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PSD854F2-90J

STMicroelectronics

PSD854F2-90J by STMicroelectronics

PSD854F2-90J by STMicroelectronics is a CMOS parallel I/O port with 27 I/O lines, operating b/w 4.5V and 5.5V. It features a compact square chip carrier package and supports commercial temp ranges up to 70 °C. Ideal for general-purpose applications requiring efficient data handling.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,827 parts In-Stock

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5,827

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Digiode

USA . 2,620 parts In-Stock

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-

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2,620

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Anansix

USA . 1,236 parts In-Stock

1+ parts

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1,236

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 108 parts In-Stock

1+ parts

$21.760

100+ parts

-

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108

$21.760

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IDEA Electronic Components Group

UK . 1,439 parts In-Stock

1+ parts

$32.396

100+ parts

-

1k+ parts

$29.156

10k+ parts

-

1,439

$32.396

-

$29.156

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MKK Technologies

India . 650 parts In-Stock

1+ parts

$60.918

100+ parts

-

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650

$60.918

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DigiPath Technology Company

USA . 650 parts In-Stock

1+ parts

$60.918

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-

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650

$60.918

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Corohmni

South Africa . 1,063 parts In-Stock

1+ parts

$80.445

100+ parts

-

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1,063

$80.445

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Component Stockers USA

USA . 796 parts In-Stock

1+ parts

$99.990

100+ parts

-

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796

$99.990

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Microchip USA

USA . 433 parts In-Stock

1+ parts

$114.018

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433

$114.018

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Parana Technologies

USA . 1,568 parts In-Stock

1+ parts

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100+ parts

$38.734

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1,568

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$38.734

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GreenTree Electronics

Israel . 575 parts In-Stock

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575

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A-Z Elektronik GmbH

Germany . 425 parts In-Stock

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425

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Corphita

USA . 259 parts In-Stock

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259

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Perfect Parts

USA . 6 parts In-Stock

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Overview

Unlock unmatched versatility with the PSD854F2-90J from STMicroelectronics, a leader in innovation. This premium parallel I/O port offers seamless integration into your projects, enabling efficient data transfer and control across various applications, from consumer electronics to industrial automation. With ST's commitment to quality and reliability, this device not only elevates performance but also ensures longevity and cost-effectiveness, making it the perfect choice for engineers seeking excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making the product reliable in various applications.

Surface Mount: YES

Surface mount technology allows for a more compact design and improved performance due to shorter electrical paths, making integration easier.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V offers flexibility for a wide range of applications without the risk of damaging the device.

Package Shape: SQUARE

The square package shape optimizes space on the circuit board, allowing for efficient layout and design.

Power Supplies (V): 5

Utilizing a 5V power supply is standard in many electronic devices, ensuring compatibility and ease of use.

No. of Terminals: 52

With 52 terminals available, this product can handle multiple connections, enhancing its versatility for various applications.

Package Style (Meter): CHIP CARRIER

The chip carrier package style provides excellent thermal performance and ease of handling during assembly.

Minimum Supply Voltage: 4.5 V

A minimum supply voltage requirement of 4.5 V allows for reliable operation in environments with slightly lower voltage supplies.

Maximum Operating Temperature: 70 °C

Operating up to 70 °C ensures the device can function in moderately high-temperature environments.

Minimum Operating Temperature: 0 °C

Starting operation from 0 °C ensures functionality in colder climates, expanding usability.

Terminal Finish: MATTE TIN

The matte tin finish enhances solderability and corrosion resistance, ensuring long-term reliability.

Ultraviolet Erasable: N

Being non-ultraviolet erasable simplifies the usage model and prevents accidental data loss in many applications.

Terminal Position: QUAD

Quad terminal position provides efficient space utilization on the PCB while maintaining optimal connectivity.

No. of Ports: 4

With four ports, this product allows for multiple parallel I/O operations simultaneously, improving overall system performance.

Maximum Seated Height: 4.57 mm

A low seated height allows for integration into space-constrained environments, providing design flexibility.

Width: 19.1 mm

The compact width ensures easy placement on PCB layouts, maximizing available space for other components.

Length: 19.1 mm

Similar length to width provides a symmetrical footprint, enhancing the aesthetic and functional layout of the PCB.

Temperature Grade: COMMERCIAL

Being rated for commercial temperature means it can reliably operate in a wide range of everyday environments.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

Its classification as a general-purpose parallel I/O port increases its versatility for a variety of electronics projects.

ROM Bits Size: 2097152 Bits

A ROM size of 2097152 bits ensures ample storage for data, enabling more complex functionalities in applications.

Technology: CMOS

Utilizing CMOS technology offers low power consumption and high performance, making it suitable for battery-operated devices.

Terminal Form: J BEND

J bend terminal form facilitates easy insertion and soldering, enhancing assembly efficiency.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V is standard in many digital circuits, simplifying design and integration.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm enables compatibility with a wide range of circuit boards, enhancing its adoption.

Maximum Standby Current: 0.0002 Amp

A very low standby current enhances energy efficiency, making it ideal for power-sensitive applications.

Maximum Access Time: 0.00000009 ns

Extremely fast access time allows for rapid data processing, improving the speed and efficiency of operations.

No. of I/O Lines: 27

With 27 I/O lines, this product offers significant data handling capabilities, making it suitable for complex tasks.

Technical Specifications

Parallel I/O Ports PSD854F2-90J attributes and parameters. Explore more Parallel I/O Ports devices from STMicroelectronics

Specs

Maximum Access Time:

.00000009 ns

JESD-30 Code:

S-PQCC-J52

JESD-609 Code:

e3

Length:

19.1 mm

No. of I/O Lines:

27

No. of Ports:

4

No. of Terminals:

52

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC52,.8SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

ROM Bits Size:

2097152 Bits

Maximum Seated Height:

4.57 mm

Maximum Standby Current:

.0002 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Width:

19.1 mm

Peripheral IC Type:

Trade Compliance

PSD854F2-90J Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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