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M58BF008B100D3T

STMicroelectronics

M58BF008B100D3T by STMicroelectronics

STMicroelectronics M58BF008B100D3T is a 256Kx32 NOR Flash Memory with 32 sectors of 8K words each. Operating at temperatures from -40 to 125 °C, it has a memory density of 8388608 bits and supports parallel interface. Ideal for automotive applications due to its CMOS technology and low standby current of 0.000005A.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,610 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,610

-

-

-

-

Digiode

USA . 826 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

826

-

-

-

-

Anansix

USA . 696 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

696

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,854 parts In-Stock

1+ parts

$3.411

100+ parts

-

1k+ parts

$3.070

10k+ parts

-

1,854

$3.411

-

$3.070

-

MKK Technologies

India . 154 parts In-Stock

1+ parts

$6.415

100+ parts

-

1k+ parts

-

10k+ parts

-

154

$6.415

-

-

-

DigiPath Technology Company

USA . 154 parts In-Stock

1+ parts

$6.415

100+ parts

-

1k+ parts

-

10k+ parts

-

154

$6.415

-

-

-

Corphita

USA . 4,808 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,808

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-

-

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Parana Technologies

USA . 2,079 parts In-Stock

1+ parts

-

100+ parts

$4.079

1k+ parts

-

10k+ parts

-

2,079

-

$4.079

-

-

Overview

Experience unparalleled quality and reliability with the M58BF008B100D3T by STMicroelectronics, a leading manufacturer in the industry. This Flash Memory device offers exceptional value and benefits to customers across various applications. With its high performance and innovative technology, this product provides a seamless user experience and unmatched durability. Trust STMicroelectronics to deliver top-notch products that exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the flash memory, ensuring long-term reliability.

Surface Mount: YES

Allows for easy and secure mounting on printed circuit boards, saving space and simplifying assembly.

Power Supplies (V): 3.3,5

Compatible with common voltage supplies, making it versatile for a variety of applications.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, suitable for automotive and industrial environments.

Memory Density: 8388608 bit

Provides ample storage capacity for data, ideal for storing large amounts of information securely.

Maximum Access Time: 100 ns

Offers fast access speeds, allowing for quick retrieval and storage of data.

Technical Specifications

Flash Memory M58BF008B100D3T attributes and parameters. Explore more Flash Memory devices from STMicroelectronics

Specs

Maximum Access Time:

100 ns

Command User Interface:

YES

Data Polling:

NO

JESD-30 Code:

R-PQFP-G80

JESD-609 Code:

e0

Memory Density:

8388608 bit

Memory IC Type:

Memory Width:

32

No. of Sectors/Size:

32

No. of Terminals:

80

No. of Words:

262144 words

No. of Words Code:

256K

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256KX32

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP80,.7X.9,32

Package Shape:

Package Style (Meter):

FLATPACK

Parallel or Serial:

PARALLEL

Power Supplies (V):

3.3,5

Qualification:

Not Qualified

Sector Size (Words):

8K

Maximum Standby Current:

.000005 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

25 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn85Pb15)

Terminal Form:

GULL WING

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Toggle Bit:

NO

Type:

NOR TYPE

Trade Compliance

M58BF008B100D3T Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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