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NVMFD5875NLT3G

Onsemi

NVMFD5875NLT3G by Onsemi

NVMFD5875NLT3G by Onsemi is a Power FET with 60V DS Breakdown Voltage, 80A IDM, and 0.045 ohm RDS(ON). Ideal for automotive applications due to AEC-Q101 standard compliance. Enhances performance in power management systems with its high current handling capabilities.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 8,898 parts In-Stock

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Digiode

USA . 1,287 parts In-Stock

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AZTECH Wire

Italy . 137 parts In-Stock

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$8.970

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Component Stockers USA

USA . 436 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 29,238 parts In-Stock

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Kulean Microsystems

USA . 5,611 parts In-Stock

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TANS Electronics

Latvia . 4,775 parts In-Stock

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SupplyDigital Components

Austria . 3,635 parts In-Stock

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Problanco Electronics

Mexico . 2,554 parts In-Stock

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Corphita

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UHIMA Technologies

Türkiye . 220 parts In-Stock

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Corohmni

South Africa . 217 parts In-Stock

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Overview

Experience the power of innovation with the NVMFD5875NLT3G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Field Effect Transistors that are perfect for a wide range of applications. With its N-Channel configuration and separate elements with built-in diode, this transistor offers enhanced performance and reliability. Whether you're in automotive, industrial, or consumer electronics, the NVMFD5875NLT3G provides unmatched value and benefits, making it the ideal choice for your next project. Elevate your designs with Onsemi's cutting-edge technology and unleash the full potential of your applications.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components of the FET.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON resistance and higher switching speeds, making them efficient for many power applications.

Minimum DS Breakdown Voltage: 60 V

With a minimum breakdown voltage of 60V, this FET can handle high voltage applications with ease.

Maximum Drain Current (ID): 22 A

The high maximum drain current rating of 22A allows this FET to handle large amounts of current, making it suitable for high-power applications.

Maximum Power Dissipation (Abs): 32 W

The high maximum power dissipation rating of 32W ensures that this FET can handle high power levels without overheating.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature of 175 °C allows this FET to operate in extreme temperature conditions.

Maximum Drain-Source On Resistance: 0.045 ohm

The low ON resistance of 0.045 ohms allows for efficient power transfer and minimal power loss in the FET.

Technical Specifications

Power Field Effect Transistors (FET) NVMFD5875NLT3G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

40 mJ

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

22 A

Maximum Drain Current (ID):

7 A

Maximum Drain-Source On Resistance:

.045 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

80 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

15.7 ns

Maximum Turn On Time (ton):

11.3 ns

Trade Compliance

NVMFD5875NLT3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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