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M27C512-10C6

STMicroelectronics

M27C512-10C6 by STMicroelectronics

M27C512-10C6 by STMicroelectronics is a 64Kx8 OTP ROM with a max access time of 100 ns, operating at 5V. It features a quad terminal form and operates in an industrial temperature range from -40 °C to 85°C. Ideal for applications requiring reliable data storage in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

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Vyrian

USA . 5,350 parts In-Stock

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Digiode

USA . 4,731 parts In-Stock

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ComSIT Distribution GmbH

Germany . 2,161 parts In-Stock

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Anansix

USA . 1,653 parts In-Stock

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1,653

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Sternenhof Electronics

Switzerland . 600 parts In-Stock

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600

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Electronics Depot

USA . 150 parts In-Stock

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150

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LIBRA Elektronik GmbH

Germany . 134 parts In-Stock

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EPE Components Inc.

USA . 108 parts In-Stock

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108

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Bristol Electronics

USA . 108 parts In-Stock

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108

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J2 Sourcing AB

Sweden . 77 parts In-Stock

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Holdelec - ElecDif-Pro

France . 77 parts In-Stock

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Classic Components Corporation

USA . 32 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 31 parts In-Stock

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Halfin

Belgium . 23 parts In-Stock

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Odi Ramu Company

Canada . 20 parts In-Stock

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Ashlea Components Ltd

UK . 18 parts In-Stock

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ComSIT USA

USA . 18 parts In-Stock

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Distributors (Availability)

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Benley Electronics

USA . 2 parts In-Stock

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$1.750

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2

$1.750

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IDEA Electronic Components Group

UK . 1,018 parts In-Stock

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$4.784

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$4.306

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$4.784

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$4.306

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Microchip USA

USA . 433 parts In-Stock

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$5.224

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433

$5.224

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MKK Technologies

India . 468 parts In-Stock

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$8.996

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468

$8.996

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DigiPath Technology Company

USA . 468 parts In-Stock

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$8.996

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468

$8.996

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AZTECH Wire

Italy . 1,038 parts In-Stock

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$21.130

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1,038

$21.130

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Lixinc

USA . 19,367 parts In-Stock

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Metaverse IC Inc.

Canada . 7,935 parts In-Stock

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Authorized Procurement Solutions

USA . 7,500 parts In-Stock

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Kepictronics

USA . 5,860 parts In-Stock

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Corphita

USA . 3,192 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 2,383 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,346 parts In-Stock

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Assy Fe

Spain . 1,595 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,564 parts In-Stock

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Parana Technologies

USA . 659 parts In-Stock

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$5.720

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$5.720

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Perfect Parts

USA . 224 parts In-Stock

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224

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A-Plus Industry Inc.

USA . 2 parts In-Stock

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Overview

Unlock unparalleled performance and reliability with the M27C512-10C6 from STMicroelectronics, a leader in quality semiconductor solutions. This OTP ROM is designed for diverse applications, ensuring seamless integration and exceptional durability in challenging environments. With its robust construction and efficient power consumption, it delivers unmatched value, making it the ideal choice for industrial projects that demand excellence. Elevate your designs with this trusted component!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material enhances durability and protects the chip from environmental factors, making it suitable for various industrial applications.

Surface Mount: YES

Surface mount capability allows for a compact design and easier integration into modern electronic circuits.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space on PCB layouts, enhancing design flexibility.

Operating Mode: ASYNCHRONOUS

Asynchronous operation simplifies the design and reduces the required timing control, benefiting system performance.

Input/Output Type: COMMON

A common I/O type is versatile, allowing for greater compatibility with various systems and ease of integration.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard nominal supply voltage of 5V makes it compatible with a wide range of electronic devices.

Power Supplies (V): 5

Utilization of a single power supply voltage simplifies the design and improves efficiency.

No. of Terminals: 32

A sufficient number of terminals ensures connectivity and supports multiple functionalities, allowing for versatile applications.

Package Style (Meter): CHIP CARRIER

The chip carrier style supports a reliable installation process, resulting in improved performance and reliability.

Maximum Operating Temperature: 85 °C

Rated for a maximum operating temperature of 85 °C, it suits a variety of industrial and commercial applications.

Organization: 64KX8

A 64Kx8 organization allows for efficient data storage, optimizing memory usage in applications.

Output Characteristics: 3-STATE

3-state output characteristics enhance data bus management, preventing bus contention and improving system efficiency.

Minimum Operating Temperature: -40 °C

The ability to operate at -40 °C ensures reliability and functionality in extreme environmental conditions.

Terminal Finish: TIN

Tin finish provides excellent solderability and corrosion resistance for improved long-term reliability.

Terminal Position: QUAD

Quad terminal positioning offers effective space utilization on PCB, optimizing design layouts.

Maximum Seated Height: 3.56 mm

The low seated height contributes to a compact overall design, allowing for dense circuit packing.

Width: 11.43 mm

A width of 11.43 mm enables efficient PCB layout design while maintaining component accessibility.

Minimum Supply Voltage (Vsup): 4.5 V

Supports operation at a minimum voltage of 4.5V, providing flexibility in varying supply conditions.

Length: 13.97 mm

A length of 13.97 mm offers a balance of size and performance, suitable for various applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures reliability in harsh operational environments, making it ideal for demanding applications.

Technology: CMOS

Utilizing CMOS technology results in low power consumption, ensuring energy-efficient operation.

Parallel or Serial: PARALLEL

Parallel operation facilitates faster data access, improving overall system performance.

Terminal Form: J BEND

J bend terminals provide good mechanical strength and soldering reliability, ensuring robust connections.

Maximum Supply Current: 30 mA

A maximum supply current of 30 mA supports various applications without exceeding power supply ratings.

No. of Words: 65536 words

With 65536 words, it provides ample storage capacity for many application needs.

Memory Width: 8

An 8-bit memory width aligns with standard data bus architectures, enabling easy integration into existing systems.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm ensures compatibility with common PCB layouts and facilitates easier soldering.

No. of Words Code: 64K

Offering 64K words ensures adequate memory size for a wide variety of applications.

Maximum Supply Voltage (Vsup): 5.5 V

Supports operation at a maximum voltage of 5.5V, accommodating system design flexibility.

Memory Density: 524288 bit

The memory density of 524288 bits provides substantial storage capability, suitable for complex applications.

Memory IC Type: OTP ROM

As an OTP ROM, it provides a simple and cost-effective solution for applications requiring one-time programmable memory.

Maximum Standby Current: 0.0001 Amp

A very low maximum standby current of 0.0001 Amp enables energy-efficient designs, prolonging battery life in portable devices.

Maximum Access Time: 100 ns

A maximum access time of 100 ns allows for quick data retrieval, improving system responsiveness.

Technical Specifications

OTP ROM M27C512-10C6 attributes and parameters. Explore more OTP ROM devices from STMicroelectronics

Specs

Maximum Access Time:

100 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-PQCC-J32

JESD-609 Code:

e3

Length:

13.97 mm

Memory Density:

524288 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

32

No. of Words:

65536 words

No. of Words Code:

64K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

64KX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC32,.5X.6

Package Shape:

Package Style (Meter):

CHIP CARRIER

Parallel or Serial:

PARALLEL

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

3.56 mm

Maximum Standby Current:

.0001 Amp

Sub-Category:

OTP ROMs

Maximum Supply Current:

30 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.43 mm

Trade Compliance

M27C512-10C6 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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