Loading...

PD57060STR-E

STMicroelectronics

PD57060STR-E by STMicroelectronics

PD57060STR-E by STMicroelectronics is an N-channel RF power FET designed for amplifier applications. It features a max drain current of 7 A, a breakdown voltage of 65 V, and operates in the ultra-high frequency band. This compact surface mount transistor ensures efficient performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,941 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,941

-

-

-

-

Vyrian

USA . 2,885 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,885

-

-

-

-

Anansix

USA . 2,214 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,214

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 762 parts In-Stock

1+ parts

$1.246

100+ parts

-

1k+ parts

$1.121

10k+ parts

-

762

$1.246

-

$1.121

-

MKK Technologies

India . 29 parts In-Stock

1+ parts

$2.342

100+ parts

-

1k+ parts

-

10k+ parts

-

29

$2.342

-

-

-

DigiPath Technology Company

USA . 29 parts In-Stock

1+ parts

$2.342

100+ parts

-

1k+ parts

-

10k+ parts

-

29

$2.342

-

-

-

AZTECH Wire

Italy . 890 parts In-Stock

1+ parts

$20.160

100+ parts

-

1k+ parts

-

10k+ parts

-

890

$20.160

-

-

-

Corphita

USA . 2,670 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,670

-

-

-

-

Parana Technologies

USA . 391 parts In-Stock

1+ parts

-

100+ parts

$1.489

1k+ parts

-

10k+ parts

-

391

-

$1.489

-

-

Overview

Elevate your RF applications with the PD57060STR-E from STMicroelectronics, a leader in innovative semiconductor solutions. This high-performance N-channel FET delivers exceptional amplification in ultra-high frequency bands, ensuring efficient power management and reliability. With its compact design and robust construction, it seamlessly integrates into various devices, enhancing performance while minimizing space. Trust in STMicroelectronics for quality and innovation that empower your projects to soar!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures lightweight construction, durability, and resistance to environmental stresses, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are ideal for amplification and switching applications due to their high electron mobility, resulting in better performance.

Configuration: SINGLE

A single configuration simplifies circuit design and increases reliability, making it a good choice for compact applications.

Transistor Application: AMPLIFIER

Designed for amplification, this FET efficiently increases signal strength, making it suitable for audio, radio frequency, and communication circuits.

Surface Mount: YES

Surface mount capability allows for compact PCB designs and automated assembly processes, improving manufacturability.

Minimum DS Breakdown Voltage: 65 V

With a minimum breakdown voltage of 65 V, this transistor can handle significant voltage levels, providing versatility in various applications.

Package Shape: RECTANGULAR

A rectangular package shape optimizes space on PCBs, facilitating efficient layout and design.

Terminal Form: FLAT

Flat terminals allow for increased surface contact and improved soldering results, enhancing reliability in electronic assemblies.

Operating Mode: ENHANCEMENT MODE

As an enhancement mode device, it offers high input impedance, reducing power consumption during operation.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Suitable for ultra-high frequency applications, this FET is ideal for advanced communication systems and high-speed circuits.

Maximum Drain Current (Abs) (ID): 7 A

A maximum drain current of 7 A provides sufficient current handling capability for various demanding applications.

No. of Terminals: 2

A 2-terminal design ensures simplicity in connections, reducing the potential for errors during circuit assembly.

Maximum Power Dissipation (Abs): 0.079 W

With a power dissipation of 0.079 W, this component can operate efficiently without overheating, contributing to long-term reliability.

Package Style (Meter): SMALL OUTLINE

The small outline package style is space-efficient, making it ideal for modern compact electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology enhances switching speed and reduces power consumption, making this FET suitable for energy-efficient applications.

Maximum Operating Temperature: 165 °C

Operating at up to 165 °C allows this FET to perform reliably in high-temperature environments, expanding its usability.

Transistor Element Material: SILICON

Silicon technology ensures high performance and reliability across a wide range of electronic applications.

Terminal Finish: MATTE TIN

Matte tin finish improves solderability and oxidation resistance, ensuring reliable electrical connections.

Maximum Drain Current (ID): 7 A

The capability of 7 A drain current allows this FET to power demanding applications, delivering robust performance.

Terminal Position: DUAL

Dual terminal positioning facilitates efficient layout and reduces circuit complexity, ensuring a more straightforward design.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates moderate sensitivity, making it manageable for production processes while ensuring reliability.

Case Connection: SOURCE

Connecting the case to the source enhances thermal management and stabilizes performance by dissipating heat effectively.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum reflow time of 30 seconds ensures compatibility with standard soldering processes, enhancing manufacturing efficiency.

Peak Reflow Temperature °C: 250

A peak reflow temperature of 250 °C supports a wide range of soldering techniques, ensuring easy integration into complex circuits.

Technical Specifications

RF Power Field Effect Transistors (FET) PD57060STR-E attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

HIGH RELIABILITY

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

65 V

Maximum Drain Current (Abs) (ID):

7 A

Maximum Drain Current (ID):

7 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-F2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

165 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

PD57060STR-E Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20