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PSD853F2-90JI

STMicroelectronics

PSD853F2-90JI by STMicroelectronics

PSD853F2-90JI by STMicroelectronics is a versatile parallel I/O port with a max supply voltage of 5.5V and operates in extreme temperatures from -40 °C to 85°C. It features 27 I/O lines and offers fast access times, making it ideal for industrial applications. Its compact chip carrier design ensures efficient integration into various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,492 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,492

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-

-

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Digiode

USA . 3,115 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,115

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-

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Anansix

USA . 1,047 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

1,047

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 376 parts In-Stock

1+ parts

$10.950

100+ parts

-

1k+ parts

-

10k+ parts

-

376

$10.950

-

-

-

Microchip USA

USA . 133 parts In-Stock

1+ parts

$15.289

100+ parts

-

1k+ parts

-

10k+ parts

-

133

$15.289

-

-

-

Corohmni

South Africa . 895 parts In-Stock

1+ parts

$21.825

100+ parts

-

1k+ parts

-

10k+ parts

-

895

$21.825

-

-

-

IDEA Electronic Components Group

UK . 475 parts In-Stock

1+ parts

$44.535

100+ parts

-

1k+ parts

$40.082

10k+ parts

-

475

$44.535

-

$40.082

-

MKK Technologies

India . 1,345 parts In-Stock

1+ parts

$83.746

100+ parts

-

1k+ parts

-

10k+ parts

-

1,345

$83.746

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-

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DigiPath Technology Company

USA . 1,345 parts In-Stock

1+ parts

$83.746

100+ parts

-

1k+ parts

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10k+ parts

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1,345

$83.746

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Parana Technologies

USA . 1,864 parts In-Stock

1+ parts

-

100+ parts

$53.249

1k+ parts

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10k+ parts

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1,864

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$53.249

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Corphita

USA . 505 parts In-Stock

1+ parts

-

100+ parts

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505

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Overview

Unlock the potential of your designs with the PSD853F2-90JI from STMicroelectronics, a leader in innovation and reliability. This advanced parallel I/O port delivers exceptional performance for a variety of applications, ensuring seamless integration and superior functionality. With its robust temperature range and compact design, it’s perfect for industrial settings. Trust in STMicroelectronics’ legacy of quality to enhance your projects and drive success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and cost-effectiveness, making it suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology allows for compact designs and easier integration into modern electronic circuits.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V ensures compatibility with standard digital circuits, allowing for versatility in applications.

Package Shape: SQUARE

The square package shape facilitates space-efficient designs in PCB layouts, optimizing real estate on the board.

Power Supplies (V): 5

Supporting a nominal supply voltage of 5 V makes the product ideal for common electronic components, enhancing compatibility.

No. of Terminals: 52

With 52 terminals, this product offers ample connections for various peripherals, enhancing its utility in complex systems.

Package Style (Meter): CHIP CARRIER

The chip carrier style enables easier handling and mounting, simplifying the assembly process in manufacturing.

Minimum Supply Voltage: 4.5 V

A minimum supply voltage of 4.5 V allows for stable operation in a range of environments, promoting flexibility.

Maximum Operating Temperature: 85 °C

Operating at temperatures up to 85 °C ensures reliability in industrial applications where heat is a concern.

Minimum Operating Temperature: -40 °C

The ability to function at -40 °C makes this product suitable for extreme environments, enhancing its marketability.

Terminal Finish: MATTE TIN

Matte tin terminal finish offers excellent solderability and resistance to oxidation, ensuring long-term reliability.

Ultraviolet Erasable: N

Not being ultraviolet erasable indicates a focus on stability and permanence, which is advantageous for non-volatile applications.

Terminal Position: QUAD

Quad terminal positioning allows for efficient chip layout and signal integrity, crucial for high-speed data applications.

No. of Ports: 4

Four ports provide the necessary connectivity for multiple devices, ideal for systems requiring parallel data transfer.

Maximum Seated Height: 4.57 mm

A low maximum seated height helps conserve vertical space within confined electronic enclosures.

Width: 19.1 mm

A compact width of 19.1 mm allows for flexibility in design arrangements, promoting space-efficient layouts.

Length: 19.1 mm

With a length of 19.1 mm, the product maintains a compact form factor, which is optimal for modern electronic devices.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperatures ensures the product’s suitability for demanding environments and long-term use.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

As a general-purpose parallel I/O port, it supports a wide array of applications, enhancing its versatility.

ROM Bits Size: 1048576 Bits

A large ROM bit size allows for substantial data handling capabilities, which is beneficial for complex applications.

Technology: CMOS

CMOS technology offers low power consumption and high speed, making this product suitable for energy-efficient designs.

Terminal Form: J BEND

The J bend terminal form facilitates easier PCB insertion and enhances soldering quality, improving production efficiency.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 V aligns with many standard components, simplifying integration into existing systems.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for denser packing of components on PCBs, maximizing the use of available space.

Maximum Standby Current: 0.0002 Amp

A maximum standby current of 0.0002 A leads to minimized power consumption when not in active use, enhancing overall efficiency.

Maximum Access Time: 0.00000009 ns

An extremely low maximum access time ensures high performance for data transfer applications, making it suitable for speed-critical operations.

No. of I/O Lines: 27

With 27 I/O lines, this product supports extensive interfacing capabilities, catering to complex applications.

Technical Specifications

Parallel I/O Ports PSD853F2-90JI attributes and parameters. Explore more Parallel I/O Ports devices from STMicroelectronics

Specs

Maximum Access Time:

.00000009 ns

JESD-30 Code:

S-PQCC-J52

JESD-609 Code:

e3

Length:

19.1 mm

No. of I/O Lines:

27

No. of Ports:

4

No. of Terminals:

52

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC52,.8SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

ROM Bits Size:

1048576 Bits

Maximum Seated Height:

4.57 mm

Maximum Standby Current:

.0002 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Width:

19.1 mm

Peripheral IC Type:

Trade Compliance

PSD853F2-90JI Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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