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PCA9506DGG

NXP Semiconductors

PCA9506DGG by NXP Semiconductors

PCA9506DGG by NXP Semiconductors is a 40-bit parallel I/O port with 2 ports, operating at supply voltages of 2.3-5.5V. This CMOS technology IC has a small outline package and is ideal for industrial applications requiring general-purpose parallel I/O functionality in a compact form factor.

Median Price

$3.280

Lifecycle Status

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1k+

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Verical

USA . 669 parts In-Stock

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Freelance Electronics

USA . 24 parts In-Stock

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$11.357

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Nova Conductors

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Cyclops Electronics Ltd

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CirComp Electronics, Inc.

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Touchstone Systems

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ComSIT Distribution GmbH

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AZTECH Wire

Italy . 523 parts In-Stock

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One Stop Electronics

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Aztec Data Supply Inc.

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Ampacity Inc.

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Advanced Electronics

New Zealand . 138 parts In-Stock

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$38.875

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Corohmni

South Africa . 560 parts In-Stock

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Overview

Unlock endless possibilities with the PCA9506DGG by NXP Semiconductors, a top-tier manufacturer known for its superior quality and innovation. This Parallel I/O Ports device offers unparalleled value and benefits, making it a game-changer in various applications. With 40 bits, dual terminal position, and industrial-grade technology, this product opens up a world of opportunities for your projects. Trust NXP Semiconductors to deliver excellence, reliability, and cutting-edge solutions for all your electronic needs. Elevate your designs with the PCA9506DGG today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to external elements, making this product suitable for various environments.

Surface Mount: YES

Being surface mountable makes this product easy to install on printed circuit boards, saving space and improving overall design aesthetics.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this product can handle a wide range of power input, providing flexibility in voltage requirements.

No. of Bits: 40

The high number of bits allows for complex data processing and communication, making this product suitable for advanced applications.

Minimum Operating Temperature: -40 °C

The wide operating temperature range allows this product to be used in extreme temperature conditions without compromising performance.

Technology: CMOS

The use of CMOS technology ensures low power consumption and high noise immunity, making this product efficient and reliable for long-term use.

No. of I/O Lines: 8

With 8 I/O lines, this product can handle multiple inputs and outputs, allowing for versatile connectivity options in various applications.

Technical Specifications

Parallel I/O Ports PCA9506DGG attributes and parameters. Explore more Parallel I/O Ports devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G56

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Bits:

40

No. of I/O Lines:

8

No. of Ports:

2

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP56,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Parallel IO Port

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6.1 mm

Peripheral IC Type:

Trade Compliance

PCA9506DGG Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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