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SGS10N60RUFD

Onsemi

SGS10N60RUFD by Onsemi

SGS10N60RUFD by Onsemi is an N-CHANNEL IGBT with VCEsat of 2.8V and IC of 16A. Ideal for POWER CONTROL applications, it has a max VCE of 600V and operating temperature range from -55 to 150 °C. With a built-in diode, it offers fast switching times (toff:284ns, tf:350ns) in a FLANGE MOUNT package.

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1k+

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Vyrian

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Digiode

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Andel Nordic

Denmark . 5,287 parts In-Stock

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$4.909

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TANS Electronics

Latvia . 3,068 parts In-Stock

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Problanco Electronics

Mexico . 2,508 parts In-Stock

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SupplyDigital Components

Austria . 2,170 parts In-Stock

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Corphita

USA . 1,681 parts In-Stock

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Kulean Microsystems

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Corohmni

South Africa . 380 parts In-Stock

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UHIMA Technologies

Türkiye . 337 parts In-Stock

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Supply Digital

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Overview

Unleash the power of innovation with the SGS10N60RUFD by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Insulated Gate Bipolar Transistors (IGBT) like no other. Ideal for power control applications, this N-channel transistor offers a single configuration with a built-in diode for added convenience. With a maximum operating temperature of 150 °C and a collector-emitter voltage of 600V, this transistor is designed to handle high-power demands with ease. Trust Onsemi to provide reliable solutions that meet your needs and exceed your expectations. Experience the difference with the SGS10N60RUFD today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the transistor, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

Enhances efficiency and performance in power control applications.

Maximum VCEsat: 2.8 V

Low VCEsat minimizes power dissipation and improves overall efficiency.

Maximum Power Dissipation (Abs): 55 W

Capable of handling high power levels, suitable for demanding applications.

Maximum Collector-Emitter Voltage: 600 V

Allows for high voltage operation, expanding the range of potential applications.

Maximum Gate-Emitter Voltage: 20 V

Provides reliable gate control, ensuring stable operation.

Maximum Collector Current (IC): 16 A

Capable of handling high current loads, suitable for power control applications.

Minimum Operating Temperature: -55 °C

Can operate in extreme temperature conditions, increasing versatility.

Nominal Turn On Time (ton): 49 ns

Fast turn on time enhances response time and efficiency in power control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) SGS10N60RUFD attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Additional Features:

LOW CONDUCTION LOSS

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Fall Time (tf):

350 ns

Maximum Gate-Emitter Threshold Voltage:

8.5 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

410 ns

Nominal Turn Off Time (toff):

284 ns

Nominal Turn On Time (ton):

49 ns

Maximum VCEsat:

2.8 V

Trade Compliance

SGS10N60RUFD Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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