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STGF30NC60S

STMicroelectronics

STGF30NC60S by STMicroelectronics

STGF30NC60S from STMicroelectronics is a powerful N-channel IGBT designed for efficient power control applications. It features a max collector-emitter voltage of 600V, a turn-off time of 555ns, and can handle up to 22A. Ideal for high-temperature environments with a max operating temp of 150 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,102 parts In-Stock

1+ parts

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2,102

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Digiode

USA . 1,560 parts In-Stock

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1,560

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Anansix

USA . 647 parts In-Stock

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647

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,890 parts In-Stock

1+ parts

$1.215

100+ parts

-

1k+ parts

$1.094

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1,890

$1.215

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$1.094

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MKK Technologies

India . 2,344 parts In-Stock

1+ parts

$2.285

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2,344

$2.285

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DigiPath Technology Company

USA . 2,344 parts In-Stock

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$2.285

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2,344

$2.285

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AZTECH Wire

Italy . 980 parts In-Stock

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$10.110

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980

$10.110

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Corphita

USA . 1,909 parts In-Stock

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1,909

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Parana Technologies

USA . 1,812 parts In-Stock

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$1.453

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1,812

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$1.453

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Overview

Unlock unparalleled performance with the STGF30NC60S IGBT from STMicroelectronics, a leader in innovative semiconductor solutions. This robust, N-channel transistor excels in power control applications, providing superior efficiency and reliability for your designs. Its compact flange mount package ensures easy integration, while its high voltage capabilities make it ideal for demanding environments. Experience the quality and expertise that only STMicroelectronics can deliver, empowering your projects with cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy body ensures robustness and resistance to environmental factors, making this IGBT reliable in various applications.

Polarity or Channel Type: N-CHANNEL

The N-channel configuration generally offers better performance in terms of switching speed and efficiency, making it ideal for power control applications.

Configuration: SINGLE

A single configuration allows for simple design and integration into various circuits, providing flexibility for designers.

Transistor Application: POWER CONTROL

Specialized for power control, this IGBT is optimized for high-voltage and high-current applications, enhancing its versatility.

Package Shape: RECTANGULAR

The rectangular package shape facilitates easy mounting and compact design, suitable for a wide range of space-constrained applications.

Terminal Form: THROUGH-HOLE

Through-hole terminals enhance stability and ease of soldering on circuit boards, ensuring secure and reliable connections.

Nominal Turn Off Time (toff): 555 ns

A nominal turn-off time of 555 ns allows for efficient operation in fast-switching applications, improving overall system performance.

No. of Terminals: 3

With three terminals, this IGBT simplifies connections and helps maintain a compact design while ensuring effective operation.

Maximum Power Dissipation (Abs): 40 W

A maximum power dissipation of 40 W enables the device to handle significant loads without overheating, ensuring reliability under high-power conditions.

Package Style (Meter): FLANGE MOUNT

Flange mount style provides robust mechanical stability, making it suitable for high-vibration environments and ensuring longevity.

Maximum Operating Temperature: 150 °C

High maximum operating temperature capability assures functionality in extreme conditions, expanding the range of applications.

Maximum Collector-Emitter Voltage: 600 V

A maximum collector-emitter voltage of 600 V allows for use in high-voltage environments, enhancing its applicability in various industrial settings.

Transistor Element Material: SILICON

Silicon as the element material ensures good thermal performance and reliability, which is crucial for semiconductor devices in power control.

Maximum Gate-Emitter Voltage: 20 V

A maximum gate-emitter voltage of 20 V provides flexibility in drive circuit design, ensuring compatibility with various control voltages.

Maximum Collector Current (IC): 22 A

A maximum collector current of 22 A supports high-load applications, making it suitable for demanding power control tasks.

Maximum Gate-Emitter Threshold Voltage: 5.75 V

A threshold voltage of 5.75 V allows for efficient gating, optimizing switching characteristics and improving switching performance.

Terminal Position: SINGLE

Single terminal position design promotes simplicity and ease in PCB layout, aiding designers in creating efficient circuit designs.

Case Connection: ISOLATED

Isolated case connection enhances safety by preventing unwanted interactions with other circuit elements, ensuring stable operation.

Nominal Turn On Time (ton): 30 ns

A nominal turn-on time of 30 ns supports rapid switching capabilities, enabling efficient modulation of the power supply.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGF30NC60S attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Configuration:

Maximum Gate-Emitter Threshold Voltage:

5.75 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

555 ns

Nominal Turn On Time (ton):

30 ns

Trade Compliance

STGF30NC60S Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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