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SPBTLE-1S

STMicroelectronics

SPBTLE-1S by STMicroelectronics

SPBTLE-1S by STMicroelectronics is a telecom IC with 23 terminals, operating at -40 to 85°C. It has a supply voltage of 3.3V and terminal pitch of 1.27mm, suitable for industrial applications requiring compact MICROELECTRONIC ASSEMBLY packages in surface mount configurations.

Median Price

$11.825

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 306 parts In-Stock

1+ parts

$8.220

100+ parts

$6.420

1k+ parts

$6.410

10k+ parts

-

306

$8.220

$6.420

$6.410

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Element14

Singapore . 311 parts In-Stock

1+ parts

$15.430

100+ parts

$14.150

1k+ parts

$13.820

10k+ parts

-

311

$15.430

$14.150

$13.820

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Distrelec

Netherlands . 73 parts In-Stock

1+ parts

-

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73

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Distributors (In-Stock)

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Digiode

USA . 540 parts In-Stock

1+ parts

$7.818

100+ parts

-

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-

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540

$7.818

-

-

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Nova Conductors

Japan . 900 parts In-Stock

1+ parts

$9.325

100+ parts

-

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900

$9.325

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-

-

Chip Stock

USA . 4,060 parts In-Stock

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4,060

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Anansix

USA . 2,610 parts In-Stock

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2,610

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Vyrian

USA . 168 parts In-Stock

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168

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Goldney Electronics S.L.

Spain . 6 parts In-Stock

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6

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Distributors (Availability)

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Ampacity Inc.

Singapore . 507 parts In-Stock

1+ parts

$6.120

100+ parts

-

1k+ parts

-

10k+ parts

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507

$6.120

-

-

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Continental Prestige Electronics

USA . 413 parts In-Stock

1+ parts

$6.770

100+ parts

-

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413

$6.770

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Corohmni

South Africa . 963 parts In-Stock

1+ parts

$6.884

100+ parts

-

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963

$6.884

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Corphita

USA . 3,579 parts In-Stock

1+ parts

$7.407

100+ parts

-

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3,579

$7.407

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$8.651

100+ parts

$7.872

1k+ parts

$7.094

10k+ parts

-

2,000

$8.651

$7.872

$7.094

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IDEA Electronic Components Group

UK . 503 parts In-Stock

1+ parts

$8.733

100+ parts

-

1k+ parts

$7.859

10k+ parts

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503

$8.733

-

$7.859

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Aranea Global

USA . 500 parts In-Stock

1+ parts

$9.138

100+ parts

-

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$8.772

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500

$9.138

-

$8.772

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Aztec Data Supply Inc.

USA . 48,621 parts In-Stock

1+ parts

$9.722

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-

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48,621

$9.722

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MKK Technologies

India . 1,254 parts In-Stock

1+ parts

$16.421

100+ parts

-

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1,254

$16.421

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DigiPath Technology Company

USA . 1,254 parts In-Stock

1+ parts

$16.421

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1,254

$16.421

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Perfect Parts

USA . 7,580 parts In-Stock

1+ parts

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7,580

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Authorized Procurement Solutions

USA . 1,434 parts In-Stock

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1,434

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Eastek

USA . 1,434 parts In-Stock

1+ parts

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100+ parts

$13.560

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1,434

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$13.560

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Parana Technologies

USA . 1,407 parts In-Stock

1+ parts

-

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$10.441

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1,407

-

$10.441

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Lixinc

USA . 1,137 parts In-Stock

1+ parts

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1,137

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Argo Parts USA

USA . 495 parts In-Stock

1+ parts

-

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495

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Overview

Get ready to experience seamless connectivity with the SPBTLE-1S by STMicroelectronics. As a trusted manufacturer in the industry, STMicroelectronics delivers top-quality products that meet the highest standards. The SPBTLE-1S falls under the category of Other Function Telecom Interface ICs, offering a wide range of applications for various industries. This compact and efficient product boasts surface mount capability, a rectangular package shape, and a low operating temperature range, making it perfect for industrial use. Trust STMicroelectronics to provide you with reliable solutions that offer exceptional value and performance.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the product onto a printed circuit board, making it suitable for mass production.

Package Shape: RECTANGULAR

Rectangular package shape provides a standard form factor, making it compatible with a wide range of applications and mounting options.

No. of Terminals: 23

Having 23 terminals allows for a variety of input and output options, enabling the product to interface with multiple devices or systems.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, the product can function reliably in a wide range of environmental conditions.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3V allows for compatibility with common power sources, reducing the need for additional voltage regulation circuitry.

Terminal Pitch: 1.27 mm

With a terminal pitch of 1.27 mm, the product offers easy integration onto standard printed circuit boards, simplifying the assembly process.

Technical Specifications

Other Function Telecom Interface ICs SPBTLE-1S attributes and parameters. Explore more Other Function Telecom Interface ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-XQMA-N23

Length:

13.5 mm

No. of Functions:

1

No. of Terminals:

23

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

QMA

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

2.2 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

11.5 mm

Trade Compliance

SPBTLE-1S Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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