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M48Z02-200PC1

STMicroelectronics

M48Z02-200PC1 by STMicroelectronics

M48Z02-200PC1 by STMicroelectronics is a 2Kx8 non-volatile SRAM module with 3-state output, operating at 5V. It features an asynchronous mode, parallel interface, and max access time of 200ns. Ideal for applications requiring reliable data storage in commercial temperature environments.

Median Price

$6.570

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

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$6.570

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500

$6.570

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Vyrian

USA . 3,638 parts In-Stock

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3,638

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Anansix

USA . 2,583 parts In-Stock

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2,583

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Digiode

USA . 1,685 parts In-Stock

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1,685

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MRC Electronics

USA . 61 parts In-Stock

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61

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ComSIT Distribution GmbH

Germany . 45 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 39 parts In-Stock

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Manoshevitz Elec. Sales

Israel . 20 parts In-Stock

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20

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LWI Electronics Inc

India . 16 parts In-Stock

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Bristol Electronics

USA . 13 parts In-Stock

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13

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ECAB

Sweden . 6 parts In-Stock

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6

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LittleDiode

UK . 5 parts In-Stock

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5

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J & M Industries LLC

USA . 1 parts In-Stock

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Corel Iberica Componentes, S.L.

Spain . 1 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,772 parts In-Stock

1+ parts

$4.396

100+ parts

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1k+ parts

$3.956

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1,772

$4.396

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$3.956

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Continental Prestige Electronics

USA . 6,788 parts In-Stock

1+ parts

$6.570

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$6.439

6,788

$6.570

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$6.439

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$6.570

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$6.242

10k+ parts

$6.110

2,000

$6.570

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$6.242

$6.110

Microchip USA

USA . 343 parts In-Stock

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$8.112

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343

$8.112

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MKK Technologies

India . 1,754 parts In-Stock

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$8.266

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$8.266

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DigiPath Technology Company

USA . 1,754 parts In-Stock

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$8.266

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1,754

$8.266

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AZTECH Wire

Italy . 397 parts In-Stock

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$8.786

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397

$8.786

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Ampacity Inc.

Singapore . 1,015 parts In-Stock

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$21.000

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$21.000

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A-Z Elektronik GmbH

Germany . 7,280 parts In-Stock

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Kepictronics

USA . 5,000 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,853 parts In-Stock

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Argo Parts USA

USA . 3,014 parts In-Stock

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Corphita

USA . 2,405 parts In-Stock

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Parana Technologies

USA . 355 parts In-Stock

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$5.256

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$5.256

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Assy Fe

Spain . 2 parts In-Stock

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Overview

Unlock the power of reliable data storage with the M48Z02-200PC1 by STMicroelectronics. This Non-Volatile SRAM Module offers superior quality and performance, perfect for a wide range of applications in the commercial sector. With its 2Kx8 organization and 3-STATE output characteristics, this memory IC provides fast access time and low standby current, ensuring efficiency and reliability. Trust STMicroelectronics to deliver cutting-edge technology that meets your needs and surpasses your expectations. Elevate your projects with the M48Z02-200PC1 and experience the value and benefits it brings to your business.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the SRAM, ensuring it can withstand various environmental conditions.

Operating Mode: ASYNCHRONOUS

Asynchronous operation allows for fast access times and efficient performance, making this SRAM suitable for high-speed applications.

Nominal Supply Voltage / Vsup (V): 5

A stable supply voltage of 5V ensures reliable and consistent operation of the SRAM.

No. of Terminals: 24

Having 24 terminals enables easy connectivity and integration with other components in a system.

Memory Density: 16384 bit

With a high memory density of 16384 bits, this SRAM module can store a large amount of data efficiently.

Output Enable: YES

The output enable feature allows for easy control of data output, enhancing flexibility in data transfer operations.

Maximum Access Time: 200 ns

With a maximum access time of 200 nanoseconds, this SRAM offers speedy data retrieval and processing capabilities.

Technical Specifications

SRAM M48Z02-200PC1 attributes and parameters. Explore more SRAM devices from STMicroelectronics

Specs

Maximum Access Time:

200 ns

Additional Features:

BATTERY BACK-UP; POWER SUPPLY WRITE PROTECTION

JESD-30 Code:

R-PDIP-T24

JESD-609 Code:

e3

Length:

34.545 mm

Memory Density:

16384 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

24

No. of Words:

2048 words

No. of Words Code:

2K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

2KX8

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP24,.6

Package Shape:

Package Style (Meter):

IN-LINE

Parallel or Serial:

PARALLEL

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

9.65 mm

Maximum Standby Current:

.003 Amp

Sub-Category:

SRAMs

Maximum Supply Current:

80 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

15.24 mm

Trade Compliance

M48Z02-200PC1 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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