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NTTFS008P03P8Z

Onsemi

NTTFS008P03P8Z by Onsemi

NTTFS008P03P8Z by Onsemi is a P-CHANNEL FET with 30V DS Breakdown Voltage and 22A ID. Ideal for SWITCHING applications, it features a max IDM of 418A and 0.0038 ohm Drain-Source Resistance. Operating in the -55 to 150 °C range, this MOSFET has a compact SQUARE package with NO LEAD terminals.

Median Price

$2.174

Lifecycle Status

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1k+

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Chip1Stop

Japan . 2,010 parts In-Stock

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$2.500

100+ parts

$1.270

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-

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2,010

$2.500

$1.270

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DigiKey

USA . 1,831 parts In-Stock

1+ parts

$2.510

100+ parts

$1.104

1k+ parts

$0.878

10k+ parts

$0.717

1,831

$2.510

$1.104

$0.878

$0.717

Newark

USA . 2,973 parts In-Stock

1+ parts

$2.590

100+ parts

$1.140

1k+ parts

$0.890

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2,973

$2.590

$1.140

$0.890

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Mouser Electronics

USA . 9,526 parts In-Stock

1+ parts

$2.680

100+ parts

$1.190

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$0.949

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9,526

$2.680

$1.190

$0.949

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Future Electronics

Canada . 18,000 parts In-Stock

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$1.280

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$1.280

Rochester

USA . 14,026 parts In-Stock

1+ parts

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$0.974

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$0.808

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$0.721

14,026

-

$0.974

$0.808

$0.721

Verical

USA . 6,000 parts In-Stock

1+ parts

-

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$0.728

6,000

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$0.728

Flip Electronics (Authorized)

USA . 6,000 parts In-Stock

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Element14

Singapore . 4,682 parts In-Stock

1+ parts

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$2.730

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$2.200

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$2.010

4,682

-

$2.730

$2.200

$2.010

Farnell

UK . 2,832 parts In-Stock

1+ parts

-

100+ parts

$1.530

1k+ parts

$1.230

10k+ parts

$1.170

2,832

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$1.530

$1.230

$1.170

RS (Exports)

UK . 2,050 parts In-Stock

1+ parts

-

100+ parts

$1.847

1k+ parts

$1.453

10k+ parts

$1.417

2,050

-

$1.847

$1.453

$1.417

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Digiode

USA . 1,612 parts In-Stock

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$1.472

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1,612

$1.472

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Nova Conductors

Japan . 300 parts In-Stock

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$1.660

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300

$1.660

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Chip Stock

USA . 36,102 parts In-Stock

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36,102

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IBS Electronics

USA . 18,000 parts In-Stock

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$2.300

18,000

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$2.300

Component Sense

UK . 15,000 parts In-Stock

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Flip Electronics

USA . 6,000 parts In-Stock

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Vyrian

USA . 4,662 parts In-Stock

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4,662

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Cyclops Electronics Ltd

UK . 190 parts In-Stock

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190

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Semicontronic

India . 4,403 parts In-Stock

1+ parts

$1.300

100+ parts

$1.268

1k+ parts

$1.261

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4,403

$1.300

$1.268

$1.261

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Ampacity Inc.

Singapore . 4,336 parts In-Stock

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$1.300

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4,336

$1.300

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Corphita

USA . 243 parts In-Stock

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$1.395

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$1.395

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Corohmni

South Africa . 155 parts In-Stock

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$1.530

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$1.530

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Argo Parts USA

USA . 1,424 parts In-Stock

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$1.660

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Continental Prestige Electronics

USA . 859 parts In-Stock

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$1.660

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$1.627

859

$1.660

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$1.627

Microchip USA

USA . 7,559 parts In-Stock

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$10.239

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QUARKTWIN TECHNOLOGY LTD

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Lixinc

USA . 19,335 parts In-Stock

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TANS Electronics

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Futuretech Components

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SupplyDigital Components

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Perfect Parts

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Problanco Electronics

Mexico . 1,891 parts In-Stock

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Kulean Microsystems

USA . 1,632 parts In-Stock

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1,632

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UHIMA Technologies

Türkiye . 571 parts In-Stock

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571

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GreenTree Electronics

Israel . 60 parts In-Stock

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Netroflash

USA . 50 parts In-Stock

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$1.627

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$1.577

10k+ parts

$1.544

50

-

$1.627

$1.577

$1.544

Overview

Discover the NTTFS008P03P8Z by Onsemi, a top-of-the-line Power Field Effect Transistor that guarantees high-quality performance and reliability. With a single configuration and built-in diode, this P-Channel transistor is perfect for switching applications. Its small outline package and surface mount design make it easy to integrate into various systems. Offering a maximum drain current of 22A and a low on-resistance of 0.0038 ohm, this transistor ensures efficient power management. Trust Onsemi's expertise in semiconductor technology and elevate your projects with the NTTFS008P03P8Z.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body ensures durability and resistance to temperature fluctuations, making this product suitable for a wide range of operating conditions.

Polarity or Channel Type: P-CHANNEL

The P-channel type allows for easy integration into circuits and offers efficient switching capabilities.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and enhances the performance of the transistor in switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor delivers reliable performance and efficient operation.

Surface Mount: YES

The surface mount capability makes installation and assembly easier, saving time and effort in production processes.

Minimum DS Breakdown Voltage: 30 V

The minimum breakdown voltage of 30V ensures safety and protection against voltage spikes, increasing the overall reliability of the transistor.

Package Shape: SQUARE

The square package shape allows for efficient PCB layout and space-saving, ideal for compact electronic designs.

Terminal Form: NO LEAD

The no-lead terminal form simplifies soldering and connection processes, reducing the risk of damage during assembly.

Operating Mode: ENHANCEMENT MODE

The enhancement mode operation provides enhanced control and efficiency in switching applications, resulting in improved performance.

Maximum Pulsed Drain Current (IDM): 418 A

The high maximum pulsed drain current capability of 418A allows for handling of large current spikes, making this transistor suitable for high-power applications.

No. of Terminals: 8

With 8 terminals, this transistor offers multiple connection options, increasing flexibility in circuit design and integration.

Maximum Power Dissipation (Abs): 50 W

The maximum power dissipation of 50W ensures reliable performance under high-power operation, making this transistor a robust choice for demanding applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it ideal for compact electronic devices and applications with limited board space.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

The metal-oxide semiconductor technology offers high reliability and performance, making this transistor a dependable choice for critical applications.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150°C, this transistor can withstand high-temperature environments, ensuring reliable operation in various conditions.

Transistor Element Material: SILICON

Silicon material in the transistor element provides excellent performance characteristics, such as high conductivity and reliability, ensuring long-term stability.

Minimum Operating Temperature: -55 °C

The minimum operating temperature of -55°C allows for operation in cold environments, making this transistor suitable for a wide range of temperature conditions.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides good solderability and corrosion resistance, ensuring reliable connections and long-term performance.

Maximum Drain Current (ID): 22 A

With a maximum drain current of 22A, this transistor can handle high current loads, making it suitable for power applications that require efficient current flow.

Maximum Drain-Source On Resistance: 0.0038 ohm

The low drain-source on resistance of 0.0038 ohm minimizes power loss and improves efficiency in high-current applications, making this transistor a cost-effective choice.

Terminal Position: DUAL

The dual terminal position allows for versatile and flexible connection options, enabling easy integration into different circuit configurations.

Case Connection: DRAIN

The drain case connection simplifies installation and connection, ensuring efficient heat dissipation and reliable performance under high-power operation.

Maximum Time At Peak Reflow Temperature (s): 10

The maximum time at peak reflow temperature of 10 seconds ensures safe and reliable soldering processes, minimizing the risk of damage to the transistor.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this transistor can withstand high-temperature soldering processes, ensuring secure connections and robust performance.

Maximum Feedback Capacitance (Crss): 1890 pF

The maximum feedback capacitance of 1890 pF minimizes signal distortion and crosstalk, enhancing the overall signal integrity and performance of the transistor in high-frequency applications.

Technical Specifications

Power Field Effect Transistors (FET) NTTFS008P03P8Z attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

22 A

Maximum Drain-Source On Resistance:

.0038 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

1890 pF

JESD-30 Code:

S-PDSO-N8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

418 A

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

10

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTTFS008P03P8Z Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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