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PSD401A1-70L

STMicroelectronics

PSD401A1-70L by STMicroelectronics

PSD401A1-70L by STMicroelectronics is a CMOS parallel I/O port with 40 I/O lines, operating b/w 4.5V and 5.5V. It features a compact square package (24.13mm) and supports temperatures up to 70 °C. Ideal for general-purpose applications in commercial environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,058 parts In-Stock

1+ parts

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2,058

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Vyrian

USA . 2,008 parts In-Stock

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2,008

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Anansix

USA . 683 parts In-Stock

1+ parts

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683

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 476 parts In-Stock

1+ parts

$36.704

100+ parts

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476

$36.704

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IDEA Electronic Components Group

UK . 2,042 parts In-Stock

1+ parts

$63.126

100+ parts

-

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$56.813

10k+ parts

-

2,042

$63.126

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$56.813

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MKK Technologies

India . 228 parts In-Stock

1+ parts

$118.704

100+ parts

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228

$118.704

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DigiPath Technology Company

USA . 228 parts In-Stock

1+ parts

$118.704

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228

$118.704

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Corphita

USA . 2,526 parts In-Stock

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2,526

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Parana Technologies

USA . 567 parts In-Stock

1+ parts

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100+ parts

$75.476

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567

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$75.476

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Overview

Unlock seamless connectivity and superior performance with the PSD401A1-70L from STMicroelectronics. Renowned for their innovation and reliability, STMicroelectronics delivers this robust parallel I/O port, designed for diverse applications ranging from industrial automation to consumer electronics. With its compact ceramic package and impressive temperature resilience, it ensures long-lasting durability and efficiency. Elevate your projects with unbeatable quality and exceptional value!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The durable construction ensures reliability and longevity in various operating conditions.

Surface Mount: YES

Facilitates easy integration into compact designs, saving board space.

Maximum Supply Voltage: 5.5 V

Allows for flexibility in power supply design, accommodating a range of applications.

Package Shape: SQUARE

Optimizes footprint and helps in efficient placement on the PCB.

No. of Terminals: 68

Provides ample connectivity options, making it suitable for complex circuit designs.

Package Style (Meter): CHIP CARRIER, WINDOW

The open window design facilitates easy inspection and testing of solder joints.

Minimum Supply Voltage: 4.5 V

Enables operation in low-voltage applications, promoting energy efficiency.

Maximum Operating Temperature: 70 °C

Ensures reliable performance in warmer environments, suitable for industrial applications.

Minimum Operating Temperature: 0 °C

Allows for operation in diverse environmental conditions, enhancing versatility.

Terminal Position: QUAD

Offers advantageous configuration for routing and assembly on the PCB.

No. of Ports: 5

Provides multiple interfaces for enhanced connectivity options in systems.

Maximum Seated Height: 4.57 mm

Low profile design aids in maintaining space constraints in compact electronics.

Width: 24.13 mm

Standard width ensures compatibility with most PCB designs.

Length: 24.13 mm

Standardized length facilitates predictable layout and design integration.

Temperature Grade: COMMERCIAL

Suitable for a wide range of consumer electronics applications.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

Versatile functionality allows it to be effectively utilized across various devices.

Technology: CMOS

Low power consumption combined with high speed makes it ideal for modern electronics.

Terminal Form: J BEND

J-bend terminals provide excellent mechanical stability and improve soldering reliability.

Nominal Supply Voltage: 5 V

Standard supply voltage, promoting compatibility with various logic levels.

Terminal Pitch: 1.27 mm

Allows for denser packing on PCBs while maintaining ease of soldering and assembly.

No. of I/O Lines: 40

A high number of I/O lines supports complex and data-intensive applications.

Technical Specifications

Parallel I/O Ports PSD401A1-70L attributes and parameters. Explore more Parallel I/O Ports devices from STMicroelectronics

Specs

Additional Features:

GENERAL PURPOSE ZPLD

JESD-30 Code:

S-CQCC-J68

Length:

24.13 mm

No. of I/O Lines:

40

No. of Ports:

5

No. of Terminals:

68

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, WINDOW

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

24.13 mm

Peripheral IC Type:

Trade Compliance

PSD401A1-70L Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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