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PSD401A1-15UI

STMicroelectronics

PSD401A1-15UI by STMicroelectronics

PSD401A1-15UI by STMicroelectronics is a low-profile parallel I/O port with 40 I/O lines, operating b/w -40 °C to 85°C. It supports a supply voltage of 4.5V to 5.5V and features a fast access time of 150 ns. Ideal for industrial applications requiring reliable data transfer in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,486 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,486

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Vyrian

USA . 1,723 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,723

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Anansix

USA . 1,163 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,163

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 614 parts In-Stock

1+ parts

$26.991

100+ parts

-

1k+ parts

-

10k+ parts

-

614

$26.991

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-

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IDEA Electronic Components Group

UK . 777 parts In-Stock

1+ parts

$33.779

100+ parts

-

1k+ parts

$30.401

10k+ parts

-

777

$33.779

-

$30.401

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MKK Technologies

India . 2,141 parts In-Stock

1+ parts

$63.519

100+ parts

-

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10k+ parts

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2,141

$63.519

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DigiPath Technology Company

USA . 2,141 parts In-Stock

1+ parts

$63.519

100+ parts

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1k+ parts

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10k+ parts

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2,141

$63.519

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Parana Technologies

USA . 2,077 parts In-Stock

1+ parts

-

100+ parts

$40.388

1k+ parts

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10k+ parts

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2,077

-

$40.388

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Corphita

USA . 509 parts In-Stock

1+ parts

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509

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Overview

Unlock new possibilities with the PSD401A1-15UI from STMicroelectronics—a robust parallel I/O port solution designed for reliability and performance. Manufactured by a leader in semiconductor technology, this component is ideal for diverse applications ranging from industrial automation to consumer electronics. Enjoy enhanced efficiency, low power consumption, and an impressive temperature range that ensures durability. Elevate your projects with unmatched quality and innovation today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and reliability, making this component suitable for various applications.

Surface Mount: YES

Surface mount technology allows for high-density packaging and a smaller footprint on PCBs, ideal for modern electronics.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V provides flexibility in power management while ensuring compatibility with typical digital circuits.

Package Shape: SQUARE

The square package shape allows for easier placement and alignment on printed circuit boards.

Power Supplies (V): 5

Being optimized for a 5V power supply makes integration straightforward with standard microcontrollers and digital electronics.

No. of Terminals: 80

With 80 terminals, the component supports a wide range of functionalities and applications, accommodating complex interconnections.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile flatpack design reduces overall height on PCBs, making it suitable for compact devices.

Minimum Supply Voltage: 4.5 V

A minimum supply voltage of 4.5 V ensures reliable operation across a range of power conditions, enhancing flexibility.

Maximum Operating Temperature: 85 °C

An operating temperature up to 85 °C makes this product suitable for industrial applications subject to higher temperature environments.

Minimum Operating Temperature: -40 °C

The capability to function at -40 °C ensures reliable performance in extreme conditions, ideal for outdoor or harsh environments.

Terminal Finish: TIN LEAD

Tin-lead terminal finish offers excellent solderability and reliability in electrical connections.

Terminal Position: QUAD

The quad terminal positioning promotes better space utilization and easier routing on PCBs.

No. of Ports: 5

With 5 parallel ports, this product allows for numerous inputs/outputs simultaneously, enhancing data processing capabilities.

Maximum Seated Height: 1.6 mm

The maximum seated height of 1.6 mm ensures that the component remains low-profile, which is crucial for space-constrained designs.

Width: 14 mm

A width of 14 mm provides a balanced form factor, facilitating efficient layout on the circuit board.

Length: 14 mm

The compact length of 14 mm contributes to a minimized footprint, perfect for modern electronic compactness.

Temperature Grade: INDUSTRIAL

The industrial temperature grade indicates robustness, making it a good choice for applications in demanding industrial environments.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

As a general-purpose parallel I/O port, it offers versatility for various applications, making it suitable in many designs.

ROM Bits Size: 256 Bits

The ROM size of 256 bits allows for sufficient memory for basic configurations, making it adaptable to many environments.

Technology: CMOS

CMOS technology ensures low power consumption and high-speed operations, making it efficient for battery-operated devices.

Terminal Form: GULL WING

Gull-wing terminal form provides good solder joint reliability and is preferred for automated assembly.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V indicates standard compatibility with most digital circuits and helps simplify design.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for higher density configurations on PCBs, catering to advanced board designs.

Maximum Standby Current: 0.00002 Amp

Extremely low standby current means low power dissipation during non-operation, enhancing energy efficiency.

Maximum Access Time: 0.00000015 ns

The rapid access time of 0.15 ns supports high-speed data transfer rates, optimizing overall system performance.

No. of I/O Lines: 40

Having 40 I/O lines allows for significant data flow capacity, making it suitable for high-bandwidth applications.

Technical Specifications

Parallel I/O Ports PSD401A1-15UI attributes and parameters. Explore more Parallel I/O Ports devices from STMicroelectronics

Specs

Maximum Access Time:

.00000015 ns

Additional Features:

GENERAL PURPOSE ZPLD

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e0

Length:

14 mm

No. of I/O Lines:

40

No. of Ports:

5

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.64SQ

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Power Supplies (V):

5

Qualification:

Not Qualified

ROM Bits Size:

256 Bits

Maximum Seated Height:

1.6 mm

Maximum Standby Current:

.00002 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Width:

14 mm

Peripheral IC Type:

Trade Compliance

PSD401A1-15UI Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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