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NTTFS5C454NLTWG

Onsemi

NTTFS5C454NLTWG by Onsemi

NTTFS5C454NLTWG by Onsemi is a Power FET with 40V DS Breakdown Voltage, 520A IDM, and 0.006 ohm RDS(on). Ideal for power management applications due to its high current handling capabilities. Suitable for use in enhancement mode operations at temperatures ranging from -55 to 175°C.

Median Price

$1.110

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 4,975 parts In-Stock

1+ parts

$1.740

100+ parts

$1.035

1k+ parts

$0.908

10k+ parts

$0.876

4,975

$1.740

$1.035

$0.908

$0.876

Verical

USA . 2,390 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.110

10k+ parts

$0.990

2,390

-

-

$1.110

$0.990

Rochester

USA . 2,390 parts In-Stock

1+ parts

-

100+ parts

$1.070

1k+ parts

$0.888

10k+ parts

$0.792

2,390

-

$1.070

$0.888

$0.792

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 36 parts In-Stock

1+ parts

$1.025

100+ parts

-

1k+ parts

-

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36

$1.025

-

-

-

Digiode

USA . 2,317 parts In-Stock

1+ parts

$1.776

100+ parts

-

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2,317

$1.776

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Chip Stock

USA . 75,000 parts In-Stock

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75,000

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Vyrian

USA . 4,694 parts In-Stock

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4,694

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Distributors (Availability)

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Corohmni

South Africa . 452 parts In-Stock

1+ parts

$1.004

100+ parts

-

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-

10k+ parts

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452

$1.004

-

-

-

Modulus Dynamics

Lithuania . 5,387 parts In-Stock

1+ parts

$1.010

100+ parts

$1.010

1k+ parts

$1.010

10k+ parts

-

5,387

$1.010

$1.010

$1.010

-

Continental Prestige Electronics

USA . 3,917 parts In-Stock

1+ parts

$1.025

100+ parts

-

1k+ parts

-

10k+ parts

$1.004

3,917

$1.025

-

-

$1.004

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$1.025

100+ parts

$1.004

1k+ parts

-

10k+ parts

-

2,000

$1.025

$1.004

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Argo Parts USA

USA . 1,594 parts In-Stock

1+ parts

$1.025

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1,594

$1.025

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Corphita

USA . 1,466 parts In-Stock

1+ parts

$1.683

100+ parts

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1,466

$1.683

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Aztec Data Supply Inc.

USA . 4,857 parts In-Stock

1+ parts

$1.810

100+ parts

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4,857

$1.810

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Semicontronic

India . 4,835 parts In-Stock

1+ parts

$2.370

100+ parts

$2.311

1k+ parts

$2.299

10k+ parts

-

4,835

$2.370

$2.311

$2.299

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Ampacity Inc.

Singapore . 4,894 parts In-Stock

1+ parts

$3.460

100+ parts

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4,894

$3.460

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Microchip USA

USA . 6,178 parts In-Stock

1+ parts

$5.634

100+ parts

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6,178

$5.634

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Problanco Electronics

Mexico . 6,924 parts In-Stock

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6,924

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TANS Electronics

Latvia . 5,891 parts In-Stock

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5,891

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Kulean Microsystems

USA . 3,177 parts In-Stock

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3,177

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SupplyDigital Components

Austria . 2,699 parts In-Stock

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2,699

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UHIMA Technologies

Türkiye . 254 parts In-Stock

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254

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Overview

Unlock the power of innovation with the NTTFS5C454NLTWG by Onsemi. As a leading manufacturer in the field of Power Field Effect Transistors (FET), Onsemi delivers unmatched quality and reliability in every product. This N-CHANNEL transistor offers a built-in diode and operates in enhancement mode, providing customers with seamless performance and efficiency. Whether used in automotive, industrial, or consumer electronics applications, this transistor excels in delivering high power dissipation and low drain-source resistance. Elevate your projects with the NTTFS5C454NLTWG and experience the difference that Onsemi's technology brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy package body material provides good insulation and mechanical strength, making the product durable and reliable in various conditions.

Polarity or Channel Type: N-CHANNEL

N-channel transistors generally have better performance characteristics compared to P-channel transistors, making this product suitable for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode simplifies circuit design and saves space, making it easier to integrate this transistor into a system.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and cost in production processes.

Minimum DS Breakdown Voltage: 40 V

With a minimum breakdown voltage of 40V, this FET can handle higher voltages without failure, ensuring reliable operation in high voltage circuits.

Avalanche Energy Rating (EAS): 202 mJ

High avalanche energy rating ensures the transistor can withstand energy spikes and transient events without damage, improving overall system reliability.

Maximum Power Dissipation (Abs): 55 W

With a maximum power dissipation of 55W, this FET can handle high power levels efficiently, making it suitable for power applications.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature allows for reliable operation in harsh environments or under heavy load conditions.

Technical Specifications

Power Field Effect Transistors (FET) NTTFS5C454NLTWG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

202 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

85 A

Maximum Drain Current (ID):

85 A

Maximum Drain-Source On Resistance:

.006 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

S-PDSO-F8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

520 A

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NTTFS5C454NLTWG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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