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PSD401A1-C-12J

STMicroelectronics

PSD401A1-C-12J by STMicroelectronics

PSD401A1-C-12J by STMicroelectronics is a CMOS parallel I/O port with 40 I/O lines, operating b/w 4.5V and 5.5V. It features a compact square chip carrier package and supports commercial temperature ranges up to 70 °C. Ideal for general-purpose applications requiring efficient data handling.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,877 parts In-Stock

1+ parts

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4,877

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Anansix

USA . 1,068 parts In-Stock

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1,068

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Digiode

USA . 282 parts In-Stock

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282

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 268 parts In-Stock

1+ parts

$42.185

100+ parts

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268

$42.185

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IDEA Electronic Components Group

UK . 1,917 parts In-Stock

1+ parts

$75.747

100+ parts

-

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$68.173

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1,917

$75.747

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$68.173

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MKK Technologies

India . 1,157 parts In-Stock

1+ parts

$142.438

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1,157

$142.438

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DigiPath Technology Company

USA . 1,157 parts In-Stock

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$142.438

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1,157

$142.438

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Corphita

USA . 1,847 parts In-Stock

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1,847

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Parana Technologies

USA . 1,410 parts In-Stock

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$90.567

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1,410

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$90.567

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Overview

Elevate your designs with the PSD401A1-C-12J from STMicroelectronics, a trusted leader in innovative technology. This versatile parallel I/O port offers unmatched reliability and performance, enabling seamless integration into a variety of applications—from consumer electronics to industrial systems. With its compact design and efficient power management, it delivers exceptional value, ensuring your projects run smoothly while reducing time-to-market. Choose quality, choose ST!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The sturdy plastic/epoxy material ensures durability and protection against environmental factors.

Surface Mount: YES

The surface mount design allows for compact PCB layouts and efficient space utilization.

Maximum Supply Voltage: 5.5 V

A higher maximum supply voltage offers flexibility in power management and compatibility with various systems.

Package Shape: SQUARE

The square shape facilitates easy integration and symmetrical mounting on circuit boards.

Power Supplies (V): 5

Operating at a standard 5V supply makes this product widely compatible with most electronics.

No. of Terminals: 68

With 68 terminals, this product supports versatile connections and enhanced functionality.

Package Style (Meter): CHIP CARRIER

The chip carrier style is designed for effective heat dissipation and ease of handling.

Minimum Supply Voltage: 4.5 V

A lower minimum supply voltage requirement allows the product to operate in various low-power applications.

Maximum Operating Temperature: 70 °C

High temperature tolerance ensures reliability in demanding environments.

Minimum Operating Temperature: 0 °C

This wide operating temperature range allows for applications in diverse environments.

Terminal Finish: TIN LEAD

Tin lead finish enhances solderability and provides good electrical conductivity.

Ultraviolet Erasable: N

Not being UV erasable simplifies operations, making design requirements straightforward.

Terminal Position: QUAD

The quad terminal position increases accessibility and simplifies routing on PCB designs.

No. of Ports: 5

Multiple ports enable simultaneous connections to various devices, enhancing system capability.

Maximum Seated Height: 4.57 mm

A low seated height supports compact design and integration into space-constrained applications.

Width: 24.18 mm

Standard width allows for compatibility with standard PCB layouts and placements.

Length: 24.18 mm

Consistent length complements various mounting configurations for ease of integration.

Temperature Grade: COMMERCIAL

Designed for commercial applications, ensuring reliability and consistent performance.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

As a general-purpose parallel I/O port, it provides flexibility for a wide range of applications.

ROM Bits Size: 262144 Bits

Substantial ROM size supports complex applications requiring significant data storage.

Technology: CMOS

The CMOS technology enhances power efficiency, reducing overall energy consumption.

Terminal Form: J BEND

J bend terminals make for easy mounting and improved stability on PCBs.

Nominal Supply Voltage: 5 V

At a nominal supply of 5V, it ensures reliable operation across a range of devices.

Terminal Pitch: 1.27 mm

Standard terminal pitch allows for compatibility with a wide range of connectors and sockets.

Maximum Standby Current: 0.00004 Amp

Low standby current enhances energy efficiency, making it suitable for battery-operated devices.

Maximum Access Time: 0.00000012 ns

Ultra-fast access time enables rapid data processing, making it ideal for high-speed applications.

No. of I/O Lines: 40

With 40 I/O lines, this product offers extensive connectivity for multiple peripherals.

Technical Specifications

Parallel I/O Ports PSD401A1-C-12J attributes and parameters. Explore more Parallel I/O Ports devices from STMicroelectronics

Specs

Maximum Access Time:

.00000012 ns

JESD-30 Code:

S-PQCC-J68

JESD-609 Code:

e0

Length:

24.18 mm

No. of I/O Lines:

40

No. of Ports:

5

No. of Terminals:

68

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

ROM Bits Size:

262144 Bits

Maximum Seated Height:

4.57 mm

Maximum Standby Current:

.00004 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Width:

24.18 mm

Peripheral IC Type:

Trade Compliance

PSD401A1-C-12J Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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