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PD57045S-E

STMicroelectronics

PD57045S-E by STMicroelectronics

PD57045S-E by STMicroelectronics is an N-channel RF power FET designed for amplifier applications. It features a max drain current of 5 A, breakdown voltage of 65 V, and operates in the ultra-high frequency band. Ideal for compact designs with high power dissipation up to 73 W.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,108 parts In-Stock

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4,108

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Vyrian

USA . 2,282 parts In-Stock

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2,282

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Anansix

USA . 1,600 parts In-Stock

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1,600

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 782 parts In-Stock

1+ parts

$1.071

100+ parts

-

1k+ parts

$0.964

10k+ parts

-

782

$1.071

-

$0.964

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Advanced Electronics

New Zealand . 125 parts In-Stock

1+ parts

$1.403

100+ parts

$1.277

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$1.150

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125

$1.403

$1.277

$1.150

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MKK Technologies

India . 1,259 parts In-Stock

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$2.014

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1,259

$2.014

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DigiPath Technology Company

USA . 1,259 parts In-Stock

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$2.014

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1,259

$2.014

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AZTECH Wire

Italy . 306 parts In-Stock

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$15.540

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306

$15.540

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Perfect Parts

USA . 23,340 parts In-Stock

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23,340

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Parana Technologies

USA . 2,296 parts In-Stock

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$1.280

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2,296

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$1.280

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Corphita

USA . 1,139 parts In-Stock

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Overview

Unlock unparalleled performance with the PD57045S-E from STMicroelectronics, a leading name in innovation and quality. Designed for RF applications, this N-Channel FET offers remarkable efficiency and reliability, making it ideal for amplifiers in ultra-high frequency setups. With robust power handling and compact design, elevate your projects while enjoying the peace of mind that comes from choosing a trusted manufacturer dedicated to excellence and cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package makes the transistor lightweight and suitable for various environmental conditions.

Polarity or Channel Type: N-CHANNEL

N-channel transistors generally offer higher performance and efficiency for amplification applications, making them a preferred choice in RF applications.

Configuration: SINGLE

A single configuration simplifies circuit design and reduces component count, making integration easier.

Transistor Application: AMPLIFIER

Designed specifically for amplification, this transistor is ideal for applications requiring reliable signal boost within RF circuits.

Surface Mount: YES

Surface mount technology facilitates automated assembly and allows for compact PCB designs, enhancing product miniaturization.

Minimum DS Breakdown Voltage: 65 V

A breakdown voltage of 65 V provides a safety margin for high-voltage applications, ensuring reliable performance under varying conditions.

Package Shape: RECTANGULAR

The rectangular package shape aids in efficient PCB layout and optimizes space utilization on the board.

Terminal Form: FLAT

Flat terminals support better soldering and connectivity, ensuring robust electrical performance in the device.

Operating Mode: ENHANCEMENT MODE

Enhancement-mode FETs require no biasing current, which improves power efficiency and simplifies circuit requirements.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

The ability to operate in the Ultra High Frequency band makes this transistor suitable for high-speed communication applications.

Maximum Drain Current (Abs) (ID): 5 A

A maximum drain current of 5 A provides ample power handling for a variety of demanding applications.

No. of Terminals: 2

Having only 2 terminals reduces the complexity of the circuit, making it more straightforward to interface with other components.

Maximum Power Dissipation (Abs): 73 W

With a high power dissipation capability, this transistor is capable of handling significant power without overheating.

Package Style (Meter): SMALL OUTLINE

A small outline package promotes efficient space use on PCBs, facilitating compactness in RF device designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology allows for lower on-resistance and higher switching speeds, enhancing the overall performance of RF designs.

Maximum Operating Temperature: 165 °C

A high maximum operating temperature indicates reliability and performance in demanding thermal environments.

Transistor Element Material: SILICON

Silicon-based FETs are known for their good thermal stability and reliability, making them suitable for various applications.

Terminal Finish: MATTE TIN

Matte tin plating provides good solderability and corrosion resistance, ensuring durable connections in electronic assemblies.

Maximum Drain Current (ID): 5 A

A repeat listing of a maximum drain current of 5 A reinforces the transistor's robust power handling capabilities.

Terminal Position: DUAL

Dual terminal positioning offers versatile mounting options, enhancing flexibility in circuit designs.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates moderate moisture sensitivity, requiring careful handling during assembly to ensure long-term reliability.

Case Connection: SOURCE

A source case connection allows for straightforward circuit configurations while optimizing heat dissipation from the transistor.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum time of 30 seconds at peak reflow temperature ensures effective soldering without damaging the device.

Peak Reflow Temperature °C: 250

A peak reflow temperature of 250 °C is suitable for modern surface-mount soldering processes, ensuring compatibility with industry standards.

Technical Specifications

RF Power Field Effect Transistors (FET) PD57045S-E attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

65 V

Maximum Drain Current (Abs) (ID):

5 A

Maximum Drain Current (ID):

5 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-F2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

165 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

PD57045S-E Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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