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PSD401A1-70LI

STMicroelectronics

PSD401A1-70LI by STMicroelectronics

PSD401A1-70LI by STMicroelectronics is a CMOS parallel I/O port with 40 I/O lines, operating b/w 4.5V and 5.5V. It features a ceramic, metal-sealed package and supports industrial applications with a temp range of -40 °C to 85°C. Ideal for general-purpose interfacing in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,227 parts In-Stock

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3,227

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Anansix

USA . 1,931 parts In-Stock

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1,931

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Vyrian

USA . 387 parts In-Stock

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387

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 24 parts In-Stock

1+ parts

$54.080

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24

$54.080

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IDEA Electronic Components Group

UK . 1,050 parts In-Stock

1+ parts

$62.441

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$56.197

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1,050

$62.441

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$56.197

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MKK Technologies

India . 2,008 parts In-Stock

1+ parts

$117.417

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2,008

$117.417

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DigiPath Technology Company

USA . 2,008 parts In-Stock

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$117.417

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2,008

$117.417

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Corphita

USA . 4,158 parts In-Stock

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4,158

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Parana Technologies

USA . 178 parts In-Stock

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$74.658

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178

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$74.658

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Overview

Unlock the potential of your designs with the PSD401A1-70LI from STMicroelectronics—a leader in semiconductor innovation. This robust parallel I/O port seamlessly integrates into a variety of applications, enhancing performance while ensuring reliability in harsh environments. With its durable ceramic and metal-sealed package, you benefit from superior thermal management. Trust STMicroelectronics for quality that drives your projects forward, delivering unmatched value and efficiency.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The durable ceramic and metal-sealed co-fired package body enhances reliability and protects the internal components from environmental factors, making it suitable for industrial applications.

Surface Mount: YES

The surface-mount design allows for efficient assembly and reduced space requirements on printed circuit boards, making integration easier in modern electronics.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5V, this product is suitable for a wide range of applications without risking damage to the device.

Package Shape: SQUARE

The square package shape optimizes layout flexibility on PCB designs, allowing for efficient use of space while maintaining functionality.

No. of Terminals: 68

A higher number of terminals facilitates more connections and greater functionality, allowing for versatile use in various applications.

Package Style (Meter): CHIP CARRIER, WINDOW

The chip carrier with a window provides visibility for inspection or for utilizing optical technologies, enhancing usability in certain applications.

Minimum Supply Voltage: 4.5 V

A minimum supply voltage of 4.5V allows for lower power consumption applications, thereby extending battery life in portable devices.

Maximum Operating Temperature: 85 °C

The capability to operate at high temperatures (up to 85 °C) makes this product suitable for harsh environments, ensuring dependable performance.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this device is ideal for applications in extreme cold conditions, ensuring reliable performance in diverse climates.

Terminal Position: QUAD

The quad terminal position provides a compact layout and enhances signal integrity, making it easier to manage connections in complex designs.

No. of Ports: 5

Having 5 ports allows for multiple simultaneous connections, enhancing versatility and reducing the need for additional components.

Maximum Seated Height: 4.57 mm

A low seated height of 4.57 mm contributes to compact designs, maintaining a low profile in applications where space is a premium.

Width: 24.105 mm

The specific width of 24.105 mm is designed to align with standard PCB layouts, facilitating easier design integration.

Length: 24.105 mm

A length of 24.105 mm matches its width, reinforcing its square shape which improves thermal dissipation and uniformity in mounting.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature grade, this product provides reliability in demanding applications and environments, ensuring long-term operation.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

This peripheral IC design enhances its adaptability for various communication tasks, making it suitable for general-purpose applications in numerous industries.

Technology: CMOS

Utilizing CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient while ensuring reliable performance.

Terminal Form: J BEND

The J bend terminal form provides secure mechanical attachment to PCBs, enhancing stability and reliability in connectivity.

Nominal Supply Voltage: 5 V

With a nominal supply voltage of 5V, this component aligns well with standard logic levels, ensuring compatibility with a wide variety of devices.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for closer spacing between connections, which can help to minimize space and optimize board layout.

No. of I/O Lines: 40

Having 40 I/O lines provides ample communication pathways, supporting complex operations and enabling robust data transfer for various applications.

Technical Specifications

Parallel I/O Ports PSD401A1-70LI attributes and parameters. Explore more Parallel I/O Ports devices from STMicroelectronics

Specs

JESD-30 Code:

S-CQCC-J68

Length:

24.105 mm

No. of I/O Lines:

40

No. of Ports:

5

No. of Terminals:

68

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, WINDOW

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

24.105 mm

Peripheral IC Type:

Trade Compliance

PSD401A1-70LI Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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