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NVMFS5833NWFT3G

Onsemi

NVMFS5833NWFT3G by Onsemi

NVMFS5833NWFT3G by Onsemi is an N-CHANNEL FET with 86A max drain current and 112W max power dissipation. Ideal for high-power applications, it operates at up to 175 °C and features a metal-oxide semiconductor technology. Suitable for surface mount configurations, this transistor is designed for robust performance in demanding environments.

Median Price

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Lifecycle Status

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2

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1k+

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Vyrian

USA . 7,350 parts In-Stock

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Digiode

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AZTECH Wire

Italy . 999 parts In-Stock

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$11.870

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QUARKTWIN TECHNOLOGY LTD

USA . 12,503 parts In-Stock

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TANS Electronics

Latvia . 7,277 parts In-Stock

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Authorized Procurement Solutions

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Problanco Electronics

Mexico . 4,555 parts In-Stock

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Perfect Parts

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SupplyDigital Components

Austria . 1,916 parts In-Stock

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UHIMA Technologies

Türkiye . 815 parts In-Stock

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Corphita

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Kulean Microsystems

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Corohmni

South Africa . 52 parts In-Stock

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Overview

Power up your electronics with the NVMFS5833NWFT3G by Onsemi! This high-quality N-channel power field-effect transistor offers reliable performance and efficient power management for a wide range of applications. Whether you're working on automotive, industrial, or consumer electronics projects, this single-configured FET is sure to deliver the power and efficiency you need. Trust in Onsemi's expertise and innovation to bring you the best in semiconductor technology. Experience the value and benefits of the NVMFS5833NWFT3G for yourself!

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs are commonly used in power applications due to their lower ON resistance and higher current carrying capability.

Configuration: SINGLE

SINGLE configuration simplifies circuit design and makes the FET easier to control in applications.

Surface Mount: YES

Surface mount capability enables easy and compact integration of the FET into electronic circuits.

Maximum Drain Current (Abs) (ID): 86 A

High maximum drain current rating allows the FET to handle large currents, making it suitable for high-power applications.

Maximum Power Dissipation (Abs): 112 W

High power dissipation capability ensures the FET can handle large power loads without overheating.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-Oxide Semiconductor FETs offer high switching speeds and low ON resistance, making them efficient for power applications.

Maximum Operating Temperature: 175 °C

High maximum operating temperature allows the FET to function reliably in high-temperature environments.

Terminal Finish: TIN

TIN terminal finish provides good solderability and ensures reliable electrical connections.

Maximum Time At Peak Reflow Temperature (s): 30

Short peak reflow time reduces the risk of thermal damage to the FET during the soldering process.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper solder melting and bonding for a durable connection.

Technical Specifications

Power Field Effect Transistors (FET) NVMFS5833NWFT3G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

86 A

Maximum Drain Current (ID):

86 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Maximum Operating Temperature:

175 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NVMFS5833NWFT3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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