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PSD401A1-15LI

STMicroelectronics

PSD401A1-15LI by STMicroelectronics

PSD401A1-15LI by STMicroelectronics is a CMOS parallel I/O port with 40 I/O lines, operating b/w 4.5V and 5.5V. It features a max access time of 150 ns and supports industrial applications with a temp range of -40 °C to 85°C. Its ceramic, metal-sealed package ensures durability in various environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,748 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,748

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Vyrian

USA . 4,517 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,517

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Anansix

USA . 2,378 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,378

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,690 parts In-Stock

1+ parts

$27.241

100+ parts

-

1k+ parts

$24.517

10k+ parts

-

1,690

$27.241

-

$24.517

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MKK Technologies

India . 1,302 parts In-Stock

1+ parts

$51.225

100+ parts

-

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10k+ parts

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1,302

$51.225

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DigiPath Technology Company

USA . 1,302 parts In-Stock

1+ parts

$51.225

100+ parts

-

1k+ parts

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10k+ parts

-

1,302

$51.225

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Corphita

USA . 2,838 parts In-Stock

1+ parts

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2,838

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Parana Technologies

USA . 1,875 parts In-Stock

1+ parts

-

100+ parts

$32.571

1k+ parts

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10k+ parts

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1,875

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$32.571

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Overview

Unlock unparalleled performance and reliability with the PSD401A1-15LI from STMicroelectronics. Designed for demanding industrial applications, this advanced parallel I/O port delivers exceptional quality backed by a trusted name in semiconductor innovation. Experience seamless integration and robust functionality in your projects, ensuring optimal efficiency across various systems. Elevate your designs with a component that promises durability, versatility, and unmatched support from industry leaders.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of durable ceramic and metal-sealed co-fired materials enhances reliability and protects against environmental factors.

Surface Mount: YES

Surface mount capability allows for a compact design and simplifies automated assembly processes.

Maximum Supply Voltage: 5.5 V

A higher maximum supply voltage provides flexibility in usage for various applications without compromising performance.

Package Shape: SQUARE

The square package shape optimizes space on PCB layouts, making it suitable for high-density applications.

Power Supplies (V): 5

Designed to operate at a standard 5V supply, ensuring compatibility with a wide range of existing systems.

No. of Terminals: 68

With 68 terminals, this device can support a substantial number of connections for versatile interfacing options.

Package Style (Meter): CHIP CARRIER, WINDOW

The chip carrier with a window provides visibility for easier alignment and connectivity verification during installation.

Minimum Supply Voltage: 4.5 V

A low minimum supply voltage allows for operation in various power-sensitive environments.

Maximum Operating Temperature: 85 °C

This high operating temperature rating makes it suitable for industrial applications where thermal conditions can be extreme.

Minimum Operating Temperature: -40 °C

The ability to function in low temperatures ensures reliability in harsh and cold environments.

Terminal Finish: TIN LEAD

Tin-lead terminal finish facilitates excellent solderability and reduces the risk of corrosion.

Ultraviolet Erasable: Y

Ultraviolet erasability allows for easy data updates and modifications, enhancing product versatility.

Terminal Position: QUAD

The quad terminal position enhances connectivity options and layout efficiency on the circuit board.

No. of Ports: 5

Multiple ports enable simultaneous interfacing with different devices, improving overall performance and functionality.

Maximum Seated Height: 4.57 mm

The compact height ensures compatibility with space-constrained designs.

Width: 24.13 mm

A precise width allows for efficient use of board space while providing ample connectivity.

Length: 24.13 mm

Standard length aids in standardized PCB designs and simplifies inventory management.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature ranges ensures robustness and reliability in demanding conditions.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

Versatile general-purpose parallel I/O capabilities make it ideal for a variety of applications.

ROM Bits Size: 256 Bits

With 256 bits of ROM, it can store essential configuration data, enhancing the functionality of the device.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it suitable for portable and battery-operated devices.

Terminal Form: J BEND

J bend terminals provide secure connections and facilitate easy mounting on PCBs.

Nominal Supply Voltage: 5 V

Operating at a nominal 5V ensures compatibility with most standard logic systems and components.

Terminal Pitch: 1.27 mm

A 1.27 mm pitch supports high-density layouts, making it suitable for modern electronic designs.

Maximum Standby Current: 0.00002 Amp

Extremely low standby current ensures energy efficiency, prolonging battery life in portable applications.

Maximum Access Time: 0.00000015 ns

Ultra-fast access time enables high-speed data transfer, enhancing overall system performance.

No. of I/O Lines: 40

With 40 I/O lines, it allows for extensive interfacing and control capabilities for various peripherals.

Technical Specifications

Parallel I/O Ports PSD401A1-15LI attributes and parameters. Explore more Parallel I/O Ports devices from STMicroelectronics

Specs

Maximum Access Time:

.00000015 ns

Additional Features:

GENERAL PURPOSE ZPLD

JESD-30 Code:

S-CQCC-J68

JESD-609 Code:

e0

Length:

24.13 mm

No. of I/O Lines:

40

No. of Ports:

5

No. of Terminals:

68

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER, WINDOW

Power Supplies (V):

5

Qualification:

Not Qualified

ROM Bits Size:

256 Bits

Maximum Seated Height:

4.57 mm

Maximum Standby Current:

.00002 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

Y

Width:

24.13 mm

Peripheral IC Type:

Trade Compliance

PSD401A1-15LI Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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