Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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SPBT2563C2A by STMicroelectronics is an industrial-grade telecom interface IC with a rectangular package and 33 terminals. It operates b/w -40 °C to 85°C and requires a nominal voltage of 3.3V, making it ideal for robust telecom applications.
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The rectangular package shape allows for efficient use of PCB space, making it ideal for compact designs.
With 33 terminals, this IC provides ample connectivity options, allowing for flexible circuit design and integration.
The microelectronic assembly package style offers reliability and performance in a miniaturized form, perfect for modern telecom applications.
With a maximum operating temperature of 85 °C, this IC is suitable for use in environments with moderate thermal conditions, ensuring long-term stability.
Operating effectively at -40 °C makes this IC ideal for harsh and extreme environmental conditions, ensuring reliability in diverse applications.
Designed for industrial temperature grades, this IC offers enhanced durability and performance, ideal for critical telecom systems.
Being a dedicated telecom circuit IC ensures optimized performance for communication applications, making it a smart choice for telecom solutions.
The 3.3 V nominal supply voltage is a standard for many digital circuits, ensuring compatibility and efficiency in broader electronics systems.
Other Function Telecom Interface ICs SPBT2563C2A attributes and parameters. Explore more Other Function Telecom Interface ICs devices from STMicroelectronics
JESD-30 Code:
No. of Functions:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Shape:
Package Style (Meter):
Qualification:
Nominal Supply Voltage:
Surface Mount:
Telecom IC Type:
Temperature Grade:
Terminal Form:
Terminal Position:
SPBT2563C2A Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.
President, CEO
Jean-Marc Chery
President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience
Lorenzo Grandi
President, Sales & Marketing
Jerome Roux
Castelletto
Fabrication
Fab Initiation
1968
Italy
Wafer Capacity
SGFAB AMK 6
2000
Singapore
29,000
AG200
Agrate Brianza
14,000
RST 8
France
Rousset
35,000
Crolles 1
1993
Crolles
30,000
Crolles 2-ext. mod 5
Crolles 2-ext. mod 2
2022
Crolles 2-ext. mod 3
2023
Crolles 2
2004
28,000
1985
SiC Fab
2006
Sweden
Norrköping
10,000
Fab 3
2005
Tours
2,000
Fab 1 & Fab 2
1978
55,000
Fab 2
1997
Catania
SGFAB-AMK 6E
2003
145,000
SGFAB-AMJ 9
1984
152,000
AG300 (R3)
1980
25,000
1987
34,000
AG300
2024
Crolles 2-ext. mod 1
2020
Fab 1 6-inch fab
2013
11,000
SiC 6-inch line
2021
2,500
200mm GaN
2018
SGFAB-AMK 8
2001
Crolles 2- JV Fab
SGFAB-AMK 6
2016
38,125
SGFAB-AMK 2E
2010
20,000
Silicon Carbide A.B.
SiC wafer/EPI Fab
SiC Device Fab
2025
261
New England Microwave
Other Interface ICs; No. of Terminals: 14; Package Equivalence Code: FL14(UNSPEC); Power Supplies (V): +-5,-15; Package Body Material: PLASTIC/EPOXY; Surface Mount: YES;
SMBJ18CA
Dc Components
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358MX
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
PIC18F4550T-I/PT
Microchip Technology
The Microchip Technology PIC18F4550T-I/PT microcontroller operates at a max clock frequency of 48 MHz with 8-bit architecture. It features 13-Ch 10-Bit ADC channels and USB connectivity, making it suitable for industrial applications requiring high-speed data processing and analog-to-digital conversion. With low power mode and flash ROM programmability, this device offers efficient performance in compact designs.
M39029/56351
Souriau-sunbank Connection Technologies
Souriau-sunbank's M39029/56351 is a CRIMP contact type backshell accessory compliant with MIL-DTL-38999. It features FEMALE gender contacts, compatible with M39029/58363 mating contacts. The insertion and removal tools required are M81969/14-10 and M22520/2-10 respectively, making it ideal for military connector applications.
CRG0805F10R
Tyco Electronics Components
FIXED RESISTOR; Mounting Type: SURFACE MOUNT; Resistance: 10 ohm; Rated Power Dissipation (P): .125 W; Maximum Operating Temperature: 125 Cel; Tolerance: 1 %;
2N2222A
Fairchild Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
DS18B20Z
Dallas Semiconductor
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: RECTANGULAR; Housing: PLASTIC; Maximum Accuracy (Cel): 0.50;
DS18B20
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 3; Package Shape or Style: ROUND; Housing: PLASTIC; Output Interface Type: 1-WIRE INTERFACE;
2N7002
Zetex Plc
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Peak Reflow Temperature (C): 260; Package Shape: RECTANGULAR;
1N4148
Silicon Standard
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Itt Components
RECTIFIER DIODE; Surface Mount: NO; Config: SINGLE; Maximum Operating Temperature: 200 Cel; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Output Current: .15 A;
EU2B-YS3303C
Idec
ROTARY SWITCH;
DP83848IVVX/NOPB
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: QFP; Package Shape: SQUARE;
BAV99
Sangdest Microelectronics (Nanjing)
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
PIC18F4550-I/PT
PIC18F4550-I/PT by Microchip: 8-bit microcontroller with 44 terminals, 48 MHz clock frequency, and USB connectivity. Ideal for industrial applications requiring low power mode and 10-bit ADC channels.
BSS138
Onsemi
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Package Shape: RECTANGULAR; Terminal Finish: Matte Tin (Sn) - annealed;
Rochester Electronics
LM555CN
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
43025-0400
Molex
The Molex 43025-0400 is a board connector with 4 contacts, 2 rows, and a mating contact pitch of 0.118". It has a body length of 0.27", insulation resistance of 1Gohm, and operates b/w -40 to 105°C. Ideal for commercial applications requiring a female connector with crimp termination and UL94V-0 flammability rating.
EYSHSNZWZ
Taiyo Yuden
EYSHSNZWZ by Taiyo Yuden is a RECTANGULAR telecom IC with 28 terminals, HYBRID technology, and 3V supply voltage. It operates b/w -40°C to 85°C, suitable for telecom circuit applications requiring compact design with surface mount capability.
NEO-M8T
U-blox Ag
NEO-M8T by U-blox Ag is a telecom IC with 24 terminals, operating temperature range of -40 to 85°C. It features AEC-Q100 screening and TS 16949 certification, suitable for industrial applications requiring a 3V supply voltage. The surface-mountable rectangular package makes it ideal for compact designs in various industries.
BM71BLES1FC2-0B05BA
BM71BLES1FC2-0B05BA by Microchip Technology is a surface mount telecom interface IC with 16 terminals. It operates at temperatures ranging from -40 to 85 °C and has a max seated height of 2.1 mm. With a data rate of 0.0086 Mbps, it is suitable for various telecom circuit applications.
MAX7033EUI+
Maxim Integrated
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: TSSOP; Package Shape: RECTANGULAR;
BMD-380-A-R
TELECOM CIRCUIT;
SA616DK/01
NXP Semiconductors
SA616DK/01 by NXP Semiconductors is a telecom interface IC with 20 terminals, operating temperature range of -40 to 85°C. It features a small outline package style and gull wing terminal form, suitable for industrial applications requiring a nominal voltage of 3V.
BGM111A256V21R
Silicon Labs
BGM111A256V21R by Silicon Labs is a telecom IC with 31 terminals, operating at -40 to 85°C. It has a supply voltage of 3.3V and terminal pitch of 1.2mm, suitable for industrial applications requiring compact MICROELECTRONIC ASSEMBLY packages in surface mount form.
RN41-I/RM477
Microchip Technology's RN41-I/RM477 is a telecom IC with 32 terminals, operating at -40 to 85°C. It has a supply voltage of 3.3V and is surface mountable in a rectangular package style. Ideal for industrial applications requiring reliable telecom circuit interfaces.
HTRC11001T/03EE
NXP Semiconductors' HTRC11001T/03EE is a telecom IC with 14 terminals, operating at -40 to 85°C. It has a supply voltage of 3V and current of 0.01mA, suitable for industrial applications. The package is small outline, rectangular in shape, with gull wing terminals for surface mount assembly.
WT12-A-AI4
Silicon Labs' WT12-A-AI4 is a RECTANGULAR MICROELECTRONIC ASSEMBLY with 31 terminals. Operating from -40 to 85 °C, it's ideal for INDUSTRIAL applications requiring TELECOM CIRCUIT ICs at 3.3 V supply voltage and 1.5 mm terminal pitch.
453-00059C
Laird Technologies
TELECOM CIRCUIT; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260;
BGSA14GN10E6327XTSA1
Infineon Technologies
Infineon BGSA14GN10E6327XTSA1 is a 10-terminal chip carrier IC with telecom circuit type. Operating temp range -30 to 85°C, nominal voltage of 2.85V. Used in telecom interfaces due to its compact rectangular package shape and surface mount capability.
WT32I-A-AI6IAP
The Silicon Labs WT32I-A-AI6IAP is a telecom IC with 50 terminals, rectangular package shape, and industrial temperature grade. It is surface mountable and has a microelectronic assembly package style. Ideal for telecom circuit applications with operating temperatures ranging from -40°C to 85°C.
MGM240PA22VNA3R
AS3933-BQFT
Ams Ag
AS3933-BQFT by Ams Ag is a telecom IC with 16 terminals in a square chip carrier package. Operating temperature ranges from -40 to 85 °C, suitable for industrial use. It has a nominal voltage of 3V and terminal pitch of 0.65mm, ideal for telecom circuit applications.
JN5168-001-M03Z
TELECOM CIRCUIT; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 240;
ETRX357-LRS
Silicon Labs' ETRX357-LRS is a telecom IC with 33 terminals, operating from -40 to 85°C. With a supply voltage of 3V, it's ideal for industrial applications requiring a compact MICROELECTRONIC ASSEMBLY package and DUAL terminal position.
SX1261IMLTRT
Semtech
RF AND BASEBAND CIRCUIT; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 1; Peak Reflow Temperature (C): 260; Terminal Finish: MATTE TIN;
ST25R3914-AQWT
STMicroelectronics
TELECOM CIRCUIT; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;
BM70BLES1FC2-0B05BA
BM70BLES1FC2-0B05BA by Microchip Technology is a telecom interface IC with surface mount capability. It operates in an industrial temperature range of -40 to 85 °C and has a data rate of 0.0086 Mbps. This IC is commonly used in telecom circuits for various applications.
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SPBTLE-RF0TR
SPBTLE-RFTR
SPBTLE-RF0
SPBTLE-1S
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 23; Package Code: QMA; Package Shape: RECTANGULAR;
SPBTLE-RF
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 11; Package Shape: RECTANGULAR; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
SPBT2532C2.AT
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 14; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel;
SPBT2532C2.AT2
SPBT2563C1
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: UNSPECIFIED; No. of Terminals: 24; Package Shape: RECTANGULAR; Package Body Material: UNSPECIFIED;
SPBT2632C1A.AT2
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Shape: RECTANGULAR; Length: 26.9 mm;
SPBT2632C2A.AT2
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Shape: RECTANGULAR; Length: 13.5 mm;
SPBT2932DM
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 18; Package Shape: RECTANGULAR; No. of Functions: 1;
SPBT3.0DP1
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel;
SPBT3.0DP2
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 18; Package Shape: RECTANGULAR; JESD-30 Code: R-XXMA-N18;
SPBT4.0DP
TELECOM CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 18; Package Code: XMA; Package Shape: RECTANGULAR; Surface Mount: YES;
SPBTLE-1STR
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