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SRTAG512L-SB12/5

STMicroelectronics

SRTAG512L-SB12/5 by STMicroelectronics

SRTAG512L-SB12/5 by STMicroelectronics is a 512-bit CMOS memory IC designed for asynchronous operation. It features a surface mount, no lead design with an organization of 64x8 and is ideal for compact applications requiring efficient data storage. Perfect for embedded systems, it offers reliable performance in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,598 parts In-Stock

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2,598

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Vyrian

USA . 2,310 parts In-Stock

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2,310

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Anansix

USA . 1,090 parts In-Stock

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1,090

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,221 parts In-Stock

1+ parts

$3.112

100+ parts

-

1k+ parts

$2.801

10k+ parts

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1,221

$3.112

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$2.801

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MKK Technologies

India . 1,445 parts In-Stock

1+ parts

$5.853

100+ parts

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1,445

$5.853

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DigiPath Technology Company

USA . 1,445 parts In-Stock

1+ parts

$5.853

100+ parts

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1,445

$5.853

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Corphita

USA . 4,073 parts In-Stock

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4,073

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Parana Technologies

USA . 1,120 parts In-Stock

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100+ parts

$3.721

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1,120

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$3.721

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Overview

Unlock the power of innovation with the SRTAG512L-SB12/5 from STMicroelectronics, a leader in semiconductor technology. This cutting-edge memory IC combines reliability and efficiency, ensuring seamless performance in various applications, from consumer electronics to industrial solutions. Its surface mount design and asynchronous operation provide versatility and ease of integration, delivering unmatched value and optimizing your project’s potential while maximizing space and enhancing functionality.

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for space-efficient installation, making it ideal for modern, compact electronic devices.

Operating Mode: ASYNCHRONOUS

Asynchronous operation allows for simpler interfaces and faster access times, enhancing overall system performance.

Package Style (Meter): UNCASED CHIP

The uncased chip package is suitable for custom applications where size and weight are critical, providing flexibility in design.

Organization: 64X8

A 64x8 organization facilitates easy data manipulation and retrieval, making it suitable for various data processing tasks.

Terminal Position: UPPER

Upper terminal position allows for efficient space utilization on PCBs, making it easier to route traces and place other components.

Technology: CMOS

CMOS technology ensures low power consumption and high-speed operation, making the memory IC efficient and reliable for battery-operated devices.

Terminal Form: NO LEAD

No lead terminal form contributes to a smaller footprint, enabling integration into more compact electronic designs.

No. of Words: 64 words

With 64 words, this memory IC offers sufficient storage for simple applications while maintaining compactness and efficiency.

Memory Width: 8

An 8-bit memory width is ideal for applications that require a balance between data processing speed and resource usage.

No. of Words Code: 64

The memory capacity of 64 words allows for effective storage in applications such as small data loggers and embedded system designs.

Memory Density: 512 bit

A memory density of 512 bits is suitable for applications requiring moderate data storage, making it versatile for various electronic systems.

Memory IC Type: MEMORY CIRCUIT

As a dedicated memory circuit, this IC is optimized for reliability and performance in memory-intensive applications.

Technical Specifications

Other Function Memory ICs SRTAG512L-SB12/5 attributes and parameters. Explore more Other Function Memory ICs devices from STMicroelectronics

Specs

JESD-30 Code:

X-XUUC-N

Memory Density:

512 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Words:

64 words

No. of Words Code:

64

Operating Mode:

ASYNCHRONOUS

Organization:

64X8

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

NO LEAD

Terminal Position:

UPPER

Trade Compliance

SRTAG512L-SB12/5 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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