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PSD813F2A-70J

STMicroelectronics

PSD813F2A-70J by STMicroelectronics

PSD813F2A-70J by STMicroelectronics is a CMOS parallel I/O port with 27 I/O lines, operating b/w 4.5V and 5.5V. It features a compact square package (19.1mm) and supports max access time of 70ns, ideal for general-purpose applications in commercial environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,641 parts In-Stock

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Anansix

USA . 2,637 parts In-Stock

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2,637

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Vyrian

USA . 2,276 parts In-Stock

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2,276

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Prism Electronics

USA . 4 parts In-Stock

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 197 parts In-Stock

1+ parts

$10.929

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197

$10.929

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AZTECH Wire

Italy . 594 parts In-Stock

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$17.450

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594

$17.450

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Corohmni

South Africa . 1,133 parts In-Stock

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$19.170

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$19.170

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IDEA Electronic Components Group

UK . 218 parts In-Stock

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$66.350

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$59.715

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218

$66.350

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$59.715

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MKK Technologies

India . 1,002 parts In-Stock

1+ parts

$124.768

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1,002

$124.768

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DigiPath Technology Company

USA . 1,002 parts In-Stock

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$124.768

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$124.768

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Corphita

USA . 4,105 parts In-Stock

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4,105

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Parana Technologies

USA . 1,894 parts In-Stock

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$79.332

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$79.332

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Perfect Parts

USA . 4 parts In-Stock

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Overview

Unlock endless possibilities with the PSD813F2A-70J from STMicroelectronics, a leader in semiconductor innovation. Designed for seamless integration in diverse applications, this versatile parallel I/O port boasts unmatched reliability and efficiency, making it ideal for consumer electronics, automotive, and industrial systems. Experience superior performance, energy savings, and ease of use, empowering your designs to reach new heights of quality and functionality. Elevate your projects with ST's commitment to excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy construction provides durability and resistance to various environmental factors, making it a reliable choice for diverse applications.

Surface Mount: YES

Surface mount technology allows for efficient space utilization on circuit boards, enabling compact designs and ease of manufacturing.

Maximum Supply Voltage: 5.5 V

A maximum voltage of 5.5 V ensures compatibility with a wide range of systems without the risk of damaging the component.

Package Shape: SQUARE

The square package shape facilitates easier placement on PCB layouts, leading to better thermal performance and reduced risk of error in soldering.

Power Supplies (V): 5

Operating at a standard 5V power supply simplifies integration with common digital circuits and peripherals.

No. of Terminals: 52

With 52 terminals, this product offers ample connectivity options, making it suitable for complex applications requiring multiple I/O connections.

Package Style (Meter): CHIP CARRIER

Chip carrier packaging allows for better heat dissipation, which is crucial for maintaining performance during extended operation.

Minimum Supply Voltage: 4.5 V

The low minimum voltage requirement ensures reliable operation while being energy efficient, which is beneficial in battery-powered applications.

Maximum Operating Temperature: 70 °C

Operating at temperatures up to 70 °C makes this component suitable for various commercial environments, enhancing its versatility.

Minimum Operating Temperature: 0 °C

A minimum operating temperature of 0 °C ensures reliable performance in a wide range of thermal conditions.

Ultraviolet Erasable: N

Not being ultraviolet erasable is typical for CMOS technology, which is beneficial for applications requiring stable and long-term data retention.

Terminal Position: QUAD

The quad terminal position allows for efficient and organized connections, reducing the chance of errors during installation.

No. of Ports: 4

With 4 ports available, this product can handle multiple simultaneous connections, making it ideal for multitasking applications.

Maximum Seated Height: 4.57 mm

The low seated height allows for better integration into compact electronic devices without compromising performance.

Width: 19.1 mm

A width of 19.1 mm strikes a balance between enough space for terminals and compact design, making it versatile for many applications.

Length: 19.1 mm

Similar to the width, the length of 19.1 mm ensures that the component fits well into tight spaces while maintaining strong connectivity.

Temperature Grade: COMMERCIAL

Being rated for commercial temperature ranges means it is suitable for everyday applications, enhancing its usage in various products.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

As a general-purpose parallel I/O port, this IC can be applied flexibly across numerous applications, increasing its utility.

ROM Bits Size: 1310720 Bits

A significant ROM size ensures that enough data can be stored, enabling more complex applications that require large data handling.

Technology: CMOS

Utilizing CMOS technology offers advantages such as low power consumption and high noise immunity, making it suitable for modern electronic systems.

Terminal Form: J BEND

J bend terminals simplify the soldering process and improve the mechanical stability of the connections, ensuring reliable operation over time.

Nominal Supply Voltage: 5 V

Operating at a nominal 5V ensures compatibility with a wide range of other electronic components, making integration straightforward.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm provides a compact but manageable space for connections, facilitating efficient PCB design.

Maximum Standby Current: 0.0002 Amp

A very low maximum standby current ensures energy efficiency, which is especially important in battery-operated devices.

Maximum Access Time: 0.00000007 ns

Ultra-fast access time enhances overall performance and responsiveness, making it suitable for high-speed applications.

No. of I/O Lines: 27

Offering 27 I/O lines allows for extensive data exchange capabilities, supporting sophisticated communication needs in complex systems.

Technical Specifications

Parallel I/O Ports PSD813F2A-70J attributes and parameters. Explore more Parallel I/O Ports devices from STMicroelectronics

Specs

Maximum Access Time:

.00000007 ns

JESD-30 Code:

S-PQCC-J52

Length:

19.1 mm

No. of I/O Lines:

27

No. of Ports:

4

No. of Terminals:

52

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC52,.8SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

ROM Bits Size:

1310720 Bits

Maximum Seated Height:

4.57 mm

Maximum Standby Current:

.0002 Amp

Sub-Category:

Other uPs/uCs/Peripheral ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Width:

19.1 mm

Peripheral IC Type:

Trade Compliance

PSD813F2A-70J Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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