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SPBT3.0DP1

STMicroelectronics

SPBT3.0DP1 by STMicroelectronics

SPBT3.0DP1 by STMicroelectronics is a telecom interface IC designed for industrial applications, operating b/w -40 °C to 85 °C. It features a compact 24-terminal design with a nominal voltage of 3.3V and no lead terminals. Ideal for robust telecom circuits, it ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,787 parts In-Stock

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2,787

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Anansix

USA . 1,898 parts In-Stock

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1,898

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Digiode

USA . 1,873 parts In-Stock

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1,873

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,069 parts In-Stock

1+ parts

$11.236

100+ parts

-

1k+ parts

$10.112

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1,069

$11.236

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$10.112

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MKK Technologies

India . 599 parts In-Stock

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$21.128

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599

$21.128

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DigiPath Technology Company

USA . 599 parts In-Stock

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$21.128

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599

$21.128

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Component Stockers USA

USA . 664 parts In-Stock

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$99.990

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664

$99.990

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Perfect Parts

USA . 3,293 parts In-Stock

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3,293

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Corphita

USA . 2,465 parts In-Stock

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2,465

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Parana Technologies

USA . 2,176 parts In-Stock

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$13.434

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2,176

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$13.434

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Assy Fe

Spain . 555 parts In-Stock

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555

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Overview

Elevate your connectivity solutions with the SPBT3.0DP1 from STMicroelectronics, a leader in innovative semiconductor technology. This robust telecom interface IC delivers exceptional performance in extreme conditions, making it ideal for industrial applications. With its compact design and reliable operation, you can enjoy seamless communication, reduced energy consumption, and enhanced system efficiency. Trust STMicroelectronics to power your next project with quality and innovation at its core!

Feature Benefit Bullets

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient space utilization on a PCB, making it suitable for compact designs.

No. of Terminals: 24

With 24 terminals, this device offers sufficient connectivity options for various applications, enhancing flexibility in design.

Package Style (Meter): MICROELECTRONIC ASSEMBLY

The microelectronic assembly style ensures a high level of integration, which can help reduce assembly time and improve reliability.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C allows for deployment in environments with high thermal conditions, ensuring reliable performance.

Minimum Operating Temperature: -40 °C

Operating down to -40 °C makes this product suitable for harsh environments and ensures functionality in extreme temperature variations.

Terminal Position: DUAL

Dual terminal positioning provides flexibility in layout design and helps improve the aesthetic and functional aspects of circuit designs.

Maximum Seated Height: 3 mm

A low seated height of 3 mm contributes to a slim profile, making it ideal for space-constrained applications.

Width: 15.24 mm

At 15.24 mm wide, this product strikes a balance between compactness and ease of handling during installation.

Length: 26.9 mm

The length of 26.9 mm supports versatile application across various circuit designs while providing ample space for effective filtering and termination.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliability in demanding applications, making it suitable for long-term use in critical environments.

Terminal Form: NO LEAD

No-lead terminals enhance the surface-mount capabilities and help reduce the footprint on PCBs, simplifying the manufacturing process.

Telecom IC Type: TELECOM CIRCUIT

Being classified as a telecom IC type establishes this product’s relevance in telecommunications applications, ensuring it meets industry standards.

Nominal Supply Voltage: 3.3 V

A nominal supply voltage of 3.3 V is standard for many digital circuits, ensuring ease of integration into existing systems.

Terminal Pitch: 1.524 mm

The 1.524 mm terminal pitch provides sufficient spacing for soldering and assembly, enhancing manufacturability and reliability.

Technical Specifications

Other Function Telecom Interface ICs SPBT3.0DP1 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-XDMA-N24

Length:

26.9 mm

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

3 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

NO

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.524 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

15.24 mm

Trade Compliance

SPBT3.0DP1 Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.G

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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