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M58BW016BB100T3FT

STMicroelectronics

M58BW016BB100T3FT by STMicroelectronics

M58BW016BB100T3FT from STMicroelectronics is a 16Mb NOR Flash memory with a 3V nominal voltage, ideal for automotive applications. It features asynchronous operation and a max access time of 100 ns. With an operating temp range of -40 °C to 125 °C, it ensures reliability in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,754 parts In-Stock

1+ parts

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100+ parts

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3,754

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Anansix

USA . 2,863 parts In-Stock

1+ parts

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1k+ parts

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2,863

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Digiode

USA . 2,785 parts In-Stock

1+ parts

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100+ parts

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2,785

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,110 parts In-Stock

1+ parts

$3.553

100+ parts

-

1k+ parts

$3.198

10k+ parts

-

2,110

$3.553

-

$3.198

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MKK Technologies

India . 1,606 parts In-Stock

1+ parts

$6.681

100+ parts

-

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10k+ parts

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1,606

$6.681

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DigiPath Technology Company

USA . 1,606 parts In-Stock

1+ parts

$6.681

100+ parts

-

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10k+ parts

-

1,606

$6.681

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Corphita

USA . 3,354 parts In-Stock

1+ parts

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3,354

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Parana Technologies

USA . 1,577 parts In-Stock

1+ parts

-

100+ parts

$4.248

1k+ parts

-

10k+ parts

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1,577

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$4.248

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Overview

Unlock unparalleled performance with the M58BW016BB100T3FT Flash Memory by STMicroelectronics! Renowned for innovation and quality, STMicroelectronics delivers this high-speed, automotive-grade memory solution that excels in demanding applications. With robust durability across extreme temperatures and a user-friendly interface, this memory chip ensures seamless operation and reliability, empowering your projects with efficiency and longevity. Elevate your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable plastic/epoxy construction ensures reliable performance in various environments.

Surface Mount: YES

Surface mount design makes it easy to integrate into compact PCB layouts.

Package Shape: RECTANGULAR

Rectangular package shape optimizes space efficiency on circuit boards.

Operating Mode: ASYNCHRONOUS

Asynchronous operation allows for faster data access without needing additional clock cycles.

Nominal Supply Voltage / Vsup (V): 3

Standard nominal supply voltage of 3V is widely compatible with various applications.

Power Supplies (V): 2.5/3.3, 3/3.3

Flexible power supply options provide versatility for different system requirements.

No. of Terminals: 80

High terminal count supports complex operations and greater functionality.

Package Style (Meter): FLATPACK

Flatpack style allows for easier handling and assembly in manufacturing processes.

Maximum Operating Temperature: 125 °C

High temperature tolerance ensures reliability in automotive and industrial applications.

Organization: 512KX32

512Kx32 organization provides substantial storage capacity for diverse applications.

Minimum Operating Temperature: -40 °C

Wide operating temperature range makes it suitable for extreme environments.

No. of Sectors/Size: 8, 31

Multiple sectors improve data management and organization within the memory.

Terminal Finish: TIN LEAD

Tin-lead terminal finish enhances solderability and reliability during assembly.

Terminal Position: QUAD

Quad terminal position allows for better connectivity in high-density designs.

Maximum Seated Height: 3.4 mm

Low seated height enables use in slim form factor devices.

Width: 14 mm

Compact width makes it suitable for space-constrained applications.

Minimum Supply Voltage (Vsup): 2.7 V

Minimum supply voltage of 2.7V broadens compatibility with various devices.

Type: NOR TYPE

NOR type memory ensures faster read speeds and efficient random access.

Common Flash Interface: YES

Common flash interface facilitates ease of integration with existing systems.

Length: 20 mm

Compact length allows for convenient placement in tight spaces within electronic devices.

Programming Voltage (V): 3

Standard programming voltage enhances compatibility with typical programming tools.

Temperature Grade: AUTOMOTIVE

Automotive-grade components ensure reliability and performance in automotive applications.

Technology: CMOS

CMOS technology offers low power consumption and high performance.

Parallel or Serial: PARALLEL

Parallel interface allows for higher data throughput, making it ideal for performance-sensitive applications.

Terminal Form: GULL WING

Gull wing terminal form provides excellent mechanical strength and soldering characteristics.

Sector Size (Words): 2K, 16K

Variable sector sizes offer flexibility in memory management and data storage.

Maximum Supply Current: 30 mA

Low maximum supply current contributes to energy efficiency in applications.

No. of Words: 524288 words

Large memory capacity allows for substantial data storage and program execution.

Memory Width: 32

32-bit memory width supports modern applications requiring high data bus bandwidth.

Terminal Pitch: 0.8 mm

Narrow terminal pitch facilitates compact PCB design and component density.

No. of Words Code: 512K

512K words code ensures adequate storage for software and data applications.

Command User Interface: YES

User-friendly command interface simplifies the process of controlling and accessing data.

Maximum Supply Voltage (Vsup): 3.6 V

Slightly higher maximum supply voltage provides flexibility in power supply selection.

Boot Block: BOTTOM

Bottom boot block configuration enhances flexibility in firmware storage and execution.

Memory Density: 16777216 bit

High memory density ensures ample space for complex applications and data requirements.

Memory IC Type: FLASH

Flash memory type offers non-volatile storage essential for many electronic applications.

Maximum Standby Current: 0.000005 Amp

Extremely low standby current maximizes energy efficiency when the device is not in use.

Maximum Access Time: 100 ns

Fast access time ensures quick data retrieval, enhancing overall system performance.

Technical Specifications

Flash Memory M58BW016BB100T3FT attributes and parameters. Explore more Flash Memory devices from STMicroelectronics

Specs

Maximum Access Time:

100 ns

Additional Features:

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT BLOCK

Boot Block:

BOTTOM

Command User Interface:

YES

Common Flash Interface:

YES

Data Polling:

NO

JESD-30 Code:

R-PQFP-G80

JESD-609 Code:

e0

Length:

20 mm

Memory Density:

16777216 bit

Memory IC Type:

Memory Width:

32

No. of Functions:

1

No. of Sectors/Size:

8,31

No. of Terminals:

80

No. of Words:

524288 words

No. of Words Code:

512K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

512KX32

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP80,.7X.9,32

Package Shape:

Package Style (Meter):

FLATPACK

Parallel or Serial:

PARALLEL

Power Supplies (V):

2.5/3.3,3/3.3

Programming Voltage (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

3.4 mm

Sector Size (Words):

2K,16K

Maximum Standby Current:

.000005 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

30 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Toggle Bit:

NO

Type:

NOR TYPE

Width:

14 mm

Trade Compliance

M58BW016BB100T3FT Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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