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PCA9505DGG

NXP Semiconductors

PCA9505DGG by NXP Semiconductors

PCA9505DGG by NXP Semiconductors is a Parallel I/O Port with 2 ports, 8 I/O lines, and CMOS technology. It operates b/w -40 to 85 °C with supply voltage range of 2.3V to 5.5V. Ideal for industrial applications requiring general purpose parallel IO functionality in compact form factor.

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Lifecycle Status

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9

In-Stock Inventory

1k+

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Chip Stock

USA . 9,500 parts In-Stock

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Digiode

USA . 4,163 parts In-Stock

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Anansix

USA . 2,220 parts In-Stock

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Vyrian

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Cyclops Electronics Ltd

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Electronics Depot

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Nova Conductors

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Prism Electronics

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Speed Components Ltd

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Semicontronic

India . 1,445 parts In-Stock

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$0.975

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$0.970

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AZTECH Wire

Italy . 667 parts In-Stock

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$7.202

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Ampacity Inc.

Singapore . 868 parts In-Stock

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One Stop Electronics

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Corohmni

South Africa . 92 parts In-Stock

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Aztec Data Supply Inc.

USA . 4,312 parts In-Stock

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Overview

Unlock endless possibilities with the PCA9505DGG from NXP Semiconductors. This innovative Parallel I/O Ports device offers unparalleled quality and reliability, making it the top choice for a wide range of applications. With its small outline, thin profile package and industrial temperature grade, this product is designed to meet your specific needs. Experience seamless operation and enhanced performance with the PCA9505DGG, providing you with the value and benefits you deserve. Elevate your projects to new heights with this exceptional product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and lightweight housing for the product.

Maximum Supply Voltage: 5.5 V

Can handle higher voltage levels, making it versatile for various applications.

No. of Terminals: 56

Offers multiple connection points for increased functionality.

Minimum Operating Temperature: -40 °C

Capable of operating in extremely cold environments.

No. of Ports: 2

Allows for multiple parallel connections.

Technology: CMOS

Utilizes low power consumption and provides high noise immunity.

Nominal Supply Voltage: 3.3 V

Standard voltage level for compatibility with many systems.

No. of I/O Lines: 8

Offers multiple input and output options for data transfer.

Technical Specifications

Parallel I/O Ports PCA9505DGG attributes and parameters. Explore more Parallel I/O Ports devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G56

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

8

No. of Ports:

2

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6.1 mm

Peripheral IC Type:

Trade Compliance

PCA9505DGG Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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