Loading...

PSD813F2VA-20MI

STMicroelectronics

PSD813F2VA-20MI by STMicroelectronics

PSD813F2VA-20MI by STMicroelectronics is a CMOS parallel I/O port with 27 I/O lines, operating b/w 3V and 3.6V. It features a compact square package (10mm x 10mm) and supports industrial applications with a max temp of 85 °C. Ideal for general-purpose interfacing in embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,717 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,717

-

-

-

-

Digiode

USA . 3,567 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,567

-

-

-

-

Anansix

USA . 2,346 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,346

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 259 parts In-Stock

1+ parts

$11.610

100+ parts

-

1k+ parts

-

10k+ parts

-

259

$11.610

-

-

-

Microchip USA

USA . 412 parts In-Stock

1+ parts

$30.965

100+ parts

-

1k+ parts

-

10k+ parts

-

412

$30.965

-

-

-

IDEA Electronic Components Group

UK . 34 parts In-Stock

1+ parts

$33.777

100+ parts

-

1k+ parts

$30.399

10k+ parts

-

34

$33.777

-

$30.399

-

Corohmni

South Africa . 3,016 parts In-Stock

1+ parts

$51.320

100+ parts

-

1k+ parts

-

10k+ parts

-

3,016

$51.320

-

-

-

MKK Technologies

India . 875 parts In-Stock

1+ parts

$63.515

100+ parts

-

1k+ parts

-

10k+ parts

-

875

$63.515

-

-

-

DigiPath Technology Company

USA . 875 parts In-Stock

1+ parts

$63.515

100+ parts

-

1k+ parts

-

10k+ parts

-

875

$63.515

-

-

-

Component Stockers USA

USA . 367 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

-

10k+ parts

-

367

$99.990

-

-

-

Corphita

USA . 2,676 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,676

-

-

-

-

Parana Technologies

USA . 1,559 parts In-Stock

1+ parts

-

100+ parts

$40.385

1k+ parts

-

10k+ parts

-

1,559

-

$40.385

-

-

Kepictronics

USA . 200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

200

-

-

-

-

Overview

Unlock innovation and reliability with the PSD813F2VA-20MI from STMicroelectronics, a leader in semiconductor solutions. Designed for demanding industrial applications, this versatile parallel I/O port excels in performance while ensuring energy efficiency with low voltage operation. Experience seamless integration and robust functionality that elevate your projects to new heights—perfect for automation, telecommunications, and beyond. Trust in STMicroelectronics for quality that powers your success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures a lightweight and durable package, making it suitable for various applications.

Surface Mount: YES

Surface mount technology provides a smaller footprint and enhances device performance, ideal for space-constrained designs.

Maximum Supply Voltage: 3.6 V

The relatively low maximum supply voltage allows for safe usage in sensitive electronic systems.

Package Shape: SQUARE

The square shape provides uniformity in spacing, aiding in effective layout and soldering processes.

Power Supplies (V): 3.3

Designed for compatibility with 3.3 V power sources, aligning with modern digital circuits.

No. of Terminals: 52

A higher number of terminals allows for increased connectivity and functionality, making it suitable for sophisticated applications.

Package Style (Meter): FLATPACK

The flatpack style is beneficial for easing the mounting process and improving thermal performance.

Minimum Supply Voltage: 3 V

The minimum supply voltage of 3 V ensures reliable operation in a variety of low-power situations.

Maximum Operating Temperature: 85 °C

Withstanding high temperatures makes this product suitable for industrial environments with varying thermal conditions.

Minimum Operating Temperature: -40 °C

This wide temperature range makes it adaptable for harsh and extreme conditions.

Ultraviolet Erasable: N

Having no ultraviolet erasability simplifies the manufacturing process and reduces potential failure points.

Terminal Position: QUAD

Quad terminal positioning enhances electrical performance by reducing inductance and improving signal integrity.

No. of Ports: 4

Multiple ports enable versatile and efficient data handling, increasing the product's utility in various applications.

Maximum Seated Height: 2.35 mm

A low profile design benefits designs requiring compact components, maintaining space efficiency.

Width: 10 mm

A standard width facilitates integration into a wide range of circuit boards and applications.

Length: 10 mm

The uniform length helps maintain a consistent layout, simplifying PCB design processes.

Temperature Grade: INDUSTRIAL

An industrial temperature grade ensures reliability and performance in demanding environments.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

Being a general-purpose parallel I/O port allows flexibility in various application scenarios.

ROM Bits Size: 1310720 Bits

A sizeable ROM allows for extensive programming and functionality, enhancing product capabilities.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, which is beneficial for battery-operated devices.

Terminal Form: GULL WING

Gull-wing terminals provide excellent soldering surface, enhancing reliability and facilitating manufacturing.

Nominal Supply Voltage: 3.3 V

Operating at a nominal voltage of 3.3 V aligns with the requirements of most modern digital systems.

Terminal Pitch: 0.65 mm

A 0.65 mm terminal pitch allows for high density in circuit board design, maximizing space usage.

Maximum Standby Current: 0.0001 Amp

The extremely low standby current minimizes power consumption during idle states, increasing energy efficiency.

Maximum Access Time: 0.0000002 ns

Ultra-fast access time enhances performance in high-speed applications, improving overall system throughput.

No. of I/O Lines: 27

A generous number of I/O lines facilitates complex data handling and connection to multiple peripherals.

Technical Specifications

Parallel I/O Ports PSD813F2VA-20MI attributes and parameters. Explore more Parallel I/O Ports devices from STMicroelectronics

Specs

Maximum Access Time:

.0000002 ns

JESD-30 Code:

S-PQFP-G52

Length:

10 mm

No. of I/O Lines:

27

No. of Ports:

4

No. of Terminals:

52

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP52,.52SQ

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

3.3

Qualification:

Not Qualified

ROM Bits Size:

1310720 Bits

Maximum Seated Height:

2.35 mm

Maximum Standby Current:

.0001 Amp

Sub-Category:

Other uPs/uCs/Peripheral ICs

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Width:

10 mm

Peripheral IC Type:

Trade Compliance

PSD813F2VA-20MI Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20