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SPBT4.0DP

STMicroelectronics

SPBT4.0DP by STMicroelectronics

SPBT4.0DP by STMicroelectronics is a telecom interface IC designed for surface mount applications, featuring an operating temp range of -40 °C to 85 °C. It supports data rates up to 0.8 Mbps and operates at a nominal voltage of 3.3 V. Ideal for compact electronic devices, it has a rectangular package with 18 terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,425 parts In-Stock

1+ parts

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2,425

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Digiode

USA . 2,101 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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2,101

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Vyrian

USA . 1,016 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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1,016

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,235 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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4,235

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Overview

Unlock seamless connectivity with the SPBT4.0DP from STMicroelectronics, a leader in innovation and quality. Designed for reliability across diverse applications, this telecom interface IC excels in performance while offering robust temperature resilience. Its compact, surface-mount design ensures easy integration, enabling enhanced communication solutions. Elevate your projects with unmatched efficiency and trust in ST's proven expertise to deliver outstanding value and capability.

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for automated assembly, reducing manufacturing costs and improving reliability.

Package Shape: RECTANGULAR

The rectangular package shape is efficient for space-saving in compact electronic designs.

No. of Terminals: 18

With 18 terminals, this IC offers ample connectivity options for complex telecom applications.

Package Style (Meter): MICROELECTRONIC ASSEMBLY

Microelectronic assembly ensures high integration and performance, suitable for modern telecom solutions.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature makes this IC suitable for use in demanding environments.

Minimum Operating Temperature: -40 °C

The ability to operate in extremely low temperatures ensures reliability in harsh conditions.

Terminal Position: TRIPLE

Triple terminal position provides multiple connection options enhancing the design flexibility of the circuit.

Maximum Seated Height: 2.9 mm

A low seated height supports compact PCB designs, making it ideal for space-constrained applications.

Width: 11.6 mm

This width is well-suited for high-density layouts, ensuring efficient use of space on PCBs.

Length: 13.5 mm

The length provides a balanced footprint for optimal placement on the PCB while ensuring connectivity.

Terminal Form: NO LEAD

No lead design reduces the size and weight while also minimizing the risk of solder joint issues.

Telecom IC Type: TELECOM CIRCUIT

As a telecom circuit IC, it is specifically designed for reliable performance in communication systems.

Nominal Supply Voltage: 3.3 V

The low nominal supply voltage is energy-efficient, making it suitable for battery-operated devices.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for high-density mounting, optimizing board space and connectivity.

Data Rate: 0.8 Mbps

The data rate of 0.8 Mbps provides ample speed for various telecom applications, ensuring effective data transmission.

Technical Specifications

Other Function Telecom Interface ICs SPBT4.0DP attributes and parameters. Explore more Other Function Telecom Interface ICs devices from STMicroelectronics

Specs

Data Rate:

.8 Mbps

JESD-30 Code:

R-XXMA-N18

Length:

13.5 mm

No. of Functions:

1

No. of Terminals:

18

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Code:

XMA

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Maximum Seated Height:

2.9 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

TRIPLE

Width:

11.6 mm

Trade Compliance

SPBT4.0DP Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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