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SRTAG2KL-PSB12/5

STMicroelectronics

SRTAG2KL-PSB12/5 by STMicroelectronics

SRTAG2KL-PSB12/5 from STMicroelectronics is a CMOS memory IC featuring 256x8 organization and operates asynchronously. With a density of 2048 bits, it’s ideal for compact applications requiring efficient data storage. Its no-lead design ensures easy surface mounting.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,737 parts In-Stock

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2,737

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Anansix

USA . 2,281 parts In-Stock

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2,281

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Digiode

USA . 1,537 parts In-Stock

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1,537

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 41 parts In-Stock

1+ parts

$2.601

100+ parts

-

1k+ parts

$2.341

10k+ parts

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41

$2.601

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$2.341

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MKK Technologies

India . 2,094 parts In-Stock

1+ parts

$4.891

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2,094

$4.891

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DigiPath Technology Company

USA . 2,094 parts In-Stock

1+ parts

$4.891

100+ parts

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2,094

$4.891

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Corphita

USA . 2,963 parts In-Stock

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2,963

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Parana Technologies

USA . 813 parts In-Stock

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100+ parts

$3.110

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813

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$3.110

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Overview

Unlock unparalleled performance with the SRTAG2KL-PSB12/5 from STMicroelectronics, a leader in innovative semiconductor solutions. Designed for versatility, this high-quality memory IC excels in various applications, delivering exceptional speed and efficiency. Enjoy the benefits of a cutting-edge asynchronous operation, ideal for seamless integration into your projects, ensuring reliability and longevity. Elevate your designs with STMicroelectronics’ trusted technology today!

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for easier integration into modern circuit boards, reducing space and enhancing performance.

Operating Mode: ASYNCHRONOUS

ASYNCHRONOUS operation ensures quick and efficient data access without needing clock synchronization, ideal for high-speed applications.

Package Style (Meter): UNCASED CHIP

The uncased chip design provides flexibility for custom packaging and direct integration into various systems.

Organization: 256X8

The organization of 256x8 allows for efficient data handling, suitable for applications requiring a balanced memory structure.

Terminal Position: UPPER

Upper terminal positioning facilitates easier access during circuit design, improving installation efficiency.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this memory IC suitable for battery-operated devices.

Terminal Form: NO LEAD

Lead-free terminal form supports environmentally friendly practices, meeting regulatory compliance for modern electronics.

No. of Words: 256 words

With 256 words, this memory IC provides ample storage capacity for various applications, making it versatile for different uses.

Memory Width: 8

An 8-bit memory width allows for efficient data processing, streamlining performance in digital systems.

No. of Words Code: 256

Having 256 total addressable words facilitates simple and straightforward coding, enhancing ease of use in programming.

Memory Density: 2048 bit

The 2048 bit memory density means that this IC can store a significant amount of data in a compact form, ideal for space-constrained applications.

Memory IC Type: MEMORY CIRCUIT

Being classified as a MEMORY CIRCUIT, this product is designed specifically for reliable data storage solutions in various electronic devices.

Technical Specifications

Other Function Memory ICs SRTAG2KL-PSB12/5 attributes and parameters. Explore more Other Function Memory ICs devices from STMicroelectronics

Specs

JESD-30 Code:

X-XUUC-N

Memory Density:

2048 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Words:

256 words

No. of Words Code:

256

Operating Mode:

ASYNCHRONOUS

Organization:

256X8

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

NO LEAD

Terminal Position:

UPPER

Trade Compliance

SRTAG2KL-PSB12/5 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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