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PSD401A1-70U

STMicroelectronics

PSD401A1-70U by STMicroelectronics

PSD401A1-70U by STMicroelectronics is a low-profile, square parallel I/O port with 80 terminals and operates b/w 4.5V to 5.5V. It features a max access time of 70 ns and supports up to 40 I/O lines, ideal for general-purpose applications in commercial environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,677 parts In-Stock

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3,677

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Vyrian

USA . 2,084 parts In-Stock

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2,084

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Anansix

USA . 267 parts In-Stock

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267

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,076 parts In-Stock

1+ parts

$24.685

100+ parts

-

1k+ parts

$22.217

10k+ parts

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2,076

$24.685

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$22.217

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MKK Technologies

India . 211 parts In-Stock

1+ parts

$46.419

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211

$46.419

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DigiPath Technology Company

USA . 211 parts In-Stock

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$46.419

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211

$46.419

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Corohmni

South Africa . 2,633 parts In-Stock

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$54.156

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2,633

$54.156

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Parana Technologies

USA . 909 parts In-Stock

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$29.515

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909

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$29.515

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Corphita

USA . 838 parts In-Stock

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838

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Overview

Experience unparalleled performance with the PSD401A1-70U from STMicroelectronics, a leader in innovative semiconductor solutions. This versatile parallel I/O port is designed for reliability in diverse applications, from industrial automation to consumer electronics. Benefit from its low power consumption and compact design, ensuring seamless integration into your projects. Trust in ST's commitment to quality and innovation—empower your designs with the finest technology available!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures reliability and robustness, making it suitable for a variety of applications.

Surface Mount: YES

Surface mount technology allows for a more compact design, which is ideal for modern electronics where space is limited.

Maximum Supply Voltage: 5.5 V

This flexibility in supply voltage allows the product to integrate easily into different circuit designs without risk of damage.

Package Shape: SQUARE

The square shape improves the ease of routing on PCBs, making assembly and integration straightforward.

Power Supplies (V): 5

Operating at a common 5V supply voltage makes it compatible with a wide range of existing systems.

No. of Terminals: 80

The high number of terminals allows for extensive connections, increasing the functionality of the device.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile design is perfect for portable or height-constrained applications, ensuring versatility in deployment.

Minimum Supply Voltage: 4.5 V

This range of supply voltage provides flexibility for various power conditions in different applications.

Maximum Operating Temperature: 70 °C

The device can operate in higher temperature environments, ensuring reliability in demanding conditions.

Minimum Operating Temperature: 0 °C

The ability to function from 0 °C enhances its usability in a wider temperature range.

Terminal Finish: TIN LEAD

The tin lead finish provides good solderability and enhances the durability of the connections.

Ultraviolet Erasable: N

As a non-ultraviolet erasable component, it offers a stable performance suitable for applications where data integrity is critical.

Terminal Position: QUAD

Quad terminal positioning increases density and allows for more compact PCB designs.

No. of Ports: 5

Having five ports provides multiple channels for data transfer, supporting complex data communication tasks.

Maximum Seated Height: 1.6 mm

A low seated height is crucial for efficient space utilization in various electronic configurations.

Width: 14 mm

The compact width aids in space-efficient designs, suitable for tight layouts in modern electronic devices.

Length: 14 mm

The short length allows for easy integration into small-scale applications without compromising performance.

Temperature Grade: COMMERCIAL

The commercial-grade rating ensures that the product meets standard reliability and performance criteria for consumer electronics.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

As a general-purpose parallel I/O port, it can be used in a wide range of applications, enhancing versatility.

ROM Bits Size: 256 Bits

The 256 bits ROM size is suitable for various lightweight applications requiring basic data storage.

Technology: CMOS

CMOS technology ensures low power consumption, making the device energy-efficient and ideal for battery-operated devices.

Terminal Form: GULL WING

The gull wing terminal form is popular for ease of soldering and effective heat dissipation during operation.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V simplifies design and integration in standard electronic environments.

Terminal Pitch: 0.65 mm

A 0.65 mm terminal pitch allows for closer spacing of connections, which is beneficial in designing compact systems.

Maximum Standby Current: 0.00002 Amp

Extremely low standby current consumption indicates excellent power efficiency, enhancing the suitability for low-power applications.

Maximum Access Time: 0.00000007 ns

The ultra-fast access time contributes to high-speed data processing capabilities, essential for performance-critical applications.

No. of I/O Lines: 40

Having 40 I/O lines significantly increases the communication capability, allowing for more data channels and functionality.

Technical Specifications

Parallel I/O Ports PSD401A1-70U attributes and parameters. Explore more Parallel I/O Ports devices from STMicroelectronics

Specs

Maximum Access Time:

.00000007 ns

Additional Features:

GENERAL PURPOSE ZPLD

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e0

Length:

14 mm

No. of I/O Lines:

40

No. of Ports:

5

No. of Terminals:

80

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.64SQ

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Power Supplies (V):

5

Qualification:

Not Qualified

ROM Bits Size:

256 Bits

Maximum Seated Height:

1.6 mm

Maximum Standby Current:

.00002 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Width:

14 mm

Peripheral IC Type:

Trade Compliance

PSD401A1-70U Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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