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PCA9534ADBQR

Texas Instruments

PCA9534ADBQR by Texas Instruments

PCA9534ADBQR by Texas Instruments is an 8-bit parallel I/O port with a supply voltage range of 2.3V to 5.5V, suitable for industrial applications. This CMOS technology device has 16 terminals in a small outline package, operating b/w -40°C to 85°C temperature range. Ideal for general purpose use cases requiring precise control over multiple I/O lines.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,214 parts In-Stock

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Digiode

USA . 2,421 parts In-Stock

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2,421

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Distributors (Availability)

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AZTECH Wire

Italy . 725 parts In-Stock

1+ parts

$13.625

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725

$13.625

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One Stop Electronics

USA . 575 parts In-Stock

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$30.000

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575

$30.000

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Parana Technologies

USA . 1,061 parts In-Stock

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$38.983

100+ parts

$3,620.153

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$35.085

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1,061

$38.983

$3,620.153

$35.085

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DigiPath Technology Company

USA . 1,864 parts In-Stock

1+ parts

$42.925

100+ parts

$39.491

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1,864

$42.925

$39.491

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ChromeModa Solutions

Germany . 3,012 parts In-Stock

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$43.801

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$35.917

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3,012

$43.801

$35.917

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IDEA Electronic Components Group

UK . 1,225 parts In-Stock

1+ parts

$43.801

100+ parts

$41.611

1k+ parts

$39.421

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1,225

$43.801

$41.611

$39.421

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Corohmni

South Africa . 63 parts In-Stock

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$49.273

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63

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Corphita

USA . 89 parts In-Stock

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89

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Overview

Upgrade your electronics with the Texas Instruments PCA9534ADBQR, a top-quality parallel I/O port that delivers unmatched performance and reliability. With its small outline package and industrial-grade temperature rating, this versatile chip is perfect for a wide range of applications. From controlling LED lighting to managing system interfaces, this product offers customers exceptional value and flexibility. Trust in Texas Instruments to provide cutting-edge technology that meets your needs and exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy materials are lightweight and cost-effective, making this product suitable for applications where weight and cost are key considerations.

Surface Mount: YES

Surface mount design allows for easy and efficient PCB assembly, saving time and reducing production costs.

Maximum Supply Voltage: 5.5 V

Can handle higher supply voltages, providing flexibility in power supply design.

Package Shape: RECTANGULAR

Rectangular shape fits standard PCB layouts easily, making it compatible with a wide range of designs.

No. of Bits: 8

8-bit parallel I/O ports provide sufficient data transfer capabilities for many general-purpose applications.

Power Supplies (V): 2.5/5

Supports multiple power supply voltage options, allowing for compatibility with various systems.

No. of Terminals: 16

Sufficient number of terminals for connecting to external devices and components in a typical circuit.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

Small outline and shrink pitch package style saves board space, important in compact designs.

Minimum Supply Voltage: 2.3 V

Operates reliably even at low supply voltages, suitable for battery-powered devices.

Maximum Operating Temperature: 85 °C

Wide operating temperature range allows for use in industrial environments with varying temperature conditions.

Minimum Operating Temperature: -40 °C

Can withstand extremely low temperatures, making it suitable for use in cold environments.

Terminal Position: DUAL

Dual terminal position provides redundancy and increased reliability in connections.

Maximum Seated Height: 1.75 mm

Low profile design saves space on the PCB and allows for compact product designs.

Width: 3.9 mm

Compact width dimensions suit it for use in space-constrained applications.

Length: 4.9 mm

Short length makes it suitable for compact board layouts and smaller electronic devices.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in harsh environments.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

Designed as a general-purpose parallel I/O port for versatile use in different applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for various battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals are suitable for surface mount applications and provide strong mechanical connections.

Nominal Supply Voltage: 5 V

Standard 5V supply voltage makes it compatible with many existing systems and components.

Terminal Pitch: 0.635 mm

Fine terminal pitch allows for high-density mounting and tight spacing on the PCB.

No. of I/O Lines: 8

Provides 8 I/O lines for interfacing with external devices, suitable for a variety of applications.

Technical Specifications

Parallel I/O Ports PCA9534ADBQR attributes and parameters. Explore more Parallel I/O Ports devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G16

Length:

4.9 mm

No. of Bits:

8

No. of I/O Lines:

8

No. of Ports:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Parallel IO Port

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Width:

3.9 mm

Peripheral IC Type:

Trade Compliance

PCA9534ADBQR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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