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PCF8575TS

NXP Semiconductors

PCF8575TS by NXP Semiconductors

PCF8575TS by NXP Semiconductors is a 16-bit parallel I/O port with supply voltage range of 2.5-5.5V, ideal for industrial applications. It features 24 terminals in a small outline package, operating temperature from -40 to 85°C, and CMOS technology for reliable performance.

Median Price

$9.245

Lifecycle Status

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35

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Freelance Electronics

USA . 25 parts In-Stock

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$9.245

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One Stop Electronics

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AZTECH Wire

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Aztec Data Supply Inc.

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India . 467 parts In-Stock

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Corohmni

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Overview

Experience the superior quality and reliability of NXP Semiconductors with the PCF8575TS Parallel I/O Ports. This versatile component offers endless possibilities for your industrial applications, providing seamless connectivity and control. With a wide operating temperature range and advanced CMOS technology, this product ensures optimal performance in any environment. Trust NXP Semiconductors to deliver cutting-edge solutions that exceed expectations. Elevate your projects with the PCF8575TS - where innovation meets excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, making the product long-lasting and reliable.

Maximum Supply Voltage: 5.5 V

Allows for flexibility in power supply options and compatibility with a wide range of devices.

No. of Bits: 16

High number of bits allows for versatile and precise input/output operations.

Minimum Operating Temperature: -40 °C

Can operate in extreme low temperatures, making it suitable for a variety of environments and applications.

No. of Ports: 2

Multiple ports allow for increased connectivity and simultaneous data transfer.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

General purpose peripheral IC type provides flexibility and adaptability for various uses.

Technical Specifications

Parallel I/O Ports PCF8575TS attributes and parameters. Explore more Parallel I/O Ports devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

8.2 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

16

No. of I/O Lines:

16

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP24,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Parallel IO Port

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.5 V

Nominal Supply Voltage:

2.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

5.3 mm

Peripheral IC Type:

Trade Compliance

PCF8575TS Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-579-9998, 5962015799998

NIIN

015799998

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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