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SRTAG2K-DSB12I/2

STMicroelectronics

SRTAG2K-DSB12I/2 by STMicroelectronics

SRTAG2K-DSB12I/2 by STMicroelectronics is an industrial-grade CMOS memory IC with a 256x8 organization and operates asynchronously. It features a wide temperature range from -40 °C to 85 °C, making it ideal for harsh environments. This uncasded chip is perfect for various applications requiring reliable data storage.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,942 parts In-Stock

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2,942

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Vyrian

USA . 1,612 parts In-Stock

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1,612

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Anansix

USA . 820 parts In-Stock

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820

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 547 parts In-Stock

1+ parts

$3.428

100+ parts

-

1k+ parts

$3.085

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547

$3.428

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$3.085

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MKK Technologies

India . 2,264 parts In-Stock

1+ parts

$6.446

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2,264

$6.446

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DigiPath Technology Company

USA . 2,264 parts In-Stock

1+ parts

$6.446

100+ parts

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2,264

$6.446

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Corphita

USA . 1,616 parts In-Stock

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1,616

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Parana Technologies

USA . 1,305 parts In-Stock

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$4.099

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1,305

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$4.099

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Overview

Elevate your projects with the SRTAG2K-DSB12I/2 from STMicroelectronics, a leader in innovative memory solutions. Designed for versatility and reliability, this high-performance memory IC thrives in industrial environments, delivering superior quality for demanding applications. With its compact surface mount design and wide temperature range, it ensures seamless integration and longevity in your systems, empowering you to achieve excellence in every project.

Feature Benefit Bullets

Surface Mount: YES

This surface mount compatibility allows for easy integration into compact designs, making it ideal for space-constrained applications.

Operating Mode: ASYNCHRONOUS

The asynchronous operation ensures rapid data access without the need for a clock signal, providing faster response times for applications.

Package Style (Meter): UNCASED CHIP

The uncaased chip design reduces size and weight, and offers flexibility in mounting options for various applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature makes this IC suitable for use in demanding environments without risk of overheating.

Organization: 256X8

With an organization of 256x8, this memory IC efficiently supports a range of applications requiring moderate storage needs.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable performance in harsh cold environments, making it suitable for industrial applications.

Terminal Position: UPPER

The upper terminal position aids in better accessibility during assembly and servicing processes.

Temperature Grade: INDUSTRIAL

The industrial temperature grade guarantees stability and reliability in extreme conditions, catering to demanding applications.

Technology: CMOS

Using CMOS technology provides low power consumption and high speed, making it energy efficient and ideal for battery-operated devices.

Terminal Form: NO LEAD

The no-lead design enhances performance in terms of signal integrity and reduces the footprint, contributing to miniaturization.

No. of Words: 256 words

With 256 words, this memory IC strikes a balance between storage capacity and compact size, fitting various application requirements.

Memory Width: 8

The memory width of 8 bits allows for efficient data handling, suitable for applications needing manageable data chunks.

No. of Words Code: 256

The 256-word code enhances compatibility with a wide range of protocols and systems, promoting versatility in use.

Memory Density: 2048 bit

A memory density of 2048 bits indicates a compact and efficient storage solution, vital for modern electronic devices.

Memory IC Type: MEMORY CIRCUIT

As a memory circuit, this IC is designed for reliable data storage and retrieval, essential for the functionality of electronic systems.

Technical Specifications

Other Function Memory ICs SRTAG2K-DSB12I/2 attributes and parameters. Explore more Other Function Memory ICs devices from STMicroelectronics

Specs

JESD-30 Code:

X-XUUC-N

Memory Density:

2048 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Words:

256 words

No. of Words Code:

256

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256X8

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Position:

UPPER

Trade Compliance

SRTAG2K-DSB12I/2 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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