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SRTAG2KL-MH6T/5

STMicroelectronics

SRTAG2KL-MH6T/5 by STMicroelectronics

SRTAG2KL-MH6T/5 by STMicroelectronics is a dual-terminal, 2048-bit CMOS memory IC designed for industrial applications. It operates asynchronously within a temperature range of -40 °C to 85 °C and features a compact surface mount package. Ideal for space-constrained environments, it ensures reliable performance in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,902 parts In-Stock

1+ parts

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3,902

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Digiode

USA . 3,455 parts In-Stock

1+ parts

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1k+ parts

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3,455

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Anansix

USA . 779 parts In-Stock

1+ parts

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779

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,868 parts In-Stock

1+ parts

$4.740

100+ parts

-

1k+ parts

$4.266

10k+ parts

-

1,868

$4.740

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$4.266

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MKK Technologies

India . 471 parts In-Stock

1+ parts

$8.913

100+ parts

-

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471

$8.913

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DigiPath Technology Company

USA . 471 parts In-Stock

1+ parts

$8.913

100+ parts

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471

$8.913

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Corphita

USA . 4,575 parts In-Stock

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4,575

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Parana Technologies

USA . 2,120 parts In-Stock

1+ parts

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$5.667

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2,120

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$5.667

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Overview

Unlock innovation with the SRTAG2KL-MH6T/5 from STMicroelectronics, a leader in advanced memory solutions. This robust, industrial-grade memory IC ensures dependable performance across diverse applications, from automotive to consumer electronics. Its compact design and asynchronous operation make integration seamless, while its wide temperature range guarantees reliability in extreme conditions. Choose STMicroelectronics for unmatched quality and elevate your projects with the superior value this memory solution offers!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making the product suitable for a variety of applications.

Surface Mount: YES

Surface mount technology facilitates efficient use of space and enables automated assembly processes, enhancing production efficiency.

Operating Mode: ASYNCHRONOUS

Asynchronous operation allows for flexible timing and control in various applications, making it adaptable for different system architectures.

No. of Terminals: 5

With a compact 5-terminal design, this product is ideal for space-constrained applications while maintaining functionality.

Package Style (Meter): SMALL OUTLINE

The small outline package style contributes to a reduced footprint, making it suitable for compact electronic designs.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliability in a wide range of environments, suitable for industrial applications.

Organization: 2KX1

The 2Kx1 organization offers flexibility in data handling and efficient memory usage for specific applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this product is designed to perform reliably in extreme cold conditions.

Terminal Position: DUAL

Dual terminal positions enhance versatility in installation and integration within various circuit designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grading indicates suitability for harsh working environments, ensuring longevity and dependable performance.

Technology: CMOS

CMOS technology provides low power consumption and high speed, making this memory IC an efficient choice for modern electronic devices.

Terminal Form: NO LEAD

No lead design improves the reliability of connections and supports compact circuit layouts, ideal for advanced electronics.

No. of Words: 2048 words

With a capacity of 2048 words, this product meets the memory requirements for a variety of applications, from simple to complex.

No. of Words Code: 2K

Offering 2K words of storage provides a balance between performance and efficiency for embedded systems and applications.

Memory Density: 2048 bit

2048 bit memory density ensures substantial storage capacity while maintaining a compact footprint, suitable for modern designs.

Memory IC Type: MEMORY CIRCUIT

As a dedicated memory circuit, this product is optimized for data storage reliability and performance in various electronic applications.

Technical Specifications

Other Function Memory ICs SRTAG2KL-MH6T/5 attributes and parameters. Explore more Other Function Memory ICs devices from STMicroelectronics

Specs

JESD-30 Code:

X-PDSO-N5

Memory Density:

2048 bit

Memory IC Type:

Memory Width:

1

No. of Functions:

1

No. of Terminals:

5

No. of Words:

2048 words

No. of Words Code:

2K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

2KX1

Package Body Material:

PLASTIC/EPOXY

Package Code:

SON

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Trade Compliance

SRTAG2KL-MH6T/5 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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