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SPBT2563C1

STMicroelectronics

SPBT2563C1 by STMicroelectronics

SPBT2563C1 by STMicroelectronics is a telecom interface IC designed for robust communication applications. It operates within -20 °C to 70°C, features a 3.3V nominal voltage, and comes in a compact 24-terminal rectangular package. Ideal for microelectronic assemblies, it ensures reliable performance in various telecom circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,979 parts In-Stock

1+ parts

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4,979

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Vyrian

USA . 2,663 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,663

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Anansix

USA . 420 parts In-Stock

1+ parts

-

100+ parts

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420

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 410 parts In-Stock

1+ parts

$6.130

100+ parts

-

1k+ parts

$5.517

10k+ parts

-

410

$6.130

-

$5.517

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MKK Technologies

India . 1,192 parts In-Stock

1+ parts

$11.527

100+ parts

-

1k+ parts

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10k+ parts

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1,192

$11.527

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DigiPath Technology Company

USA . 1,192 parts In-Stock

1+ parts

$11.527

100+ parts

-

1k+ parts

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10k+ parts

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1,192

$11.527

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Corphita

USA . 3,641 parts In-Stock

1+ parts

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3,641

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Parana Technologies

USA . 1,905 parts In-Stock

1+ parts

-

100+ parts

$7.329

1k+ parts

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10k+ parts

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1,905

-

$7.329

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Overview

Unlock seamless connectivity with the SPBT2563C1 from STMicroelectronics, a trusted leader in innovative technology. This robust telecom interface IC enhances communication systems while ensuring reliability in various applications—from consumer electronics to industrial solutions. With its exceptional quality and performance, it empowers customers to achieve greater efficiency and connectivity, delivering substantial value and peace of mind. Elevate your projects with STMicroelectronics’ commitment to excellence!

Feature Benefit Bullets

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient board layout and improved space utilization, making it suitable for compact electronic designs.

No. of Terminals: 24

With 24 terminals, this Telecom IC provides ample connectivity options for various applications, allowing flexibility in integrating with other components.

Package Style (Meter): MICROELECTRONIC ASSEMBLY

The microelectronic assembly package style supports advanced manufacturing processes, which can lead to better performance and reliability in telecom interfaces.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C ensures stability and performance in a range of environmental conditions, making it reliable for telecom applications.

Minimum Operating Temperature: -20 °C

The ability to operate at temperatures as low as -20 °C makes this IC suitable for outdoor or unconditioned environments, enhancing its versatility.

Terminal Position: DUAL

The dual terminal position allows for symmetrical layout and better signal integrity, optimizing performance in telecom circuit applications.

Telecom IC Type: TELECOM CIRCUIT

Being specifically designated as a telecom circuit ensures that this IC is optimized for communication tasks, resulting in improved functionality and efficiency in telecom applications.

Nominal Supply Voltage: 3.3 V

A nominal supply voltage of 3.3V is ideal for modern digital circuits, ensuring compatibility with contemporary low-voltage applications and minimizing power consumption.

Technical Specifications

Other Function Telecom Interface ICs SPBT2563C1 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-XDMA-X24

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Nominal Supply Voltage:

3.3 V

Surface Mount:

NO

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

SPBT2563C1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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