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M48Z32V-35MT1F

STMicroelectronics

M48Z32V-35MT1F by STMicroelectronics

M48Z32V-35MT1F by STMicroelectronics is a 32Kx8 non-volatile SRAM with a 3.3V supply, ideal for applications requiring fast data access and reliability. It features a max access time of 35 ns and operates in temperatures from 0 °C to 70 °C. This compact, surface-mount device ensures efficient performance in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,754 parts In-Stock

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3,754

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Vyrian

USA . 2,640 parts In-Stock

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2,640

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Anansix

USA . 210 parts In-Stock

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210

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 423 parts In-Stock

1+ parts

$5.142

100+ parts

-

1k+ parts

$4.628

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423

$5.142

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$4.628

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Microchip USA

USA . 489 parts In-Stock

1+ parts

$8.214

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489

$8.214

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AZTECH Wire

Italy . 968 parts In-Stock

1+ parts

$9.270

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968

$9.270

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MKK Technologies

India . 1,712 parts In-Stock

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$9.669

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1,712

$9.669

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DigiPath Technology Company

USA . 1,712 parts In-Stock

1+ parts

$9.669

100+ parts

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1,712

$9.669

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Corphita

USA . 3,424 parts In-Stock

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3,424

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Parana Technologies

USA . 1,978 parts In-Stock

1+ parts

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$6.148

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1,978

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$6.148

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Perfect Parts

USA . 420 parts In-Stock

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420

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GreenTree Electronics

Israel . 50 parts In-Stock

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50

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Overview

Unlock superior performance with the M48Z32V-35MT1F SRAM from STMicroelectronics. Renowned for their commitment to quality and innovation, STMicroelectronics delivers this non-volatile memory solution tailored for diverse applications, from telecommunications to automotive systems. With its efficient power consumption and robust design, this chip ensures reliable data retention and rapid access, empowering your projects with speed and efficiency. Elevate your technology with trusted excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body provides excellent durability and protection against environmental factors, making this SRAM reliable in various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient use of PCB space, ideal for modern electronic devices.

Package Shape: RECTANGULAR

The rectangular shape facilitates easy integration into circuit boards, maximizing layout flexibility.

Operating Mode: ASYNCHRONOUS

Asynchronous operation enables fast access times without the need for a clock signal, contributing to quicker system performance.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal supply voltage of 3.3V ensures compatibility with a wide range of digital circuits, making it versatile.

Power Supplies (V): 3.3

This consistent power supply ensures stable performance and reliability in various applications.

No. of Terminals: 44

A greater number of terminals supports various connections, enhancing design flexibility and functionality.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline with a shrink pitch reduces the footprint on PCBs, allowing for more compact designs in electronic devices.

Maximum Operating Temperature: 70 °C

Supporting a maximum temperature of 70 °C ensures reliable operation in moderate environmental conditions.

Organization: 32KX8

The organization allows for efficient data storage and retrieval, making it suitable for various applications requiring quick access to data.

Minimum Operating Temperature: 0 °C

A minimum operating temperature of 0 °C ensures functionality in cold environments, widening the product's application range.

Terminal Finish: TIN/NICKEL PALLADIUM GOLD

The high-quality terminal finish improves electrical connections and ensures longevity in performance.

Terminal Position: DUAL

Dual terminal positions allow for versatile mounting options, enhancing compatibility with different PCB layouts.

Maximum Seated Height: 3.05 mm

The low seated height is advantageous for designs requiring slim profiles, essential in modern electronics.

Width: 8.56 mm

A compact width aids in fitting multiple components in limited space, vital for high-density electronic assemblies.

Minimum Supply Voltage (Vsup): 3 V

Meeting operational needs down to 3V ensures versatility in power management across different systems.

Length: 18.1 mm

The length allows for efficient space usage on the PCB, important for optimizing layout.

Temperature Grade: COMMERCIAL

With a commercial temperature grade, this SRAM is tailored for general applications, providing reliable performance.

Technology: CMOS

CMOS technology offers low power consumption and high speed, making it ideal for battery-operated devices.

Parallel or Serial: PARALLEL

Parallel data access provides faster memory access speeds, promoting overall system performance.

Terminal Form: GULL WING

The gull wing terminal form simplifies the soldering process, ensuring reliable connections.

Maximum Supply Current: 45 mA

A maximum supply current of 45 mA ensures sufficient power for high-performance applications while maintaining efficiency.

No. of Words: 32768 words

The ample number of words allows for efficient data management, suitable for various applications requiring moderate storage.

Memory Width: 8

An 8-bit memory width is typical for many applications, providing balanced performance for general data storage.

Terminal Pitch: 0.81 mm

The 0.81 mm terminal pitch supports modern PCB design standards while maintaining ease of soldering.

No. of Words Code: 32K

With 32K words, it meets the needs of many memory-intensive applications without compromising speed.

Maximum Supply Voltage (Vsup): 3.6 V

Support for a maximum supply voltage of 3.6V provides operational elasticity for diverse electronic designs.

Memory Density: 262144 bit

The high density maximizes storage capability, enabling the handling of larger data sets in compact memory.

Memory IC Type: NON-VOLATILE SRAM

As a non-volatile memory IC, it retains data without power, making it essential for applications needing persistent storage.

Maximum Standby Current: 0.0005 Amp

A very low maximum standby current enables high energy efficiency, benefiting battery-powered applications.

Maximum Access Time: 35 ns

A fast access time of 35 ns increases efficiency in data retrieval, making it a strong choice for high-speed applications.

Technical Specifications

SRAM M48Z32V-35MT1F attributes and parameters. Explore more SRAM devices from STMicroelectronics

Specs

Maximum Access Time:

35 ns

JESD-30 Code:

R-PDSO-G44

JESD-609 Code:

e3/e4

Length:

18.1 mm

Memory Density:

262144 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

44

No. of Words:

32768 words

No. of Words Code:

32K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

32KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP44,.5,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

3.05 mm

Maximum Standby Current:

.0005 Amp

Sub-Category:

SRAMs

Maximum Supply Current:

45 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN/NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.81 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

8.56 mm

Trade Compliance

M48Z32V-35MT1F Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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