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SRTAG2KL-PMC6T/5

STMicroelectronics

SRTAG2KL-PMC6T/5 by STMicroelectronics

SRTAG2KL-PMC6T/5 by STMicroelectronics is a CMOS memory IC with an asynchronous operating mode, ideal for industrial applications. It features a 256x8 organization, operates b/w -40 °C to 85 °C, and supports dual terminal positioning in a compact 3mm x 2mm package. This versatile memory solution is perfect for space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

< 1k

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 376 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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376

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Digiode

USA . 292 parts In-Stock

1+ parts

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1k+ parts

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292

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Anansix

USA . 257 parts In-Stock

1+ parts

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100+ parts

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257

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,191 parts In-Stock

1+ parts

$2.881

100+ parts

-

1k+ parts

$2.593

10k+ parts

-

1,191

$2.881

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$2.593

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MKK Technologies

India . 1,379 parts In-Stock

1+ parts

$5.418

100+ parts

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1k+ parts

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1,379

$5.418

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DigiPath Technology Company

USA . 1,379 parts In-Stock

1+ parts

$5.418

100+ parts

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1k+ parts

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10k+ parts

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1,379

$5.418

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Corphita

USA . 3,638 parts In-Stock

1+ parts

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3,638

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Parana Technologies

USA . 1,534 parts In-Stock

1+ parts

-

100+ parts

$3.445

1k+ parts

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10k+ parts

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1,534

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$3.445

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Overview

Unlock unparalleled performance with the SRTAG2KL-PMC6T/5 from STMicroelectronics, a leader in innovative technology. This high-quality memory IC is designed for robust applications, ensuring reliability in extreme temperatures. With its compact profile and advanced features, it enhances efficiency across various industrial environments. Experience the perfect synergy of quality and performance, empowering your designs to reach new heights!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and resistance to environmental factors, enhancing the reliability of the memory IC.

Surface Mount: YES

Surface mount capability allows for compact designs and improved performance in high-density applications.

Package Shape: RECTANGULAR

The rectangular shape of the package facilitates easier layout and integration on printed circuit boards.

Operating Mode: ASYNCHRONOUS

Asynchronous operation enables faster access times, making it suitable for quick data retrieval and processing.

Power Supplies (V): 1.8/5

Dual power supply options improve flexibility in design and can accommodate different system voltage requirements.

No. of Terminals: 8

With 8 terminals, this IC allows for a compact interface while providing sufficient connectivity for data transmission.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The small outline and thin profile make it ideal for space-constrained applications, ensuring efficient use of PCB real estate.

Maximum Operating Temperature: 85 °C

The high temperature tolerance ensures reliable operation in demanding industrial environments.

Organization: 256X8

The 256x8 organization allows efficient data storage and retrieval, making it suitable for various applications.

Minimum Operating Temperature: -40 °C

The wide temperature range guarantees performance in extreme conditions, suitable for industrial applications.

Terminal Position: DUAL

Dual terminal positioning facilitates easier integration into various circuit designs and improves manufacturing efficiency.

Maximum Seated Height: 0.6 mm

A low seated height supports the use of multi-layer PCBs and contributes to the overall compactness of the design.

Width: 2 mm

This small width enables integration into densely packed electronic devices without sacrificing performance.

Length: 3 mm

Short length aids in minimizing PCB space usage, making this IC suitable for portable and compact devices.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures that this memory IC can operate reliably in harsh conditions and for long periods.

Technology: CMOS

CMOS technology enhances energy efficiency and performance, making it well-suited for battery-operated devices.

Terminal Form: NO LEAD

The no-lead terminal form reduces the footprint and eliminates the risk of lead contamination, supporting environmentally friendly designs.

No. of Words: 256 words

Having 256 words provides adequate storage for many applications, balancing size and data capacity.

Memory Width: 8

An 8-bit memory width allows for efficient data handling in most digital systems.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for denser packing of components on the PCB, which is essential for modern electronics.

No. of Words Code: 256

256 words of code represents a suitable level of memory for numerous applications, offering flexibility and efficiency.

Memory Density: 2048 bit

With a memory density of 2048 bits, this IC strikes a great balance between size and storage capacity needed for various applications.

Memory IC Type: MEMORY CIRCUIT

As a memory circuit, it is essential for storing and retrieving data, making it fundamental for electronic devices.

Technical Specifications

Other Function Memory ICs SRTAG2KL-PMC6T/5 attributes and parameters. Explore more Other Function Memory ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDSO-N8

Length:

3 mm

Memory Density:

2048 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

8

No. of Words:

256 words

No. of Words Code:

256

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256X8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Power Supplies (V):

1.8/5

Qualification:

Not Qualified

Maximum Seated Height:

.6 mm

Sub-Category:

Other Memory ICs

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

2 mm

Trade Compliance

SRTAG2KL-PMC6T/5 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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