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M58BW32FB4ZA3T

STMicroelectronics

M58BW32FB4ZA3T by STMicroelectronics

STMicroelectronics M58BW32FB4ZA3T is a 512Kx32 NOR flash memory with synchronous operation at 3.3V, ideal for automotive applications. Features include 80 terminals in a low-profile grid array package, AEC-Q100 screening, and fast access time of 45ns.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,981 parts In-Stock

1+ parts

-

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1,981

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Anansix

USA . 1,095 parts In-Stock

1+ parts

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1,095

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Vyrian

USA . 743 parts In-Stock

1+ parts

-

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743

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Nova Conductors

Japan . 500 parts In-Stock

1+ parts

-

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500

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 864 parts In-Stock

1+ parts

$4.333

100+ parts

-

1k+ parts

$3.900

10k+ parts

-

864

$4.333

-

$3.900

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AZTECH Wire

Italy . 743 parts In-Stock

1+ parts

$6.642

100+ parts

-

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743

$6.642

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MKK Technologies

India . 1,689 parts In-Stock

1+ parts

$8.148

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1,689

$8.148

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DigiPath Technology Company

USA . 1,689 parts In-Stock

1+ parts

$8.148

100+ parts

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10k+ parts

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1,689

$8.148

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Ampacity Inc.

Singapore . 1,248 parts In-Stock

1+ parts

$15.000

100+ parts

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1,248

$15.000

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Continental Prestige Electronics

USA . 6,960 parts In-Stock

1+ parts

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6,960

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Corphita

USA . 5,029 parts In-Stock

1+ parts

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5,029

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Parana Technologies

USA . 926 parts In-Stock

1+ parts

-

100+ parts

$5.181

1k+ parts

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926

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$5.181

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Argo Parts USA

USA . 798 parts In-Stock

1+ parts

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798

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Bastille Electronics

Australia . 100 parts In-Stock

1+ parts

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100

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Overview

Experience the cutting-edge technology of the M58BW32FB4ZA3T by STMicroelectronics, a premium flash memory solution designed for automotive applications. With a focus on quality and reliability, STMicroelectronics delivers industry-leading performance in a compact package. Ideal for demanding environments, this flash memory offers seamless operation at extreme temperatures, making it the perfect choice for automotive systems that require high-speed data storage. Trust STMicroelectronics to provide you with top-notch memory solutions that exceed your expectations. Elevate your automotive projects with the M58BW32FB4ZA3T and experience unparalleled performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy material provides durability and reliability, making the product suitable for various applications.

Surface Mount: YES

Surface mount feature allows for easy and convenient installation on circuit boards, saving space and reducing assembly time.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures precise timing and data transfer, enhancing performance and reliability of the product.

Nominal Supply Voltage / Vsup (V): 3.3

Stable supply voltage of 3.3V ensures consistent performance and reliable operation of the flash memory.

No. of Words: 524288 words

Large memory capacity of 524288 words allows for storing a significant amount of data, making it suitable for applications requiring high storage capacity.

Technical Specifications

Flash Memory M58BW32FB4ZA3T attributes and parameters. Explore more Flash Memory devices from STMicroelectronics

Specs

Maximum Access Time:

45 ns

Boot Block:

BOTTOM

Command User Interface:

YES

Common Flash Interface:

YES

Data Polling:

NO

JESD-30 Code:

R-PBGA-B80

Length:

12 mm

Memory Density:

16777216 bit

Memory IC Type:

Memory Width:

32

No. of Functions:

1

No. of Sectors/Size:

4,8,62

No. of Terminals:

80

No. of Words:

524288 words

No. of Words Code:

512K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

512KX32

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA80,8X10,40

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Page Size (words):

4

Parallel or Serial:

PARALLEL

Power Supplies (V):

3/3.3

Programming Voltage (V):

3.3

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.7 mm

Sector Size (Words):

4K,2K,16K

Maximum Standby Current:

.00015 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

50 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Toggle Bit:

NO

Type:

NOR TYPE

Width:

10 mm

Trade Compliance

M58BW32FB4ZA3T Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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