Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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M58BW016BB100T3 from STMicroelectronics is a 16Mb NOR flash memory with a 3V nominal voltage, ideal for automotive applications. It features an asynchronous operating mode and operates within -40 °C to 125°C. With a fast access time of 100 ns, it ensures efficient data retrieval.
Median Price
-
Lifecycle Status
Suppliers In-Stock
3
In-Stock Inventory
1k+
Digiode
1+ parts
100+ parts
1k+ parts
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Vyrian
Anansix
IDEA Electronic Components Group
$2.025
$1.822
MKK Technologies
$3.808
DigiPath Technology Company
Corphita
Parana Technologies
$2.421
The durable plastic/epoxy material provides good protection for the internal components, making it suitable for various applications.
Surface mount technology allows for a more compact and efficient design, making it ideal for space-constrained applications.
The rectangular shape is standard for many electronic devices, ensuring compatibility with existing footprints on circuit boards.
Asynchronous operation enables faster performance and easier integration with different systems.
The 3V nominal supply voltage is ideal for low-power applications, enhancing energy efficiency.
Support for multiple voltage levels increases flexibility in system design, accommodating various power source requirements.
The 80 terminals provide a good amount of connectivity options, allowing for robust interfacing with other components.
The flat-pack style enables easier mounting on circuit boards, leading to improved performance and reliability.
The high maximum operating temperature makes this product suitable for automotive and high-temperature environments.
The organization of 512Kx32 allows for efficient data management and access, enhancing the overall performance of the device.
With a low minimum operating temperature, this product is reliable in a wide range of environmental conditions.
8 sectors with varying sizes provide flexibility in memory management, optimizing storage for different applications.
Tin-lead terminal finish ensures good solderability and longevity, enhancing the product's durability.
Quad terminal positioning allows for efficient space utilization on PCB layouts, facilitating better performance in compact devices.
A low seated height aids in low-profile designs, making it suitable for portable and compact electronics.
The compact width allows for versatile placement options in a variety of electronic applications.
A minimum supply voltage of 2.7 V provides flexibility in system design, accommodating various power sources.
NOR type flash memory is known for its fast read speeds, making it ideal for applications requiring quick data access.
Compatibility with a common flash interface simplifies integration into existing systems, enhancing ease of use.
The short length allows for compact designs, crucial for modern electronic applications where space is limited.
A programming voltage of 3 V facilitates easier integration and reduces power consumption during programming.
Designed for automotive applications, ensuring reliability under extreme conditions that are typical in this industry.
CMOS technology offers better power efficiency and low static power consumption, making it suitable for battery-operated devices.
Parallel interface allows for simultaneous data transfer, increasing the speed of operations compared to serial interfaces.
Gull wing terminals ensure a secure mechanical connection and are friendly for both hand soldering and automated assembly processes.
Variable sector sizes allow for optimized data storage handling, suiting different application requirements.
Low maximum supply current ensures energy efficiency, which is critical in battery-operated devices.
A high word count of 524288 allows for substantial data storage, making it suitable for complex applications.
The 32-bit memory width enables faster data processing and larger data handling capabilities.
A terminal pitch of 0.8 mm balances compact design with manufacturability, suitable for modern PCB layouts.
With a code of 512K words, it provides ample memory for a variety of applications, from consumer electronics to automotive systems.
A user-friendly command interface simplifies operation and reduces development time for system designers.
The maximum supply voltage of 3.6 V provides headroom for stability and reliability in various operational conditions.
Bottom boot block design enables protection and efficient loading of critical firmware on power-up.
High memory density of 16MB allows for extensive data storage, making it suitable for applications that require large memory capacities.
As a flash memory IC, it offers fast read/write speeds and non-volatility, ensuring data retention without power.
Extremely low standby current maximizes battery life in portable and embedded applications.
Fast access time of 100 ns enhances performance in data-intensive applications, improving overall system responsiveness.
Flash Memory M58BW016BB100T3 attributes and parameters. Explore more Flash Memory devices from STMicroelectronics
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M58BW016BB100T3 Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.51
SB
8542.32.00.50
STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.
President, CEO
Jean-Marc Chery
President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience
Lorenzo Grandi
President, Sales & Marketing
Jerome Roux
Castelletto
Fabrication
Fab Initiation
1968
Italy
Wafer Capacity
SGFAB AMK 6
2000
Singapore
29,000
AG200
Agrate Brianza
14,000
RST 8
France
Rousset
35,000
Crolles 1
1993
Crolles
30,000
Crolles 2-ext. mod 5
Crolles 2-ext. mod 2
2022
Crolles 2-ext. mod 3
2023
Crolles 2
2004
28,000
1985
SiC Fab
2006
Sweden
Norrköping
10,000
Fab 3
2005
Tours
2,000
Fab 1 & Fab 2
1978
55,000
Fab 2
1997
Catania
SGFAB-AMK 6E
2003
145,000
SGFAB-AMJ 9
1984
152,000
AG300 (R3)
1980
25,000
1987
34,000
AG300
2024
Crolles 2-ext. mod 1
2020
Fab 1 6-inch fab
2013
11,000
SiC 6-inch line
2021
2,500
200mm GaN
2018
SGFAB-AMK 8
2001
Crolles 2- JV Fab
SGFAB-AMK 6
2016
38,125
SGFAB-AMK 2E
2010
20,000
Silicon Carbide A.B.
SiC wafer/EPI Fab
SiC Device Fab
2025
M24308/2-1F
Tyco Electronics Amp
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; IEC Conformity: NO; Mixed Contacts: NO; Empty Shell: NO;
BSS84-7-F
Diodes Incorporated
Diodes Inc. BSS84-7-F is a P-channel FET with 50V DS breakdown voltage, 0.13A max drain current, and 10 ohm RDS(on). Ideal for switching applications, it features a single configuration with built-in diode in a small outline package. Operating in enhancement mode at up to 150°C, it has Gull Wing terminals and matte tin finish.
1N4148WS
Taitron Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SS14
Sangdest Microelectronics (Nanjing)
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358AN
Signetics
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
Cinch Connectivity Solutions
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Dielectric Withstanding Voltage (V): 1750VAC; No. of Connectors: ONE; Body Depth: .375 inch;
BAV99
Transys Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
SMBJ18CA
Vishay Semiconductors
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: J BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Vishay Telefunken
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LL4148
Micronas Semiconductor Holding Ag
RECTIFIER DIODE; Surface Mount: YES; No. of Phases: 1; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Output Current: .2 A; Maximum Forward Voltage (VF): 1.2 V;
Weitron Technology
RECTIFIER DIODE; Surface Mount: NO; Maximum Reverse Recovery Time: .004 us; Config: SINGLE; Maximum Output Current: .15 A; Terminal Finish: Tin/Lead (Sn/Pb);
New Jersey Semiconductor Products
LM317T
Comset Semiconductors
Other Regulators; No. of Terminals: 3; Terminal Pitch: 2.54 mm; Minimum Output Voltage-1: 1.2 V; Technology: BIPOLAR; Operating Temperature (TJ-Max): 125 Cel;
Pro-an Electronic
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Clamping Voltage: 29.2 V; Polarity: BIDIRECTIONAL; Nominal Breakdown Voltage: 21.05 V; Maximum Repetitive Peak Reverse Voltage: 18 V;
2N7002
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Terminal Finish: TIN LEAD; Maximum Operating Temperature: 150 Cel;
LM317BD2TG
Onsemi
LM317BD2TG by Onsemi is an adjustable positive single output standard regulator with a max output current of 1.5A and a max load regulation of 5.8%. Operating temperature ranges from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact designs.
Changzhou Galaxy Century Microelectronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Minimum DS Breakdown Voltage: 60 V; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; No. of Terminals: 3;
LM2675M-ADJ/NOPB
Texas Instruments
LM2675M-ADJ/NOPB by Texas Instruments is a voltage-mode switching regulator with 1A output current, 37V max output voltage, and 260kHz max switching frequency. Ideal for automotive applications due to its -40°C to 125°C operating temperature range and compact small outline package design.
261
Deltrol Controls
Other Relays;
LM358DR2G
LM358DR2G by Onsemi is a dual operational amplifier with 7000uV max input offset voltage and 70dB nominal CMRR. Ideal for applications requiring low bias current such as sensor interfaces, signal conditioning circuits, and audio amplifiers. Package style: Small Outline, Technology: Bipolar, Unity Gain Bandwidth: 1000 kHz.
MTFC16GAPALBH-AATTR
Micron Technology
MTFC16GAPALBH-AATTR by Micron Technology is a 16GX8 NAND flash memory with 17179869184 words capacity. It operates synchronously at up to 200 MHz clock frequency, suitable for applications requiring high-speed data storage and retrieval. With a thin profile and fine pitch grid array package style, it offers compact design flexibility for various electronic devices.
MTFC32GAZAQHD-IT
Micron Technology's MTFC32GAZAQHD-IT is a 32GX8 NAND flash memory with 34359738368 words capacity. Operating in synchronous mode, it has a very thin profile and fine pitch package style. With a temperature range of -40 to 95 °C, it is suitable for applications requiring high-density memory storage and fast data access.
S25FL256SAGNFI010
Spansion
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Additional Features: IT ALSO CONFIGURED AS 256M X 1;
S29JL032J70TFI020
Infineon Technologies
Infineon's S29JL032J70TFI020 is a 32Mb NOR Flash Memory with 2Mx16 organization, operating at 3V. It features synchronous mode, industrial temperature grade, and parallel interface. Ideal for applications requiring fast access time, such as embedded systems and automotive electronics.
MT29F1G08ABAEAWP-IT:E
Micron Technology's MT29F1G08ABAEAWP-IT:E is a 3.3V SLC NAND Flash Memory with 128Mx8 organization, operating from -40 to 85°C. It features a small outline package, parallel interface, and industrial temperature grade suitable for various embedded applications.
SDSDQAB-008G
Western Digital
SDSDQAB-008G by Western Digital is a flash memory chip with 8GX8 organization and 8G word code. It operates b/w -25 to 85 °C, suitable for various applications requiring high memory density like flash cards. The chip features CMOS technology, rectangular shape, and upper terminal position for surface mounting.
S25FL032P0XMFI011
Cypress Semiconductor
Cypress Semiconductor S25FL032P0XMFI011 is a NOR flash memory with 4Kx16 organization, SPI serial bus type, and 104 MHz clock frequency. It operates at -40 to 85°C, has 100000 write/erase cycles endurance, and is suitable for industrial applications requiring high-speed data storage in compact devices.
THGBMNG5D1LBAIL
Toshiba
Toshiba's THGBMNG5D1LBAIL is a Flash Memory with 4GX8 organization, 34359738368 bit memory density, and operates in asynchronous mode. It features 153 terminals in a grid array package style for applications requiring high-speed data storage and retrieval.
M29W640GH70ZA6E
STMicroelectronics
M29W640GH70ZA6E by STMicroelectronics is a 3V NOR flash memory with 4Mx16 organization, operating at -40 to 85°C. It features a 64K word sector size, parallel interface, and 70 ns access time. Ideal for industrial applications requiring fast data access and reliable non-volatile storage.
S25FL256SAGNFI010 by Infineon is a NOR flash memory with 64Mx4 organization, operating at 133MHz. It has a small outline package style and can withstand industrial temperatures. Ideal for applications requiring high-speed data storage in compact devices.
W25Q16JVSNIQ
Winbond Electronics
W25Q16JVSNIQ by Winbond Electronics is a 16Mb flash memory with synchronous operation, 133 MHz clock frequency, and 3.3V supply voltage. It is ideal for industrial applications requiring high-speed data storage in a small outline package.
SST39VF1601-70-4C-B3KE
Microchip Technology
SST39VF1601-70-4C-B3KE by Microchip Technology is a 16Mbit NOR flash memory with a rectangular package and a package style of grid array. It operates asynchronously at a nominal voltage of 3V and has a max operating temperature of 70°C. This flash memory is commonly used in applications that require high-density storage and fast access times.
IS21ES08GA-JQLI
Integrated Silicon Solution
IS21ES08GA-JQLI by Integrated Silicon Solution is a NAND flash memory with 8GX8 organization, 200 MHz clock frequency, and 3.3V programming voltage. It is suitable for applications requiring high-speed synchronous operation in devices such as smartphones, tablets, and digital cameras.
SDSDQAF3-064G-I
SDSDQAF3-064G-I by Western Digital is a Flash Memory chip with 64GX8 organization and MLC NAND type technology. It operates in ASYNCHRONOUS mode, has a memory density of 549755813888 bit, and can withstand temperatures from -25 to 85 °C. Ideal for applications requiring high-speed data storage in compact devices.
SST26VF032B-104V/MF
SST26VF032B-104V/MF by Microchip: NOR Flash Memory, 3V supply, 104MHz clock freq. Ideal for industrial applications requiring high endurance EEPROM with SPI interface and 4Mx8 organization.
S29GL064N90TFI030
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TSSOP; Package Shape: RECTANGULAR; Operating Mode: ASYNCHRONOUS;
S25FL256SAGMFI001
S25FL256SAGMFI001 by Infineon is a 64MX4 NOR flash memory with 3V nominal voltage. Operating at up to 133MHz, it offers 100000 write/erase cycles and has a memory density of 268MB. Ideal for industrial applications requiring high endurance and fast data transfer over SPI serial bus.
KLMAG1JETD-B041
Samsung
Samsung's KLMAG1JETD-B041 Flash Memory features 16GX8 organization, 1.8V programming voltage, and 137.4Gbit memory density. Ideal for compact devices due to its 0.8mm height, it operates b/w -25°C to 85°C temperatures with a width of 11.5mm and length of 13mm.
IS25LP064A-JBLE
IS25LP064A-JBLE by Integrated Silicon Solution is a 64MX1 NOR Flash Memory with 133 MHz clock frequency. Operating at -40 to 105 °C, it offers 100000 Write/Erase cycles and SPI serial bus type for industrial applications.
S29GL032N90TFI040
S29GL032N90TFI040 by Infineon Technologies is a 32Mb NOR flash memory with 2MX16 organization, operating at 3V. It features an industrial temperature grade, parallel interface, and offers fast access time of 90ns. Ideal for applications requiring high-speed data storage in harsh environments.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
M58BW32FB4ZA3T
FLASH; Temperature Grade: AUTOMOTIVE; No. of Terminals: 80; Package Code: LBGA; Package Shape: RECTANGULAR; Width: 10 mm;
FLASH; Temperature Grade: AUTOMOTIVE; No. of Terminals: 80; Package Code: LBGA; Package Shape: RECTANGULAR; No. of Functions: 1;
Numonyx
FLASH; Temperature Grade: AUTOMOTIVE; No. of Terminals: 80; Package Code: LBGA; Package Shape: RECTANGULAR; Toggle Bit: NO;
M58BW016FB7T3T
FLASH; Temperature Grade: AUTOMOTIVE; No. of Terminals: 80; Package Code: QFP; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel;
FLASH; Temperature Grade: AUTOMOTIVE; No. of Terminals: 80; Package Code: QFP; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 3;
FLASH; Temperature Grade: AUTOMOTIVE; No. of Terminals: 80; Package Code: QFP; Package Shape: RECTANGULAR; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
M58BW32FB4ZA3F
FLASH; Temperature Grade: AUTOMOTIVE; No. of Terminals: 80; Package Code: LBGA; Package Shape: RECTANGULAR; Technology: CMOS;
FLASH; Temperature Grade: AUTOMOTIVE; No. of Terminals: 80; Package Code: LBGA; Package Shape: RECTANGULAR; Package Style (Meter): GRID ARRAY, LOW PROFILE;
FLASH; Temperature Grade: AUTOMOTIVE; No. of Terminals: 80; Package Code: LBGA; Package Shape: RECTANGULAR; Page Size (words): 4;
M58BW016BB100T3F
FLASH; Temperature Grade: AUTOMOTIVE; No. of Terminals: 80; Package Code: QFP; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 3.6 V;
M58BF008B90T3T
FLASH; Temperature Grade: AUTOMOTIVE; No. of Terminals: 80; Package Code: QFP; Package Shape: RECTANGULAR; Terminal Form: GULL WING;
M58BW016BB100T3T
FLASH; Temperature Grade: AUTOMOTIVE; No. of Terminals: 80; Package Code: QFP; Package Shape: RECTANGULAR; No. of Functions: 1;
M58BF008B90T3
M58BW016BB100T3FT
FLASH; Temperature Grade: AUTOMOTIVE; No. of Terminals: 80; Package Code: QFP; Package Shape: RECTANGULAR; No. of Words: 524288 words;
M58BF008B100D3
FLASH; Temperature Grade: AUTOMOTIVE; No. of Terminals: 80; Package Code: QFP; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
M58BW016BB100T6
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 80; Package Code: QFP; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 3;
M58BF008100D3T
FLASH; Temperature Grade: AUTOMOTIVE; No. of Terminals: 80; Package Code: QFP; Package Shape: RECTANGULAR; Operating Mode: SYNCHRONOUS;
M58BF008B100D3T
FLASH; Temperature Grade: AUTOMOTIVE; No. of Terminals: 80; Package Code: QFP; Package Shape: RECTANGULAR; No. of Words: 262144 words;
M58BF008B90ZA3T
FLASH; Temperature Grade: AUTOMOTIVE; No. of Terminals: 80; Package Code: LBGA; Package Shape: RECTANGULAR; Terminal Form: BALL;
M58BW016BB100T6F
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 80; Package Code: QFP; Package Shape: RECTANGULAR; Maximum Seated Height: 3.4 mm;
Supply Digital Components
$106.00
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