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PSD401A1-C-15U

STMicroelectronics

PSD401A1-C-15U by STMicroelectronics

PSD401A1-C-15U by STMicroelectronics is a low-profile parallel I/O port with 80 terminals, operating b/w 4.5V and 5.5V. It features a max access time of 150 ns and supports up to 40 I/O lines, ideal for general-purpose applications in commercial environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,024 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,024

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-

-

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Anansix

USA . 2,832 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,832

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Vyrian

USA . 469 parts In-Stock

1+ parts

-

100+ parts

-

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10k+ parts

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469

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 474 parts In-Stock

1+ parts

$20.376

100+ parts

-

1k+ parts

$18.339

10k+ parts

-

474

$20.376

-

$18.339

-

MKK Technologies

India . 2,056 parts In-Stock

1+ parts

$38.316

100+ parts

-

1k+ parts

-

10k+ parts

-

2,056

$38.316

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-

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DigiPath Technology Company

USA . 2,056 parts In-Stock

1+ parts

$38.316

100+ parts

-

1k+ parts

-

10k+ parts

-

2,056

$38.316

-

-

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Corphita

USA . 1,136 parts In-Stock

1+ parts

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1,136

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Parana Technologies

USA . 733 parts In-Stock

1+ parts

-

100+ parts

$24.363

1k+ parts

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10k+ parts

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733

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$24.363

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Overview

Unlock the potential of your projects with the PSD401A1-C-15U from STMicroelectronics, a leader in high-quality semiconductor solutions. This versatile parallel I/O port offers reliability and performance for various applications, from consumer electronics to industrial automation. With its low-profile design and efficient power management, it ensures seamless integration into your systems, maximizing efficiency while minimizing space. Experience innovation and excellence that drives your success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures longevity and reliability in various environmental conditions.

Surface Mount: YES

Surface mount technology allows for space-saving designs and efficient use of PCB real estate.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5V provides flexibility in power supply options while ensuring device safety.

Package Shape: SQUARE

The square package shape enhances thermal management and facilitates easier PCB placement.

Power Supplies (V): 5

Operating with a standard 5V supply makes integration into existing systems simple and cost-effective.

No. of Terminals: 80

With 80 terminals, this product supports a wide array of connections for comprehensive functionality.

Package Style (Meter): FLATPACK, LOW PROFILE

The low profile flatpack design enables compact packaging and minimizes height on PCBs.

Minimum Supply Voltage: 4.5 V

A minimum supply voltage of 4.5V ensures the device can operate efficiently in varied conditions.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, reliable performance is ensured in commercial applications.

Minimum Operating Temperature: 0 °C

Operating from 0 °C ensures the device is versatile and suitable for various environmental conditions.

Terminal Finish: TIN LEAD

Tin lead finish ensures good solderability and provides a reliable electrical connection.

Terminal Position: QUAD

Quad terminal positioning simplifies routing on PCBs and enhances package layout efficiency.

No. of Ports: 5

With 5 ports, this parallel I/O port IC supports multiple connections, making it ideal for complex devices.

Maximum Seated Height: 1.6 mm

A maximum height of only 1.6 mm allows for low-profile designs, crucial for space-constrained applications.

Width: 14 mm

The compact width of 14 mm aids in maximizing space usage on circuit boards.

Length: 14 mm

The 14 mm length complements the width for a consistent and compact form factor.

Temperature Grade: COMMERCIAL

Designed for commercial grade, this product is suited for long-term, reliable operations in consumer devices.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

This designation ensures versatility, making it usable in a wide range of applications beyond just parallel I/O.

ROM Bits Size: 262144 Bits

A sizeable ROM of 262144 bits supports significant data storage, enhancing the device's utility.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for battery-operated devices.

Terminal Form: GULL WING

The gull wing terminal form enhances soldering efficiency and mechanical stability on PCBs.

Nominal Supply Voltage: 5 V

Nominal operating at 5V allows seamless integration with standard digital logic devices.

Terminal Pitch: 0.65 mm

A pitch of 0.65 mm allows for denser layouts, accommodating more connections in a limited space.

Maximum Standby Current: 0.00004 Amp

A meager standby current ensures energy efficiency, beneficial for power-sensitive applications.

Maximum Access Time: 0.00000015 ns

Ultra-fast access time facilitates high-speed data communications, making it suitable for performance-critical applications.

No. of I/O Lines: 40

Offering 40 I/O lines maximizes functionality and connectivity options for complex interfacing requirements.

Technical Specifications

Parallel I/O Ports PSD401A1-C-15U attributes and parameters. Explore more Parallel I/O Ports devices from STMicroelectronics

Specs

Maximum Access Time:

.00000015 ns

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e0

Length:

14 mm

No. of I/O Lines:

40

No. of Ports:

5

No. of Terminals:

80

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.64SQ

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Power Supplies (V):

5

Qualification:

Not Qualified

ROM Bits Size:

262144 Bits

Maximum Seated Height:

1.6 mm

Maximum Standby Current:

.00004 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Width:

14 mm

Peripheral IC Type:

Trade Compliance

PSD401A1-C-15U Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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