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SPBT2632C2A.AT2

STMicroelectronics

SPBT2632C2A.AT2 by STMicroelectronics

SPBT2632C2A.AT2 by STMicroelectronics is a telecom IC with 16 terminals, operating temperature range of -40 to 85 °C, and nominal voltage of 2.5V. It is designed for industrial applications requiring a surface mount rectangular package style with nickel gold terminal finish.

Median Price

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Lifecycle Status

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8

In-Stock Inventory

1k+

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Vyrian

USA . 3,663 parts In-Stock

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Digiode

USA . 2,324 parts In-Stock

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Anansix

USA . 434 parts In-Stock

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Inventory MP

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Bristol Electronics

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SPM Sales

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Prism Electronics

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IDEA Electronic Components Group

UK . 2,327 parts In-Stock

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$9.769

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$8.793

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MKK Technologies

India . 10 parts In-Stock

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$18.371

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DigiPath Technology Company

USA . 10 parts In-Stock

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$18.371

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Perfect Parts

USA . 6,606 parts In-Stock

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Kepictronics

USA . 3,600 parts In-Stock

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Corphita

USA . 2,821 parts In-Stock

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Parana Technologies

USA . 1,737 parts In-Stock

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RC Electronics

USA . 640 parts In-Stock

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Futuretech Components

Singapore . 576 parts In-Stock

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Overview

Unlock seamless connectivity with the SPBT2632C2A.AT2 by STMicroelectronics, a top-tier manufacturer known for its superior quality and reliability. This versatile telecom interface IC is designed to revolutionize communication applications, offering unparalleled performance and efficiency. Experience the value of effortless integration, enhanced functionality, and unmatched durability with this cutting-edge product. Elevate your projects to new heights with the SPBT2632C2A.AT2 and stay ahead of the curve in the fast-paced world of telecommunications.

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and cost in manufacturing.

Package Shape: RECTANGULAR

Rectangular package shape is commonly used and easy to handle, providing stability during installation and operation.

No. of Terminals: 16

Having 16 terminals allows for multiple connections and functionalities, increasing versatility in usage.

Package Style (Meter): MICROELECTRONIC ASSEMBLY

Microelectronic assembly style enhances precision and reliability, crucial for telecom interface ICs.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures stability and performance even in demanding environments.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature enables the product to function in a wide range of temperature conditions, making it versatile.

Terminal Finish: NICKEL GOLD

Nickel gold terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable connections over time.

Width: 11.6 mm

Compact width size allows for space-efficient integration in PCB layouts, ideal for applications with limited space.

Peak Reflow Temperature °C: 245

High peak reflow temperature withstands the soldering process without compromising product integrity.

Length: 13.5 mm

Optimal length size offers a balance between compactness and functionality, fitting well in various device designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliability and performance in harsh industrial environments, making it suitable for industrial applications.

Terminal Form: NO LEAD

No lead terminal form complies with environmental regulations and reduces potential health hazards, promoting sustainability.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom circuits, ensuring compatibility and optimized performance in telecom applications.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage simplifies power management and ensures proper operation within the specified voltage range.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 indicates moderate sensitivity to moisture exposure, requiring standard handling precautions to maintain product quality.

Technical Specifications

Other Function Telecom Interface ICs SPBT2632C2A.AT2 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-XXMA-N16

JESD-609 Code:

e4

Length:

13.5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Peak Reflow Temperature (C):

245

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL GOLD

Terminal Form:

Terminal Position:

UNSPECIFIED

Width:

11.6 mm

Trade Compliance

SPBT2632C2A.AT2 Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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