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SRTAG64K-SB12I/2

STMicroelectronics

SRTAG64K-SB12I/2 by STMicroelectronics

SRTAG64K-SB12I/2 from STMicroelectronics is a CMOS memory IC designed for industrial applications, featuring a 64K x 1 organization and operating in asynchronous mode. It supports a wide temperature range from -40 °C to 85 °C. This surface-mount, no-lead chip ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,401 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,401

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-

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Vyrian

USA . 2,223 parts In-Stock

1+ parts

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1k+ parts

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10k+ parts

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2,223

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Anansix

USA . 1,466 parts In-Stock

1+ parts

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1,466

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,153 parts In-Stock

1+ parts

$5.107

100+ parts

-

1k+ parts

$4.596

10k+ parts

-

2,153

$5.107

-

$4.596

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MKK Technologies

India . 1,020 parts In-Stock

1+ parts

$9.603

100+ parts

-

1k+ parts

-

10k+ parts

-

1,020

$9.603

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DigiPath Technology Company

USA . 1,020 parts In-Stock

1+ parts

$9.603

100+ parts

-

1k+ parts

-

10k+ parts

-

1,020

$9.603

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Corphita

USA . 3,018 parts In-Stock

1+ parts

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3,018

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Parana Technologies

USA . 157 parts In-Stock

1+ parts

-

100+ parts

$6.106

1k+ parts

-

10k+ parts

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157

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$6.106

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Overview

Unlock your project's potential with the SRTAG64K-SB12I/2 by STMicroelectronics. Renowned for their industry-leading innovation, STMicroelectronics delivers a robust and reliable memory solution designed for harsh environments, ensuring optimal performance from -40 °C to 85 °C. Perfect for diverse applications, this versatile memory IC offers seamless integration and exceptional reliability, empowering you to create smarter, more efficient devices that stand out in today's competitive landscape. Elevate your designs with unparalleled quality and trust STMicroelectronics for excellence!

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for easier integration in compact electronic devices, saving space and enabling more efficient circuit layouts.

Operating Mode: ASYNCHRONOUS

Asynchronous operation enhances performance by allowing data access without the need for clock synchronization, reducing processing delay.

Package Style (Meter): UNCASED CHIP

The unencased chip style facilitates direct integration into custom PCB designs, allowing for greater design flexibility and product customization.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, the product is suitable for a variety of applications in challenging environments, enhancing reliability.

Organization: 64KX1

The 64K x 1 organization provides a balance of memory capacity and access efficiency, making it suitable for various applications that require modest memory needs.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40 °C extends its usability into harsh environments, making it ideal for industrial applications.

Terminal Position: UPPER

The upper terminal position design facilitates easier mounting and connectivity on PCBs, enhancing the overall assembly process.

Temperature Grade: INDUSTRIAL

Industrial temperature grade signifies robustness and durability, ensuring the memory IC performs reliably in demanding industrial conditions.

Technology: CMOS

Utilizing CMOS technology provides lower power consumption, enhancing energy efficiency and extending battery life in portable applications.

Terminal Form: NO LEAD

The no-lead terminal form supports the latest standards in environmental safety by reducing the use of lead, thus catering to eco-conscious applications.

No. of Words: 65536 words

A capacity of 65,536 words offers substantial storage for various data types, making it versatile for a range of applications in memory-critical tasks.

No. of Words Code: 64K

This code indicates a robust memory configuration that can effectively manage a wide array of data processing needs, appealing to diverse industries.

Memory Density: 65536 bit

With a memory density of 65,536 bits, this component provides an efficient memory solution suitable for systems requiring compact data storage.

Memory IC Type: MEMORY CIRCUIT

As a dedicated memory circuit, it is optimized for performance in data storage, making it a reliable choice for electronics requiring efficient data management.

Technical Specifications

Other Function Memory ICs SRTAG64K-SB12I/2 attributes and parameters. Explore more Other Function Memory ICs devices from STMicroelectronics

Specs

JESD-30 Code:

X-XUUC-N

Memory Density:

65536 bit

Memory IC Type:

Memory Width:

1

No. of Functions:

1

No. of Words:

65536 words

No. of Words Code:

64K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

64KX1

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Position:

UPPER

Trade Compliance

SRTAG64K-SB12I/2 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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