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PSD835G2V-90U

STMicroelectronics

PSD835G2V-90U by STMicroelectronics

PSD835G2V-90U by STMicroelectronics is a versatile parallel I/O port with 52 I/O lines and operates at a nominal voltage of 3.3 V. It features a compact flatpack design, ideal for space-constrained applications. With a max temp of 70 °C and low standby current, it's perfect for commercial use.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,593 parts In-Stock

1+ parts

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6,593

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Digiode

USA . 2,350 parts In-Stock

1+ parts

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2,350

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Anansix

USA . 1,610 parts In-Stock

1+ parts

-

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1,610

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 59 parts In-Stock

1+ parts

$18.380

100+ parts

-

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-

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59

$18.380

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IDEA Electronic Components Group

UK . 2,080 parts In-Stock

1+ parts

$51.009

100+ parts

-

1k+ parts

$45.908

10k+ parts

-

2,080

$51.009

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$45.908

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Corohmni

South Africa . 1,248 parts In-Stock

1+ parts

$81.716

100+ parts

-

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1,248

$81.716

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MKK Technologies

India . 625 parts In-Stock

1+ parts

$95.920

100+ parts

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625

$95.920

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DigiPath Technology Company

USA . 625 parts In-Stock

1+ parts

$95.920

100+ parts

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10k+ parts

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625

$95.920

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QUARKTWIN TECHNOLOGY LTD

USA . 26,563 parts In-Stock

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26,563

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Microchip USA

USA . 5,083 parts In-Stock

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5,083

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Parana Technologies

USA . 1,930 parts In-Stock

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100+ parts

$60.990

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1,930

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$60.990

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Corphita

USA . 1,795 parts In-Stock

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1,795

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Overview

Unlock the potential of your next project with the PSD835G2V-90U by STMicroelectronics—where innovation meets reliability. Designed for seamless integration, this versatile parallel I/O port delivers exceptional performance in commercial applications while ensuring low power consumption. With STMicroelectronics' trusted quality, experience superior durability and efficiency, empowering your designs to excel in demanding environments. Elevate your technology with a partner committed to excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability and protects the internal components from environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and helps in achieving higher circuit density, ideal for modern electronic applications.

Maximum Supply Voltage: 3.6 V

This voltage specification ensures compatibility with many low-power devices, offering flexibility in application.

Package Shape: SQUARE

The square package shape aids in efficient space utilization on printed circuit boards (PCBs), optimizing layout efficiency.

Power Supplies (V): 3.3

Operating at 3.3V makes this device suitable for interfacing with a wide range of microcontrollers and digital logic circuits.

No. of Terminals: 80

Having 80 terminals provides ample connections for various pins, enhancing connectivity for complex applications.

Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH

The thin profile and fine pitch design facilitate easier mounting and soldering on PCBs, crucial for space-constrained environments.

Minimum Supply Voltage: 3 V

This characteristic increases power handling flexibility as it can operate effectively at lower voltage levels, suitable for battery-powered applications.

Maximum Operating Temperature: 70 °C

This temperature rating ensures reliable performance in moderately high-temperature environments, making it robust for industrial applications.

Minimum Operating Temperature: 0 °C

Starting from 0 °C allows this product to function effectively in standard ambient conditions, expanding its usability.

Terminal Finish: NICKEL PALLADIUM GOLD

This high-quality terminal finish guarantees excellent conductivity and corrosion resistance, enhancing the longevity of the connections.

Ultraviolet Erasable: N

Not being UV erasable makes this product suitable for applications requiring non-volatile memory, ensuring data integrity.

Terminal Position: QUAD

Quad terminal positioning offers a structured and efficient layout for multiple connection routes, aiding in optimized PCB design.

No. of Ports: 7

With 7 ports, this device provides flexibility for multiple parallel connections, enhancing its functionality in data transfers.

Maximum Seated Height: 1.2 mm

A low seated height allows this component to fit in compact spaces, catering to advanced miniature designs.

Width: 12 mm

The 12 mm width ensures a balance between space-saving and accessibility for handling and soldering.

Length: 12 mm

Similar to its width, the length contributes to compact design, essential for smaller electronic devices.

Temperature Grade: COMMERCIAL

This grade indicates reliability and performance suitable for consumer electronics, ensuring consistent quality.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

Being a general-purpose parallel I/O port makes this IC highly versatile for different applications, enhancing its practicality.

ROM Bits Size: 4456448 Bits

A large ROM size allows for ample storage capacity for data, beneficial for memory-intensive applications.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, making this device efficient and reliable.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and inspection, which is advantageous for manufacturing processes.

Nominal Supply Voltage: 3.3 V

This nominal voltage ensures optimal performance in low-power applications while maintaining compatibility with industry-standard components.

Terminal Pitch: 0.5 mm

A fine terminal pitch allows for higher density placements, ideal for compact electronic designs requiring numerous connections.

Maximum Standby Current: 0.0001 Amp

A very low standby current is indicative of energy efficiency, making it suitable for low-power applications and extending battery life.

Maximum Access Time: 0.00000009 ns

This ultra-fast access time enhances performance in high-speed applications, ensuring quick data transfers.

No. of I/O Lines: 52

With 52 I/O lines, the product supports extensive data communication capabilities, catering to complex interfacing needs.

Technical Specifications

Parallel I/O Ports PSD835G2V-90U attributes and parameters. Explore more Parallel I/O Ports devices from STMicroelectronics

Specs

Maximum Access Time:

.00000009 ns

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

No. of I/O Lines:

52

No. of Ports:

7

No. of Terminals:

80

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP80,.55SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Power Supplies (V):

3.3

Qualification:

Not Qualified

ROM Bits Size:

4456448 Bits

Maximum Seated Height:

1.2 mm

Maximum Standby Current:

.0001 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Width:

12 mm

Peripheral IC Type:

Trade Compliance

PSD835G2V-90U Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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