,586 parts In-Stock

1+ parts

$2.673

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2,586

$2.673

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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56,986

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QUARKTWIN TECHNOLOGY LTD

USA . 28,421 parts In-Stock

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28,421

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Microchip USA

USA . 5,267 parts In-Stock

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5,267

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Perfect Parts

USA . 1,109 parts In-Stock

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1,109

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Parana Technologies

USA . 496 parts In-Stock

1+ parts

-

100+ parts

$1.360

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496

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$1.360

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Overview

Unlock the power of innovation with the STGP30H65F Insulated Gate Bipolar Transistor by STMicroelectronics. Designed for optimum performance in power control applications, this N-CHANNEL transistor delivers exceptional reliability and efficiency. With a maximum collector-emitter voltage of 650V and a maximum collector current of 60A, this transistor is perfect for a wide range of high-power applications. Trust in STMicroelectronics' renowned quality and expertise to bring your projects to life with superior performance and reliability. Elevate your designs with the STGP30H65F and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material of the package provides durability and protection for the internal components of the IGBT.

Polarity or Channel Type: N-CHANNEL

N-Channel IGBTs typically have lower ON-resistance and therefore lower voltage drop, leading to higher efficiency in power control applications.

Maximum VCEsat: 2.4 V

The low VCEsat of 2.4 V helps in reducing power dissipation and improving overall efficiency of the IGBT.

Maximum Power Dissipation (Abs): 260 W

With a high maximum power dissipation of 260 W, this IGBT can handle high power applications reliably.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature of 175 °C ensures the IGBT can operate in harsh environments without overheating.

Maximum Collector-Emitter Voltage: 650 V

The high maximum collector-emitter voltage of 650 V allows the IGBT to be used in high voltage applications.

Maximum Gate-Emitter Threshold Voltage: 7 V

The low gate-emitter threshold voltage of 7 V allows for easier turn-on of the IGBT, improving efficiency and speed of operation.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGP30H65F attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Configuration:

Maximum Gate-Emitter Threshold Voltage:

7 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

234 ns

Nominal Turn On Time (ton):

64 ns

Maximum VCEsat:

2.4 V

Trade Compliance

STGP30H65F Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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