Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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SPBT4.0DP by STMicroelectronics is a telecom interface IC designed for surface mount applications, featuring an operating temp range of -40 °C to 85 °C. It supports data rates up to 0.8 Mbps and operates at a nominal voltage of 3.3 V. Ideal for compact electronic devices, it has a rectangular package with 18 terminals.
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The surface mount design allows for automated assembly, reducing manufacturing costs and improving reliability.
The rectangular package shape is efficient for space-saving in compact electronic designs.
With 18 terminals, this IC offers ample connectivity options for complex telecom applications.
Microelectronic assembly ensures high integration and performance, suitable for modern telecom solutions.
The high maximum operating temperature makes this IC suitable for use in demanding environments.
The ability to operate in extremely low temperatures ensures reliability in harsh conditions.
Triple terminal position provides multiple connection options enhancing the design flexibility of the circuit.
A low seated height supports compact PCB designs, making it ideal for space-constrained applications.
This width is well-suited for high-density layouts, ensuring efficient use of space on PCBs.
The length provides a balanced footprint for optimal placement on the PCB while ensuring connectivity.
No lead design reduces the size and weight while also minimizing the risk of solder joint issues.
As a telecom circuit IC, it is specifically designed for reliable performance in communication systems.
The low nominal supply voltage is energy-efficient, making it suitable for battery-operated devices.
A terminal pitch of 0.5 mm allows for high-density mounting, optimizing board space and connectivity.
The data rate of 0.8 Mbps provides ample speed for various telecom applications, ensuring effective data transmission.
Other Function Telecom Interface ICs SPBT4.0DP attributes and parameters. Explore more Other Function Telecom Interface ICs devices from STMicroelectronics
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SPBT4.0DP Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.
President, CEO
Jean-Marc Chery
President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience
Lorenzo Grandi
President, Sales & Marketing
Jerome Roux
Castelletto
Fabrication
Fab Initiation
1968
Italy
Wafer Capacity
SGFAB AMK 6
2000
Singapore
29,000
AG200
Agrate Brianza
14,000
RST 8
France
Rousset
35,000
Crolles 1
1993
Crolles
30,000
Crolles 2-ext. mod 5
Crolles 2-ext. mod 2
2022
Crolles 2-ext. mod 3
2023
Crolles 2
2004
28,000
1985
SiC Fab
2006
Sweden
Norrköping
10,000
Fab 3
2005
Tours
2,000
Fab 1 & Fab 2
1978
55,000
Fab 2
1997
Catania
SGFAB-AMK 6E
2003
145,000
SGFAB-AMJ 9
1984
152,000
AG300 (R3)
1980
25,000
1987
34,000
AG300
2024
Crolles 2-ext. mod 1
2020
Fab 1 6-inch fab
2013
11,000
SiC 6-inch line
2021
2,500
200mm GaN
2018
SGFAB-AMK 8
2001
Crolles 2- JV Fab
SGFAB-AMK 6
2016
38,125
SGFAB-AMK 2E
2010
20,000
Silicon Carbide A.B.
SiC wafer/EPI Fab
SiC Device Fab
2025
ULN2803ADWG4
Texas Instruments
ULN2803ADWG4 by Texas Instruments is a peripheral driver with 8 functions, open-collector output characteristics, and built-in transient protections. It operates at temperatures ranging from -40 to 85°C and has a max supply voltage of 3V. Ideal for applications requiring sink current flow direction in a small outline package style.
FDD5614P
Onsemi
FDD5614P by Onsemi is a P-CHANNEL Power FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features 45A IDM and 0.1 ohm RDS(ON), operating in ENHANCEMENT MODE at up to 175°C. The PLASTIC/EPOXY package with GULL WING terminals ensures efficient heat dissipation and reliable performance.
1N4148
Forward International Electronics
RECTIFIER DIODE; Surface Mount: NO; Maximum Output Current: .15 A; Maximum Reverse Recovery Time: .004 us; Maximum Operating Temperature: 200 Cel; No. of Phases: 1;
2N7002
Samsung
N-CHANNEL AND P-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Drain-Source On Resistance: 5 ohm; No. of Terminals: 3;
LM358AN
Signetics
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
1N4148WS
Yangzhou Yangjie Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM7805CT
Integrated Circuit Technology
Other Regulators; No. of Terminals: 3; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %; Terminal Position: SINGLE; Operating Temperature (TJ-Min): 0 Cel;
MMBT3906LT1G
MMBT3906LT1G by Onsemi is a PNP BJT with VCEsat of 0.4V, hFE of 30, and fT of 250MHz. Ideal for small signal applications in electronics due to its low power dissipation, high transition frequency, and compact SOT-23 package. Suitable for use in temperature-sensitive environments with an operating range from -65°C to 150°C.
Diodes Incorporated
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Terminal Form: GULL WING; JESD-30 Code: R-PDSO-G3;
IRLML6402TRPBF
International Rectifier
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.3 W; Peak Reflow Temperature (C): 260; Package Style (Meter): SMALL OUTLINE;
LM2931Z-5.0G
LM2931Z-5.0G by Onsemi is a Fixed Positive Single Output LDO Regulator with 5V output voltage, 0.6V dropout voltage, and 0.1A output current. It is ideal for applications requiring stable power supply in temperature-sensitive environments due to its operating range of -40°C to 125°C.
2N2222A
Micropac Industries
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
EPCS4SI8N
Altera
CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Parallel or Serial: SERIAL;
EU2B-YS3103F
Idec
ROTARY SWITCH;
BAV99
NXP Semiconductors
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
BAT54C-7-F
BAT54C-7-F by Diodes Inc. is a Schottky rectifier diode with common cathode, 2 elements, and max forward voltage of 0.24V. Ideal for applications requiring fast reverse recovery time of 0.005 us, such as in small outline packages for surface mount technology at temperatures ranging from -65 to 150°C.
BSS138PS,115
Nexperia
N-CHANNEL; Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE; Surface Mount: YES; No. of Elements: 2; No. of Terminals: 6; Minimum DS Breakdown Voltage: 60 V;
Kec
RECTIFIER DIODE; Surface Mount: NO; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Non Repetitive Peak Forward Current: 2 A; Config: SINGLE; Maximum Operating Temperature: 200 Cel;
2N7002-7-F
SPC TECHNOLOGY/ MULTICOMP
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Terminal Form: GULL WING; Package Shape: RECTANGULAR;
Asi Semiconductor
TDA7116FHTMA1
Infineon Technologies
TDA7116FHTMA1 by Infineon is a telecom IC with 10 terminals, operating from -40 to 85°C. It has a small outline package style, matte tin finish, and dual terminal position. This IC is suitable for telecom circuits requiring a nominal voltage of 3V in industrial temperature environments.
OPA2380AIDGKRG4
OPA2380AIDGKRG4 by Texas Instruments is a dual-function telecom interface IC with 8 terminals and a supply voltage of 3/5V. It features a small outline package style, operates in automotive temperature grades (-40 to 125°C), and has low supply current at 0.016mA. Ideal for telecom circuits, this IC is surface mountable and suitable for various applications requiring precise signal processing.
ISL32275EFVZ-T
Integrated Device Technology
TELECOM CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR;
ADRF5044BCCZN-R7
Analog Devices
Analog Devices' ADRF5044BCCZN-R7 is a 24-terminal SQUARE package IC with -40 to 85 °C operating temp. Ideal for TELECOM CIRCUIT applications, it has a 3.3 V nominal voltage and 0.5 mm terminal pitch. With NICKEL PALLADIUM GOLD finish, it suits INDUSTRIAL-grade telecom interfaces.
LEA-M8S-0
U-blox Ag
LEA-M8S-0 by U-blox Ag is a surface mount RF and baseband circuit with 28 terminals. It operates in industrial temperature range (-40 to 85°C) and has a supply voltage of 3V. This telecom IC is AEC-Q100 certified, suitable for automotive applications.
NINA-B112-03B
TELECOM CIRCUIT; Moisture Sensitivity Level (MSL): 4;
ESP32-U4WDH
Espressif Systems (shanghai)
ESP32-U4WDH by Espressif Systems (shanghai) is a telecom IC with 1 function, operating at -40 to 105°C. It offers a data rate of 150 Mbps and runs on a 3.3V supply voltage. This square-shaped chip carrier is ideal for industrial applications requiring high-speed communication in compact spaces.
ENW89815A3KF
Panasonic
TELECOM CIRCUIT; Maximum Time At Peak Reflow Temperature (s): 50; Peak Reflow Temperature (C): 250;
CYBLE-214015-01
CYBLE-214015-01 by Infineon Technologies is a surface mount telecom IC with 1 function and 32 terminals. It has a square package shape, measuring 11mm in width and length, with a max seated height of 1.8mm. With an operating temperature range of -40 to 85°C, it is suitable for industrial applications.
CLRC66301HN,551
TELECOM CIRCUIT; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 2;
MAX-M8W-0
MAX-M8W-0 by U-blox Ag is an AEC-Q100 graded GNSS Module with 18 terminals, operating b/w -40 to 85°C. With a compact size of 9.7mm x 10.1mm x 2.7mm, it's ideal for industrial applications requiring precise location tracking and navigation capabilities at a supply voltage of 3V.
PD69208MILQ-TR-LE
Microsemi
TELECOM CIRCUIT; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260;
ODIN-W260-00B-00
TELECOM CIRCUIT; Peak Reflow Temperature (C): 245; Moisture Sensitivity Level (MSL): 4;
ST60-2230C-PU
Laird Technologies
TELECOM CIRCUIT;
SN65DSI83ZQER
SN65DSI83ZQER by Texas Instruments is a telecom interface IC with 64 terminals in a grid array package. It operates b/w -40 to 85°C, has a data rate of 1 Mbps, and requires a nominal voltage of 1.8V. This IC is suitable for industrial applications requiring thin profile and fine pitch components.
ZED-F9R-01B
ZED-F9P-04B
EVA-M8M-0-10
EVA-M8M-0-10 by U-blox Ag is a telecom IC with 43 terminals, operating at -40 to 85°C. It has a nominal voltage of 3.3V and is surface mountable in a square package style. Ideal for industrial applications requiring precise telecom circuit functionality.
CMWX1ZZABZ-093
Murata Manufacturing
Murata's CMWX1ZZABZ-093 is a telecom IC with 3.3V supply voltage, operating from -40 to 85°C. It features a metal package body for industrial use and is surface mountable. Ideal for telecom circuits, this rectangular microelectronic assembly has no lead terminals.
BMD-350-A-R
The U-blox Ag BMD-350-A-R is a telecom IC with 2 Mbps data rate, suitable for industrial applications. It operates b/w -40°C to 85°C, with peak reflow temperature of 250°C. This surface mount rectangular package has MSL level of 3 and is ideal for telecom circuit designs.
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SPBTLE-RF0TR
STMicroelectronics
TELECOM CIRCUIT; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;
SPBTLE-RFTR
SPBTLE-RF0
SPBTLE-1S
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 23; Package Code: QMA; Package Shape: RECTANGULAR;
SPBTLE-RF
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 11; Package Shape: RECTANGULAR; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
SPBT2532C2.AT
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 14; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel;
SPBT2532C2.AT2
SPBT2563C1
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: UNSPECIFIED; No. of Terminals: 24; Package Shape: RECTANGULAR; Package Body Material: UNSPECIFIED;
SPBT2563C2A
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: UNSPECIFIED; No. of Terminals: 33; Package Shape: RECTANGULAR; Nominal Supply Voltage: 3.3 V;
SPBT2632C1A.AT2
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Shape: RECTANGULAR; Length: 26.9 mm;
SPBT2632C2A.AT2
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Shape: RECTANGULAR; Length: 13.5 mm;
SPBT2932DM
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 18; Package Shape: RECTANGULAR; No. of Functions: 1;
SPBT3.0DP1
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel;
SPBT3.0DP2
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 18; Package Shape: RECTANGULAR; JESD-30 Code: R-XXMA-N18;
SPBTLE-1STR
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