Loading...

PSD401A1-C-15J

STMicroelectronics

PSD401A1-C-15J by STMicroelectronics

PSD401A1-C-15J by STMicroelectronics is a CMOS parallel I/O port with 40 I/O lines, operating b/w 4.5V and 5.5V. It features a compact square chip carrier package and supports commercial temperature ranges up to 70 °C. Ideal for general-purpose applications, it ensures efficient data handling in electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,453 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,453

-

-

-

-

Vyrian

USA . 1,560 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,560

-

-

-

-

Anansix

USA . 526 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

526

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,348 parts In-Stock

1+ parts

$21.108

100+ parts

-

1k+ parts

$18.997

10k+ parts

-

1,348

$21.108

-

$18.997

-

MKK Technologies

India . 574 parts In-Stock

1+ parts

$39.691

100+ parts

-

1k+ parts

-

10k+ parts

-

574

$39.691

-

-

-

DigiPath Technology Company

USA . 574 parts In-Stock

1+ parts

$39.691

100+ parts

-

1k+ parts

-

10k+ parts

-

574

$39.691

-

-

-

Corphita

USA . 2,593 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,593

-

-

-

-

Parana Technologies

USA . 1,790 parts In-Stock

1+ parts

-

100+ parts

$25.237

1k+ parts

-

10k+ parts

-

1,790

-

$25.237

-

-

Overview

Unlock the potential of your projects with the PSD401A1-C-15J from STMicroelectronics—a leader in quality and innovation. This versatile parallel I/O port enhances operational efficiency, ensuring reliable performance across a variety of applications, from consumer electronics to industrial automation. With its compact design and robust functionalities, you can streamline your designs while reducing overhead costs, making it the ideal choice for engineers seeking excellence and value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures long-lasting performance and reliability in various environments.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient use of board space, making it ideal for modern electronic applications.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V provides flexibility in application design and compatibility with a wide range of systems.

Package Shape: SQUARE

The square package shape facilitates easy integration into PCB layouts, optimizing space and improving thermal performance.

Power Supplies (V): 5

Operating at a nominal power supply of 5 V aligns with standard digital circuits, ensuring compatibility and ease of use.

No. of Terminals: 68

With 68 terminals, this device can support a higher number of connections, enabling comprehensive interfacing capabilities.

Package Style (Meter): CHIP CARRIER

The chip carrier style enhances thermal management and reduces parasitic capacitance, improving device performance.

Minimum Supply Voltage: 4.5 V

The minimum supply voltage of 4.5 V allows for a broader operational range, accommodating various power supply designs.

Maximum Operating Temperature: 70 °C

The operational temperature of up to 70 °C ensures reliable performance in high-temperature environments, suitable for industrial applications.

Minimum Operating Temperature: 0 °C

Starting from 0 °C makes the device viable for uses in standard and colder environments, extending its application range.

Terminal Finish: TIN LEAD

Tin-lead terminals provide excellent solderability and reliability, which is crucial for maintaining good electrical connections.

Ultraviolet Erasable: N

Not being ultraviolet erasable simplifies the design and reduces the risks associated with unintended erasure, enhancing data security.

Terminal Position: QUAD

The quad terminal positioning allows for efficient routing and easier board layout, beneficial for high-density applications.

No. of Ports: 5

Having 5 parallel I/O ports maximizes data transfer capability, making this product suitable for high-bandwidth applications.

Maximum Seated Height: 4.57 mm

The low seated height enables space-saving designs in compact electronic systems.

Width: 24.18 mm

This compact width allows for efficient layout in dense circuit boards, making it a smart choice for various designs.

Length: 24.18 mm

The length mirrors the width, maintaining a square profile that supports easy integration into existing designs.

Temperature Grade: COMMERCIAL

Rated for commercial temperature ranges, this device can be used in a variety of everyday applications.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

Versatility as a general-purpose parallel I/O port makes it adaptable for numerous applications, from simple to complex.

ROM Bits Size: 262144 Bits

A ROM size of 262144 bits allows for significant data storage, suitable for applications requiring substantial firmware.

Technology: CMOS

CMOS technology is energy efficient and offers high noise immunity, enhancing the overall reliability of the product.

Terminal Form: J BEND

The J bend terminal design simplifies assembly and improves connection stability during operation.

Nominal Supply Voltage: 5 V

Operation at a nominal voltage of 5 V is standard for most logic devices, ensuring ease of integration with existing systems.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch allows for tighter layouts and efficient board space utilization in modern electronic designs.

Maximum Standby Current: 0.00004 Amp

A low maximum standby current ensures that the device is energy efficient, contributing to overall system power saving.

Maximum Access Time: 0.00000015 ns

With an extremely rapid access time, this device meets the demands of high-speed applications and data processing.

No. of I/O Lines: 40

The presence of 40 I/O lines supports extensive interfacing capabilities, making it suitable for complex peripherals and devices.

Technical Specifications

Parallel I/O Ports PSD401A1-C-15J attributes and parameters. Explore more Parallel I/O Ports devices from STMicroelectronics

Specs

Maximum Access Time:

.00000015 ns

JESD-30 Code:

S-PQCC-J68

JESD-609 Code:

e0

Length:

24.18 mm

No. of I/O Lines:

40

No. of Ports:

5

No. of Terminals:

68

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

ROM Bits Size:

262144 Bits

Maximum Seated Height:

4.57 mm

Maximum Standby Current:

.00004 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Width:

24.18 mm

Peripheral IC Type:

Trade Compliance

PSD401A1-C-15J Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20