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PSD401A1-70J

STMicroelectronics

PSD401A1-70J by STMicroelectronics

PSD401A1-70J by STMicroelectronics is a CMOS parallel I/O port with 40 I/O lines, operating b/w 4.5V and 5.5V. It features a compact square chip carrier package and supports commercial temperature ranges up to 70 °C. Ideal for general-purpose applications, it ensures efficient data handling in electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,087 parts In-Stock

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4,087

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Anansix

USA . 1,186 parts In-Stock

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1,186

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Vyrian

USA . 728 parts In-Stock

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728

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,039 parts In-Stock

1+ parts

$31.244

100+ parts

-

1k+ parts

$28.120

10k+ parts

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1,039

$31.244

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$28.120

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MKK Technologies

India . 338 parts In-Stock

1+ parts

$58.753

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338

$58.753

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DigiPath Technology Company

USA . 338 parts In-Stock

1+ parts

$58.753

100+ parts

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338

$58.753

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Corphita

USA . 4,154 parts In-Stock

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4,154

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Parana Technologies

USA . 2,040 parts In-Stock

1+ parts

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$37.357

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2,040

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$37.357

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Overview

Unlock the potential of your projects with the PSD401A1-70J from STMicroelectronics. Renowned for its cutting-edge technology and unwavering quality, this versatile parallel I/O port chip enhances performance across various applications—from consumer electronics to industrial automation. Benefit from its robust design, ensuring reliability and efficiency, all while enjoying seamless integration into your systems. Elevate your designs with a trusted partner in innovation!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and easier integration into modern circuit boards, saving space and improving performance.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V provides flexibility in powering the device from different sources, while maintaining safety standards.

Package Shape: SQUARE

The square package shape facilitates uniform mounting and efficient space utilization on PCBs, leading to potentially lower manufacturing costs.

Power Supplies (V): 5

Being compatible with a standard 5 V power supply makes it easy to integrate with commonly used devices in consumer electronics.

No. of Terminals: 68

A higher number of terminals allows for more connections and functionalities, enabling complex communications and data transfers.

Package Style (Meter): CHIP CARRIER

Chip carrier package style supports efficient heat dissipation and enhances electrical performance, which is critical for high-speed applications.

Minimum Supply Voltage: 4.5 V

With a minimum supply voltage of 4.5 V, this product can operate efficiently under a variety of conditions, ensuring reliability.

Maximum Operating Temperature: 70 °C

Operating at temperatures up to 70 °C ensures that this product can function effectively in warmer environments, broadening its application scope.

Minimum Operating Temperature: 0 °C

A minimum operating temperature of 0 °C allows for functionality in cool environments, making this product versatile for diverse applications.

Terminal Finish: TIN LEAD

Tin-lead terminal finish ensures good solderability and durability, which is important for reliable connections.

Ultraviolet Erasable: N

Not being ultraviolet erasable may enhance stability and reliability, focusing on solid state and long-lasting performance.

Terminal Position: QUAD

Quad terminal position allows for effective space distribution on the PCB, enhancing layout design flexibility.

No. of Ports: 5

Having five ports enables expanded connectivity and data handling capabilities for various applications.

Maximum Seated Height: 4.57 mm

A low maximum seated height allows for compact designs in devices, making it suitable for space-constrained applications.

Width: 24.2316 mm

The specific width supports integration into standard PCB footprints, making it easier to source and design around.

Length: 24.2316 mm

Consistent length dimensions offers compatibility with existing PCB designs, ensuring a seamless design process.

Temperature Grade: COMMERCIAL

Commercial temperature grade indicates this product is suitable for use in a wide range of everyday applications.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

Being a general-purpose parallel I/O port allows flexibility for multiple applications, making it a versatile choice for developers.

ROM Bits Size: 256 Bits

256 bits of ROM provides sufficient storage for basic functions and firmware, optimizing performance without occupying too much space.

Technology: CMOS

CMOS technology ensures low power consumption and high-speed performance, ideal for efficient and modern electronic devices.

Terminal Form: J BEND

J bend terminal form allows for easy manual handling during assembly and ensures secure connections.

Nominal Supply Voltage: 5 V

Standard 5 V nominal supply voltage is widely supported, enhancing compatibility with various systems and devices.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm facilitates higher density placement on PCBs, making this product suitable for compact designs.

Maximum Standby Current: 0.00002 Amp

Extremely low maximum standby current helps conserve power, making it an eco-friendly option for battery-operated devices.

Maximum Access Time: 0.00000007 ns

Ultra-fast maximum access time ensures quick data retrieval and processing, making it highly efficient for high-speed applications.

No. of I/O Lines: 40

With 40 I/O lines, this product supports extensive input and output operations, enabling complex applications and improved functionality.

Technical Specifications

Parallel I/O Ports PSD401A1-70J attributes and parameters. Explore more Parallel I/O Ports devices from STMicroelectronics

Specs

Maximum Access Time:

.00000007 ns

Additional Features:

GENERAL PURPOSE ZPLD

JESD-30 Code:

S-PQCC-J68

JESD-609 Code:

e0

Length:

24.2316 mm

No. of I/O Lines:

40

No. of Ports:

5

No. of Terminals:

68

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

ROM Bits Size:

256 Bits

Maximum Seated Height:

4.57 mm

Maximum Standby Current:

.00002 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Width:

24.2316 mm

Peripheral IC Type:

Trade Compliance

PSD401A1-70J Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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