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SPBT2532C2.AT

STMicroelectronics

SPBT2532C2.AT by STMicroelectronics

SPBT2532C2.AT by STMicroelectronics is a dual-terminal telecom IC designed for industrial applications, operating b/w -40 °C to 85°C. It features a compact rectangular package (10.4mm x 13.5mm) and requires a nominal voltage of 3V. Ideal for robust telecom interfaces, it ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,937 parts In-Stock

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4,937

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Anansix

USA . 1,982 parts In-Stock

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1,982

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Vyrian

USA . 778 parts In-Stock

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778

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,473 parts In-Stock

1+ parts

$7.497

100+ parts

-

1k+ parts

$6.747

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1,473

$7.497

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$6.747

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MKK Technologies

India . 600 parts In-Stock

1+ parts

$14.098

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600

$14.098

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DigiPath Technology Company

USA . 600 parts In-Stock

1+ parts

$14.098

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600

$14.098

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Corphita

USA . 1,954 parts In-Stock

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1,954

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Parana Technologies

USA . 1,314 parts In-Stock

1+ parts

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$8.964

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1,314

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$8.964

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Perfect Parts

USA . 218 parts In-Stock

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Overview

Elevate your telecom projects with the SPBT2532C2.AT from STMicroelectronics, a trusted name in innovative technology. This robust and reliable interface IC is designed for demanding industrial applications, ensuring exceptional performance even in extreme temperatures. With its compact, no-lead design and dual terminal positioning, it seamlessly integrates into various systems, delivering superior communication efficiency while reducing space. Unlock unparalleled value and dependability for your next project!

Feature Benefit Bullets

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient space utilization on circuit boards, making it suitable for various compact applications.

No. of Terminals: 14

With 14 terminals, this IC offers sufficient connectivity for diverse functionalities while maintaining a compact footprint.

Package Style (Meter): MICROELECTRONIC ASSEMBLY

The microelectronic assembly package style is designed for high-density circuit integration, enhancing performance in telecom applications.

Maximum Operating Temperature: 85 °C

The ability to operate at a maximum temperature of 85 °C ensures reliability in various environmental conditions, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this product is ideal for use in extreme environments, ensuring functionality in harsh conditions.

Terminal Position: DUAL

Dual terminal positioning optimizes circuit layout and increases design flexibility, making it easier to integrate into different systems.

Width: 10.4 mm

A width of 10.4 mm keeps the IC compact, allowing for efficient use of space on PCB designs without compromising performance.

Length: 13.5 mm

At 13.5 mm in length, this IC maintains a small profile, which is crucial for modern compact designs in telecommunications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade signifies that this IC is built for robustness, suitable for demanding industrial and telecom environments.

Terminal Form: NO LEAD

A no-lead terminal form reduces the footprint and enhances thermal performance while being environmentally friendly and compliant with RoHS standards.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom applications, this IC delivers optimal performance and reliability in communication systems.

Nominal Supply Voltage: 3 V

Operating at a nominal supply voltage of 3 V minimizes power consumption, making it a cost-effective choice for energy-sensitive applications.

Terminal Pitch: 1.5 mm

A terminal pitch of 1.5 mm allows for easier soldering and improves the overall reliability of connections in high-density layouts.

Technical Specifications

Other Function Telecom Interface ICs SPBT2532C2.AT attributes and parameters. Explore more Other Function Telecom Interface ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-XDMA-N14

Length:

13.5 mm

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Nominal Supply Voltage:

3 V

Surface Mount:

NO

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10.4 mm

Trade Compliance

SPBT2532C2.AT Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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