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NTTFS5826NLTAG

Onsemi

NTTFS5826NLTAG by Onsemi

NTTFS5826NLTAG by Onsemi is a Power FET with 60V DS Breakdown Voltage, 133A IDM, and 0.032 ohm RDS(on). Ideal for SWITCHING applications in ENHANCEMENT MODE operation. Features include N-CHANNEL polarity, built-in DIODE, and METAL-OXIDE SEMICONDUCTOR technology.

Median Price

$0.480

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

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Nova Conductors

Japan . 97 parts In-Stock

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$0.480

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Cyclops Electronics Ltd

UK . 143,660 parts In-Stock

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Chip Stock

USA . 13,641 parts In-Stock

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Vyrian

USA . 11,920 parts In-Stock

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Sensible Micro Corp

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Infinite Electronics LLP

India . 6,000 parts In-Stock

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Flip Electronics

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Digiode

USA . 521 parts In-Stock

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Ampacity Inc.

Singapore . 11,633 parts In-Stock

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$0.259

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Corohmni

South Africa . 287 parts In-Stock

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$0.305

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Aranea Global

USA . 1,000 parts In-Stock

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$0.470

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$0.452

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$0.470

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Advanced Electronics

New Zealand . 87 parts In-Stock

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$1.027

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$0.976

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$0.976

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87

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Aztec Data Supply Inc.

USA . 1,179 parts In-Stock

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$1.580

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AZTECH Wire

Italy . 779 parts In-Stock

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$6.976

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Semicontronic

India . 682 parts In-Stock

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$58.050

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$56.599

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Perfect Parts

USA . 166,491 parts In-Stock

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RC Electronics

USA . 89,428 parts In-Stock

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Lixinc

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SupplyDigital Components

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Argo Parts USA

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Problanco Electronics

Mexico . 4,263 parts In-Stock

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TANS Electronics

Latvia . 3,412 parts In-Stock

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Kulean Microsystems

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Kepictronics

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Continental Prestige Electronics

USA . 2,882 parts In-Stock

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Corphita

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Futuretech Components

Singapore . 1,500 parts In-Stock

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iodParts Technologies Inc.

India . 900 parts In-Stock

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UHIMA Technologies

Türkiye . 754 parts In-Stock

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Overview

Unlock the power of efficient switching with the NTTFS5826NLTAG by Onsemi. Crafted with precision by a leading manufacturer, this Power Field Effect Transistor offers unparalleled performance for a wide range of applications. Its N-CHANNEL design and SINGLE configuration with built-in diode ensure reliable operation. Whether you're looking to optimize your system’s efficiency or enhance its capabilities, this transistor is the perfect solution. Experience seamless functionality and superior quality with the NTTFS5826NLTAG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material of the package body provides durability and protection for the internal components of the transistor, ensuring reliable performance in various operating conditions.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer lower on-resistance and higher performance compared to P-channel FETs, making them a good choice for switching applications where efficiency is important.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode in the transistor allows for efficient energy dissipation and protection against reverse currents, making it suitable for applications where diode functionality is required.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast switching speeds and low on-resistance, making it ideal for applications that require high efficiency and reliability.

Package Shape: SQUARE

The square package shape allows for easier mounting and assembly in circuit designs, contributing to overall space-saving and efficient layout solutions.

Transistor Element Material: SILICON

Silicon is a commonly used semiconductor material known for its high reliability and performance characteristics, ensuring that this FET operates consistently and efficiently in various conditions.

Technical Specifications

Power Field Effect Transistors (FET) NTTFS5826NLTAG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

20 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (ID):

8 A

Maximum Drain-Source On Resistance:

.032 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

S-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

133 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTTFS5826NLTAG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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