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PSD401A1-C-70U

STMicroelectronics

PSD401A1-C-70U by STMicroelectronics

PSD401A1-C-70U by STMicroelectronics is a low-profile, 80-terminal parallel I/O port IC designed for general-purpose applications. It operates at a nominal voltage of 5V with a max access time of just 70 ns and supports temperatures up to 70 °C. Ideal for embedded systems, it offers efficient data handling in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,362 parts In-Stock

1+ parts

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3,362

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Vyrian

USA . 3,185 parts In-Stock

1+ parts

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1k+ parts

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3,185

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Anansix

USA . 2,131 parts In-Stock

1+ parts

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2,131

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 61 parts In-Stock

1+ parts

$20.308

100+ parts

-

1k+ parts

$18.277

10k+ parts

-

61

$20.308

-

$18.277

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MKK Technologies

India . 1,807 parts In-Stock

1+ parts

$38.188

100+ parts

-

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10k+ parts

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1,807

$38.188

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DigiPath Technology Company

USA . 1,807 parts In-Stock

1+ parts

$38.188

100+ parts

-

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10k+ parts

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1,807

$38.188

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Corphita

USA . 4,722 parts In-Stock

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4,722

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Parana Technologies

USA . 1,454 parts In-Stock

1+ parts

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100+ parts

$24.281

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1,454

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$24.281

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Overview

Unlock unparalleled performance with the PSD401A1-C-70U from STMicroelectronics—a leader in innovative electronic solutions. This advanced parallel I/O port combines reliability and cutting-edge technology, catering to diverse applications from consumer electronics to industrial automation. With its low-profile design and robust features, it seamlessly integrates into your projects, ensuring efficiency and longevity. Experience quality and precision that elevate your designs to new heights!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy offers durability and protection against environmental factors, ensuring reliable use in various applications.

Surface Mount: YES

Surface mount technology allows for a compact design and easy integration into modern circuit boards, making it suitable for space-constrained environments.

Maximum Supply Voltage: 5.5 V

A higher maximum supply voltage enhances compatibility with a wider range of power sources while ensuring stable operation.

Package Shape: SQUARE

The square package shape aids in uniform heat distribution and simplifies layout design for PCB mounting.

Power Supplies (V): 5

Operating at a standard 5V power supply makes it easy to integrate with other components and systems.

No. of Terminals: 80

The 80 terminals provide ample connectivity options for versatile applications, facilitating complex circuit designs.

Package Style (Meter): FLATPACK, LOW PROFILE

A low-profile flatpack design is ideal for applications where height constraints are critical, allowing for more compact devices.

Minimum Supply Voltage: 4.5 V

The relatively low minimum supply voltage ensures compatibility with a variety of power management systems and devices.

Maximum Operating Temperature: 70 °C

The capability to operate at elevated temperatures makes this product suitable for industrial and demanding environments.

Minimum Operating Temperature: 0 °C

A minimum operating temperature of 0 °C allows for a broad range of applications in both indoor and outdoor settings.

Terminal Finish: TIN LEAD

Tin-lead finishes enhance solderability and connection reliability during assembly, which is critical for manufacturing processes.

Terminal Position: QUAD

The quad terminal position facilitates efficient signal routing and connection management within the circuit design.

No. of Ports: 5

Multiple ports enable concurrent data handling, enhancing system performance and versatility.

Maximum Seated Height: 1.6 mm

A low seated height contributes to a compact footprint, making it suitable for densely populated PCB layouts.

Width: 14 mm

A width of 14 mm strikes a balance between connectivity and compactness, fitting well in restricted spaces.

Length: 14 mm

Uniform dimensions of 14 mm length promote consistency in design and layout planning across various applications.

Temperature Grade: COMMERCIAL

Designed for commercial grade applications, ensuring reliability and performance in standard operating conditions.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

This IC type is versatile and suitable for interfacing with a variety of devices and systems, enhancing its applicability.

ROM Bits Size: 262144 Bits

A large ROM size allows for substantial data storage capabilities, making it suitable for applications requiring significant memory.

Technology: CMOS

CMOS technology provides low power consumption and high speed, making this product energy efficient and fast.

Terminal Form: GULL WING

Gull wing terminals facilitate automated assembly processes and improve soldering reliability.

Nominal Supply Voltage: 5 V

The standard nominal supply voltage aligns with most electronic devices, ensuring ease of integration.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for tightly packed designs, maximizing the circuit board's real estate usage.

Maximum Standby Current: 0.00004 Amp

Low standby current enhances energy efficiency, making it an environmentally friendly choice.

Maximum Access Time: 0.00000007 ns

Ultra-fast access time ensures rapid data processing and improves overall system performance.

No. of I/O Lines: 40

A generous number of I/O lines allows for extensive interfacing capabilities with multiple peripherals.

Technical Specifications

Parallel I/O Ports PSD401A1-C-70U attributes and parameters. Explore more Parallel I/O Ports devices from STMicroelectronics

Specs

Maximum Access Time:

.00000007 ns

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e0

Length:

14 mm

No. of I/O Lines:

40

No. of Ports:

5

No. of Terminals:

80

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.64SQ

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Power Supplies (V):

5

Qualification:

Not Qualified

ROM Bits Size:

262144 Bits

Maximum Seated Height:

1.6 mm

Maximum Standby Current:

.00004 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Width:

14 mm

Peripheral IC Type:

Trade Compliance

PSD401A1-C-70U Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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