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PSD401A1-C-15L

STMicroelectronics

PSD401A1-C-15L by STMicroelectronics

PSD401A1-C-15L by STMicroelectronics is a CMOS parallel I/O port with 68 terminals, supporting a supply voltage of 4.5-5.5V. It features a max access time of 150ns and operates within -0 to 70 °C. Ideal for general-purpose applications in commercial environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,117 parts In-Stock

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2,117

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Vyrian

USA . 1,592 parts In-Stock

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1,592

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Anansix

USA . 1,413 parts In-Stock

1+ parts

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1,413

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DF Sales Co.

USA . 4 parts In-Stock

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DF Sales Co.

USA . 4 parts In-Stock

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4

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 56 parts In-Stock

1+ parts

$64.144

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56

$64.144

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IDEA Electronic Components Group

UK . 2,287 parts In-Stock

1+ parts

$74.904

100+ parts

-

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$67.413

10k+ parts

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2,287

$74.904

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$67.413

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MKK Technologies

India . 2,151 parts In-Stock

1+ parts

$140.851

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2,151

$140.851

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DigiPath Technology Company

USA . 2,151 parts In-Stock

1+ parts

$140.851

100+ parts

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2,151

$140.851

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Corphita

USA . 1,340 parts In-Stock

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1,340

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Parana Technologies

USA . 255 parts In-Stock

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$89.559

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255

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$89.559

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Overview

Unlock unparalleled performance with the PSD401A1-C-15L from STMicroelectronics, a leader in innovative semiconductor technology. This advanced parallel I/O port solution combines high reliability and exceptional versatility, empowering your applications—from embedded systems to consumer electronics. With its robust design and efficient power management, you can trust this product to enhance your projects while maximizing efficiency and longevity. Experience quality and innovation that propel your designs forward!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The durable ceramic and metal-sealed co-fired body material ensures enhanced reliability and protection against environmental factors.

Surface Mount: YES

Surface mount technology allows for a compact footprint and easier integration into modern circuit boards.

Maximum Supply Voltage: 5.5 V

The ability to work with a maximum supply voltage of 5.5 V makes this product versatile and capable of operating in various electronic applications.

Package Shape: SQUARE

The square package shape optimizes space on PCB layouts, enabling efficient design and assembly.

Power Supplies (V): 5

Standard 5V power supply makes it a compatible choice for most electronic devices and systems.

No. of Terminals: 68

With 68 terminals, this product supports extensive connectivity for diverse I/O applications.

Package Style (Meter): CHIP CARRIER, WINDOW

The chip carrier style offers easy handling and installation, ideal for various applications in electronic devices.

Minimum Supply Voltage: 4.5 V

Operating within a 4.5 V minimum supply voltage range ensures stable performance across a variety of circuits.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C enables this product to function in moderate thermal environments without performance issues.

Minimum Operating Temperature: 0 °C

Suitable for use in cold environments, this component remains functional down to 0 °C.

Terminal Finish: TIN LEAD

The tin-lead terminal finish provides good solderability, ensuring reliable connections during assembly.

Ultraviolet Erasable: Y

Being ultraviolet erasable allows for easy reprogramming, enhancing the flexibility of use in various applications.

Terminal Position: QUAD

Quad terminal position facilitates straightforward connectivity options, streamlining the design of peripheral interfaces.

No. of Ports: 5

With 5 ports available, this product enables multiple data channels for simultaneous communication, increasing efficiency.

Maximum Seated Height: 4.57 mm

A low maximum seated height ensures compatibility with compact electronic designs, saving valuable space on the PCB.

Width: 24.105 mm

The width provides a balanced form factor, ideal for both performance and spatial considerations in electronic layouts.

Length: 24.105 mm

Its square dimensions make layout uniform and predictable, easing the design process.

Temperature Grade: COMMERCIAL

Rated for commercial temperature ranges, suitable for a wide variety of consumer and industrial applications.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

As a general-purpose parallel I/O port, it supports a range of applications, making it a versatile choice for designers.

ROM Bits Size: 262144 Bits

A sizable ROM bits capacity enhances functionality, accommodating substantial data storage needs.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high-speed performance, making it ideal for battery-operated devices.

Terminal Form: J BEND

The J bend terminal form simplifies PCB assembly, providing a reliable connection point for easy integration.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 V matches industry standards, ensuring compatibility with a wide range of devices.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm is ideal for both small and larger layouts, allowing for flexible PCB designs.

Maximum Standby Current: 0.00004 Amp

Very low standby current ensures energy efficiency, making it suitable for low-power applications.

Maximum Access Time: 0.00000015 ns

Ultra-fast access time enhances overall system performance, facilitating quick data retrieval and processing.

No. of I/O Lines: 40

Forty I/O lines provide extensive interfacing capabilities, ideal for complex peripheral connections and operations.

Technical Specifications

Parallel I/O Ports PSD401A1-C-15L attributes and parameters. Explore more Parallel I/O Ports devices from STMicroelectronics

Specs

Maximum Access Time:

.00000015 ns

JESD-30 Code:

S-CQCC-J68

JESD-609 Code:

e0

Length:

24.105 mm

No. of I/O Lines:

40

No. of Ports:

5

No. of Terminals:

68

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER, WINDOW

Power Supplies (V):

5

Qualification:

Not Qualified

ROM Bits Size:

262144 Bits

Maximum Seated Height:

4.57 mm

Maximum Standby Current:

.00004 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

Y

Width:

24.105 mm

Peripheral IC Type:

Trade Compliance

PSD401A1-C-15L Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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